Securing the Future: The Integral Role of SiP Technology in Thwarting Physical Attack Vectors in Embedded Systems

 

The security of embedded systems stands as a crucial yet often overlooked aspect. As technology propels forward, these systems become increasingly central to our everyday lives, powering everything from smartphones to critical infrastructure.

However, with this technological integration comes a heightened vulnerability to physical attack vectors. The need to protect these systems from such threats has never been more pressing. As designers and engineers, understanding and mitigating these risks is not just a challenge but a requirement.

This article aims to shine a light on the various physical attack vectors threatening embedded systems and explore how advancements in System-in-Package (SiP) technology are revolutionizing our approach to securing these vital components of the modern technological landscape.

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Developing Secure Embedded Systems: Best Practices and Strategies

 

In the rapidly evolving landscape of technology, embedded systems have become the backbone of modern electronic devices, ranging from simple household appliances to complex industrial machines. As these devices become more interconnected, the importance of security in embedded systems cannot be overstated. For professionals involved in electronic product design, ensuring the security of these systems is paramount.

 

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Heterogeneous Integration (HI) and System-in-Package (SiP) Technology: A Comprehensive Overview

 

The quest for more efficient, compact, and high-performing devices has led to significant technological innovations. Among these, heterogeneous integration (HI) and System-in-Package (SiP) technology stand out as pivotal advancements. These methodologies redefine electronic systems design and open up possibilities for design engineers. Let’s clarify the concepts of HI and SiP, demonstrating their significance and advantages in the context of contemporary electronic design and development.

 

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Understanding The Differences Between System-on-Chip (SoC), Package-on-Package (PoP), System-on-Module (SoM), and System-in-Package (SiP)

 

For electronic systems design, efficiency, innovation, and integration are key. Electronic design engineers constantly seek solutions that offer robust performance, are cost-effective, and streamline the design process. This is where understanding different semiconductor packaging technologies – System-in-Package (SiP), Package-on-Package (PoP), System-on-Chip (SoC), and System-on-Module (SoM) – becomes crucial. 

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Octavo Systems: SiP the Future of Edge AI – 2023 Highlights & 2024 Preview

AI at the Edge Relies on the Right Hardware

Artificial intelligence (AI) once seemed like a figment of science fiction, but as technology has evolved, many new and exciting applications have arisen. From national security to finance, healthcare, and beyond, AI has the capacity to improve the quality and quantity of data analytics and reduce costs. As the ubiquity of AI technology continues to grow, we see it moving closer to the edge, requiring specialized hardware to ensure that AI-enabled devices can operate and process data efficiently.

What is AI at the Edge?

AI at the edge relies on edge computing – a distributed network of computing devices that exist near the source of data, rather than in a data center. This includes Internet of Things (IoT) devices that could be sensors and smart devices that reside within a home, business, or other location. Because the Internet is a global network, the edge could exist anywhere.

Compared to AI algorithms that run inside of a data center, edge AI can offer a number of important benefits that include:

  • Reduced latency since data is processed locally.
  • Increased data security since data is processed at the edge and only results are transmitted , reducing the risk of a breach or interception.
  • Improved reliability since the AI can run even if connection to a data center goes down.
  • Real-time insights since data is processed locally instead of in a distant data center.

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The OSDZU3 System-in-Package and the OSDZU3-REF Development Platform Are Now in Production

 

Octavo Systems, a leader in providing highly integrated System-in-Package technology solutions, is excited to announce the production release of the powerful OSDZU3 System-in-Package (SiP) and the OSDZU3-REF, an open-source development and evaluation platform. Both products are available for order through our distribution partner, Avnet.

OSDZU3 System-in-Package: Performance, Flexibility, Integration

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Octavo Systems Announces Texas Instruments AM62x-Based System-in-Package

 

Nuremberg, Germany (March 14, 2023) – Expanding on its history of delivering highly integrated System-in-Package (SiP) devices, Octavo Systems announced its OSD62x family of SiPs that help expand the performance of edge and small form factor embedded processing into next generation applications. The OSD62x family is based on the Texas Instruments (TI) AM623 and AM625 processors. The OSD62x enables small-size human-machine interface (HMI) applications for building automation, industrial control, IoT gateways, artificial intelligence (AI) at the edge, as well as many other low-power systems demanding high performance Linux processing. Delivering the smallest AM62x module form factor, the OSD62x SiP family integrates high-speed memory, power management, passive components, and much more into a single BGA package.

“The OSD62x is a powerful example of our commitment to deliver ‘Innovation through Integration.’ We are excited to offer our customers a TI AM62x-based solution that reduces solution sizes by 60% and enables designs to get to market up to 9 months faster,” said Harley Walsh, President at Octavo Systems. (Read More…)

Octavo Systems Releases the OSDZU3-REF Development Platform for the AMD-Xilinx Zynq UltraScale+ MPSoC System-in-Package.

 

Houston, Texas, United States (March 1, 2023) – Octavo Systems LLC, a leading provider of System-in-Package (SiP) solutions, has officially released its latest offering, the OSDZU3-REF Development Platform. This platform gives system designers a comprehensive development environment for evaluating, testing, and starting product development using the OSDZU3 System-in-Package (SiP).

Built around the AMD-Xilinx ZU3 Zynq UltraScale+ MPSoC, the OSDZU3 SiP integrates LPDDR4, a Flexible Power System, EEPROM, Oscillators, and hundreds of passive components into a compact 20.5mm x 40mm BGA.

The OSDZU3-REF platform features standard peripherals such as 1Gb Ethernet, USB-C, Display Port, and SATA, and provides expandability through PMOD headers, Mikroe Click™, standard 100Mil headers, and an FMC LPC Connector. It also features an Onboard µUSB JTAG debugger, a µUSB UART connection and access to both SYSMON and PMBUS through standard 100mil connectors.

Octavo Systems leveraged the integration provided by the OSDZU3 SiP to create the OSDZU3-REF using just four PCB layers with low-cost design rules. “The OSDZU3-REF highlights the benefits of using an Octavo SiP to simplify and reduce the cost of your system, “says Erik Welsh, CTO of Octavo Systems. “Without the OSDZU3 SiP, this reference platform would need 8 to 12 layers with much more complex design rules to support the AMD-Xilinx MPSoC, the power system, and the LPDDR4.” (Read More…)

Chill Out with a Cool Dev Board – Summer 2022 Newsletter

It’s the heart of the summer and too hot to go outside, so why not stay in and work on a new project with the OSD32MP1-BRK.

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