What makes Octavo Systems System in Package devices different? SiP technology has been around for quite a while, and there are a handful of companies that build SiPs. So, what makes our products at Octavo Systems different? Our approach. Historically, SiPs have been designed for large, high volume opportunities to solve very specific problems. This approach has made SiPs very costly to develop, requiring high volume to pay back the development cost.
We set out with the goal to be able to provide this powerful technology to all customers, not just reserved for the largest. With this as our goal we have innovated across a variety of areas. These patented and patent pending innovations allow us to offer generic SiPs to a large variety of customers. They have also enabled us to significantly lower the upfront cost associated with designing custom SiPs allowing this technology to be leveraged by everybody.
We have developed a portfolio of intellectual property to enable this. We have patent applications covering multiple aspects of the System in Package production flow. We have focused our energy on changes in:
Last Update: August 1, 2025
Octavo Systems products may be covered by one or
more of the following U.S. patents, including, but not limited to:
10,204,890
10,867,979
11,171,126
10,714,430
11,302,648
1,752,004
11,502,030
11,157,676
11,309,056
11,416,050
10,470,294
11,032,910
11,610,844
11,211,369
11,257,803
11,869,823
12,001,363
Octavo Systems LLC
Mailing Address: P.O. Box 163835 | Austin, Texas 78716 USA
Headquarters: 2277 Plaza Drive, Suite 610 |Sugar Land, Texas 77479 USA
Tel +1.512.861.3400 x102
Mobile +1.202.494.1914
There has been multiple revisions to the OSDZU3-REF and some of the documentation is for specific revisions.
The revision of your OSDZU3-REF is printed under the fan next to the Octavo Systems logo. See the image below.
If there are multiple versions of a document make sure you select the one that matches your revision.