The OSD32MP2x-PM System-in-Package (SiP) integrates the ST Microelectronics STM32MP2 processor, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD32MP2x-PM offers the full functionality of the STM32MP2 in a significantly smaller form factor, making it suitable for new, space-constrained applications.
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