- Austin, TX
- (512) 861-3400
- Austin, TX
- 512-861-3400
System-in-Package
Performance and Flexibility of the AMD ZU3 MPSoC without the Complexity
The OSDZU3 simplifies designs utilizing the AMD ZU3 Zynq UltraScale+ MPSoC by integrating a Power Management solution, LPDDR4 memory, QSPI memory, and other required components into a single BGA Package that is ~60% smaller than an implementation with discrete chip-down components. The integrated Power Management solution has been customized for the MPSoC and tailored to suit a large range of performance requirements. This integration significantly reduces Engineering time and effort spent on developing applications with ZU3 MPSoC, accelerating time to market by ~9 months and saving significant design costs.
OSDZU3EG1-2G 1V8 V2021.2 (BDF) | Version: 2021.2 | November 26, 2025
OSDZU3EG1-2G 1V8 V2023.1 (BDF) | Version: 2023.1 | December 1, 2025
OSDZU3EG1-2G 3V3 V2023.1 (BDF) | Version: 2023.1 | December 1, 2025
OSDZU3EG1-2G 3V3 V2021.2 (BDF) | Version: 2021.2 | November 26, 2025
OSDZU3 BSP V2021.2 | Version: 1.0 | November 28, 2023
* The OSDZU3 BSP 2023.1 uses the traditional sysvinit init system and does not fully support the Weston Windowing system. This may cause display glitches like trailing cursor/windows on DP or LVDS outputs. There is a suggested work around that requires applying patches and moving from sysvinit to systemd, however, this has not been verified.
To make designing with Octavo Systems devices easier, a number of schematic symbol libraries have been provided below. There are options for a variety of schematic capture and layout programs. Please choose the one that best suits your needs.
Octavo Symbol Library – Eagle | Version: 16.0 | July 01, 2025
Octavo Symbol Library – Altium | Version: 12.0 | July 01, 2025
OSDZU3 Family Overview (US) | Version: 1 | March 5, 2026
OSDZU3 Family Overview (EU) | Version: 1 | March 5, 2026
Together with our partner DesignLinx we are ensuring the OSDZU3 is completely compatible with all AMD tools and software for the UltraScale+ MPSoC devices. (Login is required)
| Product Number | Description | Buy Direct | Order Form | ||||||
|---|---|---|---|---|---|---|---|---|---|
|
OSDZU3EG1-2G-HFB |
System-in-Package –
ZU3EG -1, 2GB (16Gb) LPDDR4 x32,
32MB (256Mb) NOR QSPI, 4KB (32Kb) EEPROM,
2x Infineon IRPS5401 PMICs, 2x LDO,
33MHz Oscillator, 32KHz Oscillator,
1.8V Bank 500 (eMMC Boot),
over 100 Passives –
20.5mm x 40mm, 600 Ball BGA,
-40° to 100° C |
||||||||
|
OSDZU3EG1-2G-HFA |
System-in-Package –
ZU3EG -1, 2GB (16Gb) LPDDR4 x32,
32MB (256Mb) NOR QSPI, 4KB (32Kb) EEPROM,
2x Infineon IRPS5401 PMICs, 2x LDO,
33MHz Oscillator, 32KHz Oscillator,
3.3V Bank 500 (No eMMC Boot),
over 100 Passives –
20.5mm x 40mm, 600 Ball BGA,
-40° to 100° C |
||||||||
|
OSDZU3EG1-2G-BFB |
System-in-Package –
ZU3EG -1, 2GB (16Gb) LPDDR4 x32,
32MB (256Mb) NOR QSPI, 4KB (32Kb) EEPROM,
2x Infineon IRPS5401 PMICs, 2x LDO,
33MHz Oscillator, 32KHz Oscillator,
1.8V Bank 500 (eMMC Boot),
over 100 Passives –
20.5mm x 40mm, 600 Ball BGA,
0° to 85° C |
||||||||
|
OSDZU3EG1-2G-BFA |
System-in-Package –
ZU3EG -1, 2GB (16Gb) LPDDR4 x32,
32MB (256Mb) NOR QSPI, 4KB (32Kb) EEPROM,
2x Infineon IRPS5401 PMICs, 2x LDO,
33MHz Oscillator, 32KHz Oscillator,
3.3V Bank 500 (No eMMC Boot),
over 100 Passives –
20.5mm x 40mm, 600 Ball BGA,
0° to 85° C |
||||||||
|
OSDZU3EG1-2G-IFB |
System-in-Package –
ZU3EG -1, 2GB (16Gb) LPDDR4 x32,
32MB (256Mb) NOR QSPI, 4KB (32Kb) EEPROM,
2x Infineon IRPS5401 PMICs, 2x LDO,
33MHz Oscillator, 32KHz Oscillator,
1.8V Bank 500 (eMMC Boot),
over 100 Passives –
20.5mm x 40mm, 600 Ball BGA,
-40° to 85° C |
||||||||
|
OSDZU3EG1-2G-IFA |
