OSD62x

Texas Instruments AM62x based - Full Featured System-in-Package

The new OSD62x System-in-Package (SiP) family of devices empowers designers utilizing the Texas Instruments AM62x processors to get their design to market faster and in a smaller form factor. It enables them to build the next generation of building and industrial automation/control, IoT Gateway, Artificial Intelligence (AI) at the edge, Human Machine Interface (HMI) and other low-power high performance applications by allowing the designer to focus on features that will differentiate their product instead of spending time getting the processor to function.

The OSD62x integrates the AM62x processor, LPDDR4, Power Management, EEPROM, Oscillators, and Passives into a single package. This integration removes tedious tasks from your design process allowing you to focus on areas that will add value to your AM62 based design. It is the fastest, smallest, and most cost-effective way to implement an AM62 system.

Related Products

OSD62x-PM – AM62x, DDR, Passives in a tiny 9mm x 14mm Package

OSD62x Features

  • Integrated into a 21mm x 21mm BGA Package:
  • AM62 Features:
    • Up to 4x Arm® Cortex®-A53 @ 1.4GHz
    • Arm® Cortex®-M4F
    • Display subsystem
      • Supports 2x 1920×1080 @ 60fps
      • OLDI/LVDS (4 lanes – 2x) and 24-bit RGB parallel
        interface
    • 3D Graphics Processing Unit
      • Supports up to 2048×1080 @ 60fps
      • OpenGL ES 3.1, Vulkan 1.2
  • Access to All AM62 Peripherals Including:
    • MIPI CSI 1.3 Compliant + MIPI-DPHY 1.2
    • 10/100/1000 Ethernet Switch
    • Support for Time Sensitive Networking (TSN)
    • 2x USB2.0 Ports
    • 9x UART, 5x SPI, 6x I2C, 3x McASP
    • 3x ePWM, 3x eQEP, 3x eCAP
    • 3x CAN-FD
    • 1x eMMC, 2x SDIO, 1x GPMC
  • Power Supply
    • Single (3.3V) voltage Input
    • All Power sequencing handled internal to SiP
    • Rails available for system user.
  • Package Options:
    • 21mm x 21mm (0.827in x 0.827in) 437 Ball BGA
    • 1.0mm BGA spacing
  • Temperature Rating
    • 0° to 85°C case
    • -40° to 85°C case

Family Overview

OSD62x Family Overview (US) | Version: 1 | March 6, 2026

OSD62x Family Overview (EU) | Version: 1 | March 6, 2026

What our Customers are Saying:

Determine Your OSDZU3-REF Revision

There has been multiple revisions to the OSDZU3-REF and some of the documentation is for specific revisions.

The revision of your OSDZU3-REF is printed under the fan next to the Octavo Systems logo.  See the image below.

If there are multiple versions of a document make sure you select the one that matches your revision.

Document Change Notifications