OSD62x-PM

System-in-Package
AM62 + DDR4 in a Small Flexible Package

The new OSD62x-PM System-in-Package (SiP) family of devices empowers designers utilizing the Texas Instruments AM62x processors to get their design to market faster and in the smallest form factor.

The OSD62x-PM System-in-Package (SiP) integrates the AM62x, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD62x-PM offers the full functionality of the AM62 in a significantly smaller form factor, making it suitable for new, space-constrained applications.

Related Products

OSD62x – AM62, DDR, PMIC, EEPROM, Oscillator, Passives in a 21mm x 21mm Package

OSD62x-PM Features

  • Integrated into a 9mm x 14mm BGA Package:
  • AM62 Features:
    • Up to 4x Arm® Cortex®-A53 @ 1.4GHz
    • Arm® Cortex®-M4F
    • Display subsystem
      • Supports 2x 1920×1080 @ 60fps
      • OLDI/LVDS (4 lanes – 2x) and 24-bit RGB parallel
        interface
    • 3D Graphics Processing Unit
      •  Supports up to 2048×1080 @ 60fps
      • OpenGL ES 3.1, Vulkan 1.2
  • Access to All AM62 Peripherals Including:
    • MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2
    • 10/100/1000 Ethernet Switch
    • Support for Time Sensitive Networking (TSN)
    • 2x USB2.0 Ports
    • 9x UART, 5x SPI, 6x I2C, 3x McASP
    • 3x ePWM, 3x eQEP, 3x eCAP
    • 3x CAN-FD
    • 1x eMMC, 2x SDIO, 1x GPMC
  • Package Options:
    • 9mm x 14mm (0.35in x 0.55in) 500 Ball BGA
    • 0.5mm BGA spacing
  • Temperature Rating
    • -40° to 85°C case

Datasheet

OSD62x-PM Datasheet | Version: 2.0 | January 16, 2026

Family Overview

OSD62x-PM Family Overview (US) | Version: 1 | March 5, 2026

OSD62x-PM Family Overview (EU) | Version: 1 | March 5, 2026

Order Now

Product Number Price Description Buy Direct Order Form
OSD6254-1G-IPM
$22.50
System-In-Package – Processor Module AM6254, 1GB x 16 DDR4, Passives – 9mm x 14mm, 500 Ball BGA, -40°C to 85°C
Product Number Description Buy Direct Order Form
OSD6254-1G-IPM
System-In-Package – Processor Module AM6254, 1GB x 16 DDR4, Passives – 9mm x 14mm, 500 Ball BGA, -40°C to 85°C

Order Now

Product Number Description Buy Direct Order Form
OSD6254-1G-IPM
System-In-Package – Processor Module AM6254, 1GB x 16 DDR4, Passives – 9mm x 14mm, 500 Ball BGA, -40°C to 85°C

Application Notes

  • OSD62x-PM Schematic Checklist – This application note provides a checklist of items to review for custom designs using OSD62x-PM. It is recommended to go through and check each item in this schematic checklist to make sure all specifications are followed for AM62x SoC and OSD62x-PM device.
  • OSD62x-PM to AM625x Pin Mapping – A quick reference to understand the mapping of the pins between the OSD62x-PM Family of devices, the AM6254 processor AMC package and other devices contained within.
  • OSD62x-PM Thermal Guide – A discussion about Thermal Performance and Management of the OSD62x-PM.
  • OSD62x-PM Layout Guide – Overview of how the OSD62x-PM SiP simplifies AM62x SoC designs by integrating DDR4 memory to reduce PCB layer count and complexity.
  • OSD62x-PM Boot Chain and Debug – An overview of the OSD62x-PM boot process, including startup flow, configuration steps, and essential debugging methods for custom designs.
  • OSD62x-PM Power Application Note – This application note outlines power-supply requirements, sequencing, and design recommendations for reliable OSD62x-PM-based system designs.
  • OSD62x-PM Power Design and Budgeting – An application note providing guidance on power rail design, PMIC configuration, and power budgeting for the OSD62x-PM using the OSD62-PM-BRK reference platform.

DDR Configuration Parameters

Development Platforms

Flexible Open Development Platform

The OSD62-PM-BRK is the official open-hardware development platform for the OSD62x-PM System-in-Package (SiP). This compact 4-inch by 1.2-inch (101.6mm x 30.48mm) board is designed for maximum flexibility and ease of use, providing direct access to every I/O of the AM62 processor inside the OSD62x-PM. By leveraging the integration and size savings of the OSD62x-PM, engineers can dramatically reduce PCB complexity and overall footprint, enabling smaller, more efficient designs without sacrificing performance

3D Models

We want to help you with all aspects of your design so we have provided a set of 3D models for our devices as STP files.  They are provided as a best effort without warranty to help you get started with your mechanical designs

Octavo Systems 3D Model Library – STP | Version: 1.0 | July 31, 2025

Symbols

To make designing with Octavo Systems devices easier, a number of schematic symbol libraries have been provided below. There are options for a variety of schematic capture and layout programs. Please choose the one that best suits your needs.

Octavo Symbol Library – Eagle | Version: 16.0 | July 01, 2025

Octavo Symbol Library – Altium | Version: 12.0 | July 01, 2025

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Determine Your OSDZU3-REF Revision

There has been multiple revisions to the OSDZU3-REF and some of the documentation is for specific revisions.

The revision of your OSDZU3-REF is printed under the fan next to the Octavo Systems logo.  See the image below.

If there are multiple versions of a document make sure you select the one that matches your revision.

Document Change Notifications