OSD335x Bare Minimum Board Boot Process

Introduction

This document will take you through the bring-up process of the Printed Circuit Board (PCB) developed as part of the OSD335x Reference Design Lesson 1.

We begin with bringing-up the newly manufactured board (PCB) to make sure it is functional.  Then we set up the necessary software environment including the TI Code Composer Studio (CSS) IDE and Starterware. We conclude with the demo apps to verify the overall functionality of the board.

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OSD335x Peripheral Circuitry

Introduction

Now that the power, reset and clocks are all connected, we need to add the ability to program the OSD335x to make our design useful. To program the OSD335x, we are going to use the JTAG connection to the processor (later lessons will look at other boot devices). To enable us to do some fun things with our design, we will add a couple of general purpose LEDs, switches, and a multipurpose peripheral header. The header will allow us to connect daughter boards to extend functionality.

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OSD335x Clock Circuitry

Introduction

A clock is essential for the operation of any microprocessor. Therefore, proper design of the clock circuit is pivotal to achieve reliable operation. This article will help you understand the OSD335x Clock Circuitry design methodology.

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OSD335x Reset Circuitry

Introduction

This article will help you understand the OSD335x Reset Circuitry design methodology.

A Reset circuit/pin is typically used to help a microprocessor reinitialize itself and resume its normal operation whenever it runs into an error condition which is undesirable for the current activity and when all other recovery mechanisms fail. It is also used during power-up to make sure the microprocessor and all its modules start their operation from a known state.

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OSD335x Clamping Circuit

Introduction

This article is the fourth part of the OSD335x Reference Design Lesson 1 Power circuitry discussion. It will focus on a clamping circuit which may be needed by your application. A clamping circuit is a type of circuit that maintains the voltage level of an input with respect to another input. As we discuss the clamping circuit, we will build the schematic and layout the corresponding traces.

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OSD335x Power Management

Introduction

This article is the third part of the OSD335x Reference Design Lesson 1 Power circuitry articles. It will mainly focus on topics related to control and management of power for the OSD335x. As we discuss the power circuitry, we will build the schematics and layout the corresponding traces.

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OSD335x ESD Protection

Introduction

Electrostatic discharge (ESD) is the flow of a static electric charge from one object to another when two charged objects come into contact. Familiar examples of ESD include the shock we receive when we walk across a carpet and touch a metal door knob and the static electricity we feel after drying clothes in a clothes dryer. This flow of static charge involves build-up of a very high voltage (around 10KV) for a very short duration of time. Generally, a Printed Circuit Board (PCB) receives an ESD strike whenever a person (whose skin is statically charged) touches it. Most electronic components (without internal ESD protection) get damaged since they cannot withstand such high voltage. Hence, ESD protection for a PCB is essential to protect all the components on it.

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OSD335x Ground Connections

Introduction

This article is the second part of the OSD335x Reference Design Lesson 1 Power circuitry article. It will focus on ground connections and pours required for reliable performance from the OSD335x. As we discuss the power circuitry, we will build the schematic and layout the corresponding traces.

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OSD335x Power Application Note part 2: Software Power Management with OSD335x

In a previous article, we discussed the hardware aspects associated with power management and power budgeting for the OSD335x. However, to optimize the power performance of your design you must also fine tune the power usage of the AM335x inside the OSD335x through software. Using firmware to control the power management of the OSD335x leads to significant power savings in some applications. This document introduces software power management techniques for the OSD335x in Linux and provides examples to demonstrate the advantages of these techniques. (Read More…)

Introduction to the OSD335x Reference Design Tutorial Series

The OSD335x family of System-In-Package (SiP) devices serve as a solid foundation to build advanced embedded systems quickly with reduced time to market. These SiPs tightly integrate Texas Instrument (TI)’s AM335x ARM® Cortex® A8 CPU, TPS65217C Power Management IC (PMIC), TL5209 LDO, up to 1GB of DDR3 and all associated passives. All this is contained in a US quarter sized package as shown in Figure 1.

At Octavo Systems, we are committed to simplifying your design as much as possible so that you can quickly start designing and building your dream products. With this intent in mind, we have developed the OSD335x Reference Design Tutorial Series which will walk you through the OSD335x design process in a systematic manner. (Read More…)

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