July 2019 Newsletter
The July 2019 Newsletter includes an exciting industry award announcement plus new application notes for AM335x on ethernet and industrial control as well as CubeMX software for STM32MP1.
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Category: Embedded Systems
OSD335x C-SiP Brings a Dead Bug Single Chip Computer to Life
Are you tired of spending all your time re-inventing the wheel? Unfortunately, many embedded engineers do just that; spend countless hours integrating the same core systems components over and over again. The OSD335x C-SiP allows you to break the cycle by providing an easy to use, complete system in a single package that integrates all of the core components that you need for your embedded system. Provide power, connect your peripherals, and you are ready to go. This single chip computer is so easy to use, you can now ‘dead bug’ a 1GHz Linux computer. (Read More…)
Embedded World 2019 Newsletter
The Embedded World 2019 Newsletter includes plans for the show, new technology demonstrations, win a robot, and more
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Leveraging Engineering Experience: Embedded Linux Systems Jump-Start
You have a great new design idea. Now that you’ve chosen your processor and the System-in-Package that meets your needs, you need to get up to speed on the device. You grab your cup of coffee and sit down at your computer to check out the resources, but there is so much information out there! Where to begin?
When starting 
a new embedded systems design, wouldn’t it be nice to have a technical support mentor? Could you use an embedded engineer with years of experience, at your elbow helping you navigate all the information on the web? It can be difficult to navigate through the hundreds of pages of information to find key pieces that can help you get a jump-start on your design:
OSD3358-SM-RED Board Demo. So Easy Even Marketing Can Do It!
The OSD3358-SM-RED is our Reference, Evaluation and Development platform for the OSD335x Family of System-in-Package (SiP) devices. It was designed to make it easy for anybody with some knowledge or a desire to learn to begin developing applications on the OSD335x family of SiPs. In fact, it is so easy to use even a Marketing Person like me can quickly develop on it!
Escape the Struggles of Layout with OSD335x C-SiP
Here at Octavo Systems, we pride ourselves in making our devices easy to use. This extends to reducing the challenges that designers have in laying out a new printed circuit board (PCB). Our System-in-Package devices by their very nature will reduce a bill of materials (BOM) from over one hundred discreet devices to only one. This saves enormous amounts of layout time and effort purely from a component placement and routing point of view. However, Octavo Systems goes to the next level in simplifying your design layout.
Ball-grid Array (BGA) packages can be difficult to route during layout. Routing out, or escaping, the signals on the inner balls of a BGA can be difficult and can add many layers to the PCB. However, the ball maps of our System-in-Package devices are specifically designed from a system integration point of view. By moving all signal pins to the outer three rows and columns, with the 1.27mm (50 mil) ball pitch, it allows all signals to be escaped in one PCB layer with very standard 0.15mm (6 mil) trace / space routing rules. Then we designed the power inputs and outputs to be easy to use by grouping the ball together such that it is easy to use copper pours to connect them together. Similarly all control signals between the processor and power management IC (PMIC) are pinned out next to each other for easy connections. This not only reduces design complexity but makes laying out the BGA much easier which saves engineering time and money.
Octavo Introduces C-SiP™ : a Complete 1GHz Computer in a 27mm Package
Austin, TX (September 27, 2018) – Octavo Systems, the leader in System-in-Package (SiP) technology, announced today, the most completely integrated 1GHz Arm® Cortex®-A8 computing platform, the OSD335x C-SiP™. The OSD335x C-SiP (Complete System-In-Package) integrates the required components for a computing system into a single IC package that is about the size of a standard Lego block. The newest addition to the OSD335x family, the OSD335x C-SiP is a complete system containing:
- 1GHz Arm Cortex-A8 Sitara™ AM335x processor from Texas Instruments
- Up to 1GB of DDR3 RAM
- 4KB EEPROM
- 2 Power Supplies
- Up to 16GB of eMMC Non-Volatile Flash Memory
- MEMS Oscillator
- Over 100 passive components
- All in a single 27mm X 27mm 400 Ball BGA Package.
Altium Symbol Library now Available for OSD335x
At Octavo Systems, we are always looking for ways to help designers be more productive, be it with application notes, tutorials, reference designs, or design collateral. The goal of our System-in-Package technology is to create modular building blocks that abstract away tedious, repetitive, and complex tasks that designers are forced to spend time on, but don’t really add value to the end system so that they can create better, more innovate products.
Today we took another step in making designing with Octavo Systems devices easier by adding an Altium symbol library for the OSD335x-SM for you to download from our website. Scroll down to the link to download.
July 2018 Newsletter
At Octavo we are committed to making it as easy as possible to develop embedded systems. We have revamped our App Notes page and added new content to ease your design tasks. We have included some of our favorites below! (Read More…)
Leveraging Linux: Enlightened Under the Tree
Due to its openness, flexibility, and tremendous community support and development, Linux has become the operating system of choice for most new embedded systems. Be it Industrial control systems, robotics applications, or IoT devices, Linux distributions pull together drivers, utilities, libraries, and application software that reduce time to market and development costs. However, the challenge with Linux is:
How does one get started using Linux on a new Embedded System?
