OSD32MP2-PM System-in-Package

STM32MP2 + DDR4 in a Small Flexible Package

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The OSD32MP2x-PM System-in-Package (SiP) integrates the ST Microelectronics STM32MP2 processor, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD32MP2x-PM offers the full functionality of the STM32MP2 in a significantly smaller form factor, making it suitable for new, space-constrained applications.

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  • OSD32MP2 – STM32MP2, DDR, PMIC, EEPROM, Oscillator, Passives in a in a 21mm X 21mm Package

 

  • Integrated into a 9mm X 14mm BGA Package:
  • STM32MP2 Features:
    • Up to 2x Arm® Cortex®-A35 @1.5GHz
    • Arm® Cortex®-M33 @ 400MHz
    • AI Neural Processing Unit
      • 35 TOPS
    • 3D Graphics Processing Unit
      • OpenGL ES 3.1, Vulkan 1.1, OpenCL 1.2
  • Access to All STM32MP2 Peripherals Including:
    • 8× I2C FM+ (1 Mbit/s, SMBus/PMBus®)
    • 4× I3C (12.5 Mbit/s)
    • 5× UART + 4× USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI) + 1× LPUART
    • 8× SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
    • 4× SAI (stereo audio: I2S, PDM, SPDIF Tx)
    • SPDIF Rx with 4 inputs
    • 3× SDMMC up to 8-bit (SD/e•MMC™/SDIO)
    • Up to 3× CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
    • 1× USB 2.0 high-speed Host with embedded 480 Mbits/s PHY
    • 1× USB 2.0/3.0 high-speed/SuperSpeed dual role data with embedded 480 Mbits/s and 5 Gbits/s PHY (5 Gbits/s PHY shared with PCI Express)
    • 1× USB Type-C® Power Delivery control with two CC lines PHY
    • 1 × PCI Express with embedded 5 Gbits/s PHY (PHY shared with USB 3.0 SuperSpeed)
    • Up to 3× Gigabit Ethernet interfaces
      • TSN, IEEE 1588v2 hardware
    • Camera interface #1 (5 Mpixels @30 fps)
      • MIPI CSI-2®, 2× data lanes up to 2.5 Gbit/s each
      • 8- to 16-bit parallel, up to 120 MHz
      • RGB, YUV, JPG, RawBayer with basic ISP
      • Lite-ISP, demosaicing, downscaling, cropping, 3 pixel pipelines
    • Camera interface #2 (1 Mpixels @15 fps)
      • 8- to 14-bit parallel, up to 80 MHz
      • RGB, YUV, JPG
      • Cropping
    • Digital parallel interface up to 16-bit input or output
    • 3 × ADCs with 12-bit max. resolution (up to 5 Msps each, up to 23 channels)
    • Internal temperature sensor (DTS)
    • 1× multifunction digital filter (MDF) with up to 8 channels/8 filters
    • 1× audio digital filter (ADF) with 1 filter and sound activity detection
    • Internal (VREFBUF) or external ADC reference VREF+
  • 9mm X 14mm (0.35in X 0.55in) BGA Package
    • 500 Ball
    • 5mm BGA spacing
  • Temperature Rating
    • 0° to 85° C case
    • -40° to 85° C case

Family Overview

OSD32MP2 Family Overview | Version: 1.0 | April 04, 2024

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