Nuremberg, Germany — April 9, 2024 — Octavo Systems, a leader in system integration technology, proudly announces the launch of its OSD32MP2 family, featuring two innovative System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM. Designed to leverage the advanced capabilities of the new STM32MP25 processor from STMicroelectronics, this family is set to transform electronics design by significantly reducing complexity, size, and total cost of ownership.
The OSD32MP2 family caters to a diverse range of applications, from industrial automation to consumer electronics, offering unparalleled processing power, connectivity, and security features. The series includes:
OSD32MP2: A comprehensive SiP solution integrating the STM32MP2 processor, DDR4 memory, power management (STMPMIC2), EEPROM, oscillators, and passives into a 21mm x 21mm BGA package. This module is designed for designers seeking a straightforward, efficient path to harnessing the full capabilities of the STM32MP2.
OSD32MP2-PM: A streamlined module focusing on the essential integration of the STM32MP2 processor and DDR4 memory in a compact 9mm x 14mm package, ideal for cost-sensitive or uniquely designed projects requiring flexibility in power solutions or form factors.
Innovative Features for Advanced Designs
The OSD32MP2 series is built around the STM32MP25 processor, featuring a dual Arm Cortex-A35 cores, an Arm Cortex-M33 core, a 3D GPU supporting Vulkan API, H.264 video encoding/decoding, a 1.35 TOPS AI accelerator, and comprehensive connectivity options. These features enable the development of cutting-edge applications that demand high-performance processing, advanced graphics, and robust security.
Empowering Electronics Design Engineers
“Octavo Systems is committed to empowering electronics design engineers by simplifying the complexities of modern electronic design,” said Harley Walsh, President of Octavo Systems. “Our OSD32MP2 series allows engineers to focus on innovation and product differentiation, providing them with the tools to bring their ideas to market faster and more efficiently than ever before.”
The OSD32MP2 reduces design time and size by up to 60%, offering the lowest total cost of ownership. The OSD32MP2-PM offers a flexible option for designs requiring a unique form factor or power solution, making it ideal for wearable technology or other innovative applications.
Availability
Samples of the OSD32MP2-PM will be available at the end of 2024, with the OSD32MP2 samples following in early 2025. For additional information, including detailed specifications and ordering details, please visit https://octavosystems.com or contact Octavo Systems at sales@octavosystems.com.
About Octavo Systems
Octavo Systems is at the forefront of System-in-Package technology, dedicated to making electronic design simpler, faster, and more cost-effective. With a focus on integrating complex systems into compact, efficient packages, Octavo Systems is paving the way for the future of electronics design.
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Octavo Systems, a leader in providing highly integrated System-in-Package technology solutions, is excited to announce the production release of the powerful OSDZU3 System-in-Package (SiP) and the OSDZU3-REF, an open-source development and evaluation platform. Both products are available for order through our distribution partner, Avnet.
Nuremberg, Germany (March 14, 2023) – Expanding on its history of delivering highly integrated System-in-Package (SiP) devices, Octavo Systems announced its OSD62x family of SiPs that help expand the performance of edge and small form factor embedded processing into next generation applications. The OSD62x family is based on the Texas Instruments (TI) AM623 and AM625 processors. The OSD62x enables small-size human-machine interface (HMI) applications for building automation, industrial control, IoT gateways, artificial intelligence (AI) at the edge, as well as many other low-power systems demanding high performance Linux processing. Delivering the smallest AM62x module form factor, the OSD62x SiP family integrates high-speed memory, power management, passive components, and much more into a single BGA package.
“The OSD62x is a powerful example of our commitment to deliver ‘Innovation through Integration.’ We are excited to offer our customers a TI AM62x-based solution that reduces solution sizes by 60% and enables designs to get to market up to 9 months faster,” said Harley Walsh, President at Octavo Systems. (Read More…)
Houston, Texas, United States (March 1, 2023) – Octavo Systems LLC, a leading provider of System-in-Package (SiP) solutions, has officially released its latest offering, the OSDZU3-REF Development Platform. This platform gives system designers a comprehensive development environment for evaluating, testing, and starting product development using the OSDZU3 System-in-Package (SiP).
Built around the AMD-Xilinx ZU3 Zynq UltraScale+ MPSoC, the OSDZU3 SiP integrates LPDDR4, a Flexible Power System, EEPROM, Oscillators, and hundreds of passive components into a compact 20.5mm x 40mm BGA.
The OSDZU3-REF platform features standard peripherals such as 1Gb Ethernet, USB-C, Display Port, and SATA, and provides expandability through PMOD headers, Mikroe Click™, standard 100Mil headers, and an FMC LPC Connector. It also features an Onboard µUSB JTAG debugger, a µUSB UART connection and access to both SYSMON and PMBUS through standard 100mil connectors.
Octavo Systems leveraged the integration provided by the OSDZU3 SiP to create the OSDZU3-REF using just four PCB layers with low-cost design rules. “The OSDZU3-REF highlights the benefits of using an Octavo SiP to simplify and reduce the cost of your system, “says Erik Welsh, CTO of Octavo Systems. “Without the OSDZU3 SiP, this reference platform would need 8 to 12 layers with much more complex design rules to support the AMD-Xilinx MPSoC, the power system, and the LPDDR4.” (Read More…)
The OSD32MP1-RED full Featured Development Platform is AVAILABLE NOW from Digi-Key, Arrow, and Mouser. Quickly prototype your design on the OSD32MP1 System-in-Package, leveraging some of the most common peripherals (WiFi, Bluetooth, Camera, Ethernet, CAN, Display, etc.), plenty of options for expansion, and support for both Debian Linux and OpenSTLinux.
The new year is a time for resolutions, not only for ourselves but also our projects. Some of the most popular revolve around TIME or MONEY. The good news is using an Octavo Systems System-in-Package Device will make sure these are resolutions you can keep. (Read More…)
’tis the Season for More MP1 and IoT! OSD32MP1-RED available for Pre-order, App Notes to get you started on your IoT projects, and more variations of the MP1.
Join our joint webinar with ST Microelectronics to learn how the MP1 and System-in-Package can get you into production faster. Also register to win 1 of 5 OSD32MP1-BRK flexible development platforms at the end of the webinar.
Octavo Systems recently celebrated our fifth year in business! It has been an amazing time for us as we have utilized the concepts surrounding system-in-package (SiP) technology. It is moments like these that make it fun to look back on what has happened and also look forward to the next five years.
Octavo had its inception when three former Texas Instruments employees (Bill Heye, Masood Murtuza and myself – Gene Frantz) began to discuss where the semiconductor industry was going and how we could participate in its movement. Octavo came to life in 2015 when we teamed up with Green Source Holding LLC and several engineer colleagues of ours. The name “Octavo” references the 15th century technology that made early printing available to the broader public by miniaturizing and reducing the cost of books. In that same vein, Octavo’s vision is to change the rules of electronics design and manufacturing so advanced technology is available to everyone by reducing the size and cost of integrated systems. (Read More…)