System-in-Package –
ZU3EG -1, 2GB (16Gb) LPDDR4 x32,
32MB (256Mb) NOR QSPI, 4KB (32Kb) EEPROM,
2x Infineon IRPS5401 PMICs, 2x LDO,
33MHz Oscillator, 32KHz Oscillator,
3.3V Bank 500 (No eMMC Boot),
over 100 Passives –
20.5mm x 40mm, 600 Ball BGA,
-40° to 85° C |
||||||||
| Product Number | Description | Buy Direct | Order Form | ||||||
|---|---|---|---|---|---|---|---|---|---|
|
OSDZU3EG1-2G-HFB |
System-in-Package –
ZU3EG -1, 2GB (16Gb) LPDDR4 x32,
32MB (256Mb) NOR QSPI, 4KB (32Kb) EEPROM,
2x Infineon IRPS5401 PMICs, 2x LDO,
33MHz Oscillator, 32KHz Oscillator,
1.8V Bank 500 (eMMC Boot),
over 100 Passives –
20.5mm x 40mm, 600 Ball BGA,
-40° to 100° C |
||||||||
|
OSDZU3EG1-2G-HFA |
System-in-Package –
ZU3EG -1, 2GB (16Gb) LPDDR4 x32,
32MB (256Mb) NOR QSPI, 4KB (32Kb) EEPROM,
2x Infineon IRPS5401 PMICs, 2x LDO,
33MHz Oscillator, 32KHz Oscillator,
3.3V Bank 500 (No eMMC Boot),
over 100 Passives –
20.5mm x 40mm, 600 Ball BGA,
-40° to 100° C |
||||||||
|
OSDZU3EG1-2G-BFB |
System-in-Package –
ZU3EG -1, 2GB (16Gb) LPDDR4 x32,
32MB (256Mb) NOR QSPI, 4KB (32Kb) EEPROM,
2x Infineon IRPS5401 PMICs, 2x LDO,
33MHz Oscillator, 32KHz Oscillator,
1.8V Bank 500 (eMMC Boot),
over 100 Passives –
20.5mm x 40mm, 600 Ball BGA,
0° to 85° C |
||||||||
|
OSDZU3EG1-2G-BFA |
System-in-Package –
ZU3EG -1, 2GB (16Gb) LPDDR4 x32,
32MB (256Mb) NOR QSPI, 4KB (32Kb) EEPROM,
2x Infineon IRPS5401 PMICs, 2x LDO,
33MHz Oscillator, 32KHz Oscillator,
3.3V Bank 500 (No eMMC Boot),
over 100 Passives –
20.5mm x 40mm, 600 Ball BGA,
0° to 85° C |
||||||||
|
OSDZU3EG1-2G-IFB |
System-in-Package –
ZU3EG -1, 2GB (16Gb) LPDDR4 x32,
32MB (256Mb) NOR QSPI, 4KB (32Kb) EEPROM,
2x Infineon IRPS5401 PMICs, 2x LDO,
33MHz Oscillator, 32KHz Oscillator,
1.8V Bank 500 (eMMC Boot),
over 100 Passives –
20.5mm x 40mm, 600 Ball BGA,
-40° to 85° C |
||||||||
|
OSDZU3EG1-2G-IFA |
System-in-Package –
ZU3EG -1, 2GB (16Gb) LPDDR4 x32,
32MB (256Mb) NOR QSPI, 4KB (32Kb) EEPROM,
2x Infineon IRPS5401 PMICs, 2x LDO,
33MHz Oscillator, 32KHz Oscillator,
3.3V Bank 500 (No eMMC Boot),
over 100 Passives –
20.5mm x 40mm, 600 Ball BGA,
-40° to 85° C |
||||||||
The OSDZU3-REF is the perfect platform to evaluate the capabilities of the OSDZU3 System-in-Package in your next application.
The Octavo Systems OSDZU3-REF is a full featured 4-layer development platform for the OSDZU3 System-in-Package devices. Based on the UltraZED PCIe Carrier Card from Avnet the OSDZU3-REF provides access to a host of peripherals and expansion headers to fully evaluate the OSDZU3 in your application. Its USB-C, USB 3.0, SATA Host, and 1Gb Ethernet interfaces support easy connectivity to off the shelf peripherals. It can also be expanded with custom functionality through the FMC Low Pin Count Connector and the PMOD headers. The OSDZU3-REF also supports displays through a Display Port or LVDS Display + Touch Interface. It is pre-installed with a Peta Linux Distribution, provided by DesignLinx, that features a number of demo applications, enabling you to go from box to AI demo in a matter of minutes.
We want to to help you with all aspects of your design so we have provided a set of 3D models for our devices as STP files. They are provided as a best effort without warranty to help you get started with your mechanical designs
Octavo Systems 3D Model Library – STP | Version: 1.0 | July 31, 2025
There has been multiple revisions to the OSDZU3-REF and some of the documentation is for specific revisions.
The revision of your OSDZU3-REF is printed under the fan next to the Octavo Systems logo. See the image below.
If there are multiple versions of a document make sure you select the one that matches your revision.
