The Practical Guide to Product Development with SiPs Most articles about System-in-Package devices stop at the definition. This one starts
- Austin, TX
- (512) 861-3400
- Austin, TX
- 512-861-3400
The Practical Guide to Product Development with SiPs Most articles about System-in-Package devices stop at the definition. This one starts
Octavo Systems is heading to Embedded World North America 2026 in Anaheim, California, September 22–24. Meet our team and get the latest updates on the OSD62x-PM, OSD32MP2x-PM, and System-in-Package technology.
The OSD32MP2x-PM has been shortlisted for Embedded Solution Product of the Year in the 2026 Instrumentation & Electronics Awards. Learn more about the recognition and cast your vote for Octavo Systems.
Lean embedded teams often juggle hardware, firmware, and software responsibilities. Learn how architecture decisions and System-in-Package (SiP) designs help reduce complexity and protect engineering time.
The hidden costs of discrete design aren’t found in the BOM alone. PCB complexity, component qualification, and supply chain risk can all impact development timelines and product stability. Explore how the OSD32MP15x System-in-Package helps simplify embedded design by integrating critical system functions into a single package.
Most SiP vs SoC comparisons stop at definitions. The real question is how each option affects layout complexity, bring-up risk, development timelines, and your path to a working system. Here’s what the decision actually means in practice.
Most board spins are not caused by mistakes. They are caused by decisions that carry risk into hardware. Here is what a board spin actually costs and why the same teams keep experiencing them.
DDR pricing has nearly tripled in some cases, and availability is increasingly unpredictable. But the real cost is not the price increase. It is the validation work, board spins, and schedule risk that follow every sourcing change. This piece breaks down where DDR risk actually shows up in embedded designs, and why more teams are moving memory complexity upstream.
As embedded systems shrink, where complexity lives matters more than ever. See how System-in-Package integration simplifies DDR routing, reduces risk, and improves performance per area.
Compare SiP and discrete integration beyond BOM cost. Learn where SiP reduces assembly steps, test time, and rework to accelerate embedded hardware ramps.
Modern PCBs are being asked to support more functionality than ever before. As embedded systems grow more capable, board-level decisions now play a central role in shaping system behavior, reliability, and scalability.
Compact industrial designs eventually reach a tipping point where board density, thermal limits, and long-term reliability collide. System-in-Package integration helps embedded teams manage complexity by relocating the most sensitive interactions off the PCB and into a pre-validated device.
Recognizing Innovation: OSD62x-PM Shortlisted at the Elektra Awards We are proud to announce that Octavo Systems has been named a
Independent platforms are taking a closer look at our newest System-in-Package, the OSD62x-PM—and the feedback is exciting. Recently, Electromaker published a
We Just Launched the OSD62x-PM – Our Smallest SiP Yet We’re excited to share that our newest System-in-Package Module, the OSD62x-PM, is
From Prototype to Production: How Octavo Systems Accelerates Product Development In the embedded world, the journey from prototype to production
Meet the Minds Behind Octavo: How Innovation and Experience Drive Our Mission At Octavo Systems, we believe simplifying embedded design
In the world of embedded systems, performance, scalability, and simplicity often feel like trade-offs. But what if you didn’t have
In industrial automation, robotics, and autonomous systems, timing isn’t just important—it’s everything. Devices need to respond with split-second accuracy, communicate
Welcome to the inaugural edition of Embedded Insights, where we explore how System-in-Package (SiP) technology is accelerating product development across industries.
There has been multiple revisions to the OSDZU3-REF and some of the documentation is for specific revisions.
The revision of your OSDZU3-REF is printed under the fan next to the Octavo Systems logo. See the image below.
If there are multiple versions of a document make sure you select the one that matches your revision.
