The Heating, Ventilation and Air Conditioning (HVAC) market is expected to reach over $130B in the next five years. Driven by the rise in construction globally, plus refurbishment of homes and businesses, the demand to put in new units is increasing rapidly. Smarter equipment with more sensors, higher efficiency, reliability and ease of maintenance are priorities for new designs. As with most rapidly growing electronics markets, the need for fast turnaround of embedded systems designs while maintaining cost controls and increasing features is critical to a strong go to market strategy. Increasingly these systems also need be configured and controlled based on information being received in real time. In order to keep up with the rapid rate at which technology is transforming the HVAC industry, design engineers need a flexible platform on which they can spend time developing the features that make their application unique and efficient, and not have to channel valuable resources into tedious complexities such as power management and DDR routing. They also need reliable, open source hardware and software design tools. The OSD335x-SM System in Package based on the TI AM335x, is the perfect solution as it provides engineers the solid foundation that they need. With the availability of low cost development tools, such as PocketBeagle® from BeagleBoard.org®, rapid prototyping HVAC features is easy. (Read More…)
The July 2019 Newsletter includes an exciting industry award announcement plus new application notes for AM335x on ethernet and industrial control as well as CubeMX software for STM32MP1. (Read More…)
Figure 1 Let’s have better control and put AM335x based system in package into all these Air Conditioner units!
Some applications of IoT are still being debated. Does your refrigerator really need an operating system and be connected to the internet? Should it try to detect when you’re out of milk and automatically order more? What if there’s an error and 50 gallons shows up on your doorstep? Just like many others, I do not know the answers to all these questions. One thing I know for sure is that IoT does belong in air conditioning and the control systems of medium-to-large buildings. The OSD335x family of System-in-Package products featuring the AM335x, provides an excellent foundation for the design of an Open-Hardware Building Automation System Controller. This article introduces a series of technical application notes for building a reference design with the OSD335x-SM.
Due to its openness, flexibility, and tremendous community support and development, Linux has become the operating system of choice for most new embedded systems. Be it Industrial control systems, robotics applications, or IoT devices, Linux distributions pull together drivers, utilities, libraries, and application software that reduce time to market and development costs. However, the challenge with Linux is:
How does one get started using Linux on a new Embedded System?
Embedded World (February 27, 2018) – Octavo Systems LLC (Octavo), the expert in System-In-Package (SiP) for mass-market applications, today announced the smallest system ready for Industrial applications with a temperature rating of -40°C to 85°C case. (Read More…)
Industry analysts predict billions of things will connect to the Internet by 20201. Whether it is your fitness tracker or a smart fridge, we are now able track, analyze and make healthier choices to improve our lives. We are able to make our homes more secure and energy efficient. Soon we will watch Netflix in self-driving vehicles on our way to work. Due to the potential and the ability to personalize information, the industry has pursued connecting all devices to the Internet with passion. Therefore, it is a given that your marketing department will come in asking you to update your product with IoT capabilities.
How Octavo Systems Helps Your IoT Design
Octavo Systems is leading the hardware effort to make IoT system development more accessible to everyone. Through System-in-Package (SiP) technology, it is possible to embed complex and powerful systems into tiny spaces while saving valuable time to market and cost.
Last week we headed out to San Jose to attend the Embedded Systems Conference (ESC) Silicon Valley. We met a lot of innovative startups and had very productive conversations, as well as engaged with more familiar industry names that were all looking to take advantage of System-In-Package technology. Hopefully, if you were in the area, you were able to stop by and talk to the team. If you weren’t, here’s a few highlights from the show, as well as some exciting things to come.
