The new OSD62x System-in-Package (SiP) family of devices empowers designers utilizing the Texas Instruments AM62x processors to get their design to market faster and in a smaller form factor. It enables them to build the next generation of building and industrial automation/control, IoT Gateway, Artificial Intelligence (AI) at the edge, Human Machine Interface (HMI) and other low-power high performance applications by allowing the designer to focus on features that will differentiate their product instead of spending time getting the processor to function.
The OSD62x integrates the AM62x processor, LPDDR4, Power Management, EEPROM, Oscillators, and Passives into a single package. This integration removes tedious tasks from your design process allowing you to focus on areas that will add value to your AM62 based design. It is the fastest, smallest, and most cost-effective way to implement an AM62 system.
OSD62x-PM – AM62x, DDR, Passives in a tiny 9mm x 14mm Package
OSD62x Family Overview (US) | Version: 1 | March 6, 2026
OSD62x Family Overview (EU) | Version: 1 | March 6, 2026
There has been multiple revisions to the OSDZU3-REF and some of the documentation is for specific revisions.
The revision of your OSDZU3-REF is printed under the fan next to the Octavo Systems logo. See the image below.
If there are multiple versions of a document make sure you select the one that matches your revision.