Today is an exciting day at Octavo Systems. It is the culmination of months of hard work and at the same time the beginning of even more! Starting today you can place orders for OSD32MP1 Engineering Samples through all of our distribution partners! Also, we have released our first reference design using the OSD32MP1 SiP so you can get started on your own! (Read More…)
Whether you use OrCAD, Eagle or Altium, we’ve just released a library containing our OSD32MP1 , the STM32MP1 System in Package device. Download all of the OSD32MP1 SiP, STM32MP1 Schematic Symbol and STM32MP1 Footprint files in one place.
It is crazy to think that just 3 years ago we released our first SiP built around the popular AM335x microprocessor from Texas Instruments. We have since spread the word that System-in-Package is no longer a solution reserved for the large, well-funded companies, but that any designer can take advantage of System-in-Package Technology via solutions from Octavo Systems. Now with this recognition from the Electronics Industry Awards, it appears this message is gaining traction.
Embedded World, Nuremberg, Germany (February 25, 2019) – Octavo Systems today introduced the OSD32MP1, their first System-in-Package (SiP) product based on the new STM32MP1 microprocessor from STMicroelectronics. The OSD32MP1 allows users of the popular STM32 family to move to Linux without adding size or complexity to their design. Octavo has leveraged their years of experience creating tightly integrated system building blocks to develop a device that is up to 64% smaller than an equivalent system made from discrete components. At only 18mm X 18mm the OSD32MP1 is the same size as the STM32MP1 but integrates: (Read More…)
