Published On: June, 29, 2017 By: Eshtaartha Basu | Updated: July 18, 2018 by Cathleen Wicks
The OSD335x family of System-In-Package (SiP) devices serve as a solid foundation to build advanced embedded systems quickly with reduced time to market. These SiPs tightly integrate Texas Instrument (TI)’s AM335x ARM® Cortex® A8 CPU, TPS65217C Power Management IC (PMIC), TL5209 LDO, up to 1GB of DDR3 and all associated passives. All this is contained in a US quarter sized package as shown in Figure 1.
At Octavo Systems, we are committed to simplifying your design as much as possible so that you can quickly start designing and building your dream products. With this intent in mind, we have developed the OSD335x Reference Design Tutorial Series which will walk you through the OSD335x design process in a systematic manner.
The tutorial series is broken down into several lessons. Each lesson will address specific concepts and build upon the concepts of previous lessons. Each lesson will conclude with a Printed Circuit Board (PCB), which will implement and verify all of the concepts taught. The lessons will begin with the basics and then take you through advanced concepts.
Each lesson will covert:
Lesson 1: You will learn how to build the bare minimum circuitry required to boot the OSD335x without an operating system and all the concepts related to it as follows:
Lesson 2: You will learn how to build the minimum circuitry required to Boot Linux on the OSD335x and all the concepts related to it.
The complete OSD335x Design Tutorial series can be downloaded here.
There are many parts within the OSD335x family. We will be focusing on the OSD3358-512M-BAS in this series. Therefore, all references to the OSD335x hereafter imply OSD3358-512M-BAS.
The OSD335x comes in a 27mm x 27mm Ball Grid Array (BGA) package with 400 balls and 1.27mm ball pitch as shown in Figure 2.
It consists of four main components as shown in Figure 3. They are:
All of the peripheral interfaces of the AM335x (except the DDR interface) are brought out to pins on the OSD335x. See the OSD335x datasheet for more information on the pinout.
Each lesson will consist of an Introduction section which describes the objective of the lesson followed by a series of articles, each of which will walk you through the design methodology. The lesson will conclude with an Expected outcome section which describes how the outcome of that lesson will look.
Furthermore, each lesson may have several Perks and Caveats. The Perks will give additional information about the topic in discussion and the Caveats will warn you about conditions or situations which require more attention. The Perks and Caveats look like this:
Before starting lesson 1, we strongly encourage you to go through the OSD335x datasheet which can be found here.
We will be using Autodesk Eagle for schematics and layout. Hence, we assume that you are familiar with Eagle schematics and layout. If not, please learn about them first. The following website is one of the many websites that can help you:
To learn more about schematics: https://learn.sparkfun.com/tutorials/using-eagle-schematic
To learn more about layouts: https://learn.sparkfun.com/tutorials/using-eagle-board-layout
Continue to”Introduction to Bare Minimum Circuitry to Boot OSD335x” >> |
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