Intellectual Property
What makes Octavo Systems System in Package devices different? SiP technology has been around for quite a while, and there are a handful of companies that build SiPs. So, what makes our products at Octavo Systems different? Our approach. Historically, SiPs have been designed for large, high volume opportunities to solve very specific problems. This approach has made SiPs very costly to develop, requiring high volume to pay back the development cost.
We set out with the goal to be able to provide this powerful technology to all customers, not just reserved for the largest. With this as our goal we have innovated across a variety of areas. These patented and patent pending innovations allow us to offer generic SiPs to a large variety of customers. They have also enabled us to significantly lower the upfront cost associated with designing custom SiPs allowing this technology to be leveraged by everybody.
We have developed a portfolio of intellectual property to enable this. We have patent applications covering multiple aspects of the System in Package production flow. We have focused our energy on changes in:
- Component design
- Component manufacture
- System design
- System manufacturing
- System test
Figure 1 depicts in a bit more detail the aspects of the SiP technology that we felt were important to our long term passion to invent the technology which
As can be seen in Figure 1, we have over 40 patentable concepts covered in 15 or so patent applications. They range from:
- How do we change our component design concepts to allow for the integration of systems using integrated circuit concepts?
- How do we design systems with SiP ready integrated circuits?
- How do we apply semiconductor high volume component testing methods to systems in packages?
Moving forward we will continue to innovate in areas that will allow you to have an integration path as you grow your business.
Please contact us to learn more.
