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- 512-861-3400
The OSD32MP15x family is the first fully integrated ST32MP1 System in Package providing the full system in the same size as the STMicroelectronic processor itself
1 Page Overview of the OSD32MP15x System in Package Family based on the STM32MP1
Flexible Prototyping Platform
The OSD32MP1-BRK is a small flexible prototyping platform for the STM32MP1 based SiP, the OSD32MP15x. At only 3in X 1.8in (75mm X 46mm), provides easy access to the I/O of the STM32MP1 through a set of breadboard compatible headers. The OSD32MP1-BRK allows developers to quickly build a proof of concept that more closely resembles their actual system without the need to build their own custom hardware.
The OSD32MP1-RED is the Reference, Evaluation, Development platform for the OSD32MP15x family of SiP devices. It is designed to enable quick evaluation of the OSD32MP15x in your specific application. It has a number of industry standard connectors, plus access to a host of peripherals, and connectivity options including WiFi and Bluetooth. Running a completely opensource Debian Distribution the OSD32MP1-RED allows quick prototyping in both hardware and software.
All of the hardware design files and software are freely available as Opensource so it can be used as a known good starting point for new designs.
First STM32MP15x System in Package
Description
The OSD32MP15x integrates the STMicroelectronics STM32MP1 featuring Dual Arm® Cortex® A7 Cores and an Arm® Cortex® M4 along with up to 1GB DDR3, STPMIC1 Power Management IC, EEPROM, MEMS Oscillator, and passives into single 18mm x 18mm BGA package.
Processor
STM32MP15x Dual Core Arm® Cortex® A7 plus an Arm® Cortex® M4
Memory
0° to 85° C
-40° to 85° C
Package Size
18mm X 18mm – 302 Ball BGA
System-in-Package The Quickest and Most Cost-effective way to develop with the STM32MP2
Description
The OSD32MP2x System-in-Package (SiP) integrates the STMicroelectronics STM32MP2 processor with DDR4 memory, STPMIC2 PMIC, EEPROM, Oscillators and passives into a compact 21mm x 21mm BGA package. This integration removes tedious tasks from your design process allowing you to focus on areas that will add value to your STM32MP2 based design.
Processor
STMicroelectronics STM32MP25x
Memory
Starting at 1GB DDR4
– STMicroelectronics STM32MP2 processor
– DDR4 memory
– STPMIC2 PMIC
– EEPROM
– Oscillators
– Passives
0° to 85° C
-40° to 85° C
Package Size
21mm X 21mm – 437 Ball BGA
System-in-Package STM32MP2 + DDR4 in a Small Flexible Package
Description
The OSD32MP2x-PM System-in-Package (SiP) integrates the ST Microelectronics STM32MP2 processor, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD32MP2x-PM offers the full functionality of the STM32MP2 in a significantly smaller form factor, making it suitable for new, space-constrained applications.
Processor
STMicroelectronics STM32MP25x
Memory
Starting at 1GB DDR4
– Passives
0° to 85° C
-40° to 85° C
Package Size
9mm X 14mm – 500 Ball BGA18mm X 18mm – 302 Ball BGA
The OSD335x family is the perfect solution for any designer looking to quickly integrate the Texas Instruments AM335x into their product using the smallest possible footprint.
A 2 page overview of the entire OSD335x System-in-Package Family.
Description
The OSD335x C-SiP is a Complete System-in-Package Device. It integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, LDO, TPS65217C PMIC, 4KB of EEPROM, eMMC non-volatile Storage, a MEMS Oscillator and all the needed passives, into a 27mm x 27mm 400 Ball BGA.
Processor
Memory
Package Size
Description
The OSD335x-SM integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, LDO, TPS65217C PMIC, all the needed passives, and 4KB of EEPROM into a 21mm x 21mm 256 Ball BGA.
Processor
Memory
Package Size
First STM32MP15x System in Package
Description
The OSD3358-SM-RED is the Reference, Evaluation, Development board for the OSD335x families of System-In-Package devices. It is designed to enable quick evaluation of the OSD335x SiP, OSD335x-SM SiP and OSD335x C-SiP™. It has a number of common peripherals, sensors, and expansion connectors. All of the design documents are freely available so it can be used as a known good starting point for a new design.
Lowest Cost Integration
Description
Processor
Memory
Package Size
The OSD62 Family is the ideal choice for designers seeking to seamlessly integrate powerful processing, memory, and power management into their products — all within a compact, single-package solution that minimizes board space and accelerates development.
Most Integration
The OSD62-PM-BRK is a small open hardware flexible development platform for the OSD62x-PM SiP, the Texas Instruments AM62 based SiP. At only 4in X 1.2in (101.6mm X 30.48mm), it provides easy access to all the I/O of the AM62 through standard headers. The OSD62-PM-BRK allows developers to quickly build a proof of concept that more closely resembles their actual system without the need to build their own custom hardware.
Processor
Memory
1GB
4KB EEPROM
MEMS Oscillator
up to 16GB eMMC
Package Size
The OSD62-PM System-in-Package (SiP) integrates the Texas Instruments AM62 processor, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD62-PM offers the full functionality of the AM62 in a significantly smaller form factor, making it suitable for new, space-constrained applications.
Processor
Memory
Package Size
Description
The OSD3358-SM-RED is the Reference, Evaluation, Development board for the OSD335x families of System-In-Package devices. It is designed to enable quick evaluation of the OSD335x SiP, OSD335x-SM SiP and OSD335x C-SiP™. It has a number of common peripherals, sensors, and expansion connectors. All of the design documents are freely available so it can be used as a known good starting point for a new design.
Processor
Memory
0 to 85C
-40 to 85C
Package Size
21mm X 21mm – 437 Ball BGA
The OSDZUx family of System-in-Package devices are the quickest way to harness the performance and flexibility of the AMD Zynq UltraScale+ MPSoC architecture. Integrating the ZU MPSoC along with DDR, Power Supplies and other components removes many of the complexities found when designing with these flexible and powerful devices.
The OSDZUx devices will reduce your design time by months allowing you to get to market faster or spend more time adding features that will bring extra value to your customers.
OSDZU3 Family Overview | Version: 15.0 | March 25, 2024
A 1 page overview of the OSDZU3 System-in-Package family of devices
Most Integration
The OSDZU3-REF is the official development platform for the AMD ZU3 System in Package, the OSDZU3. It provides a host of connectors and expansion headers providing an excellent foundation to evaluate the OSDZU3 in your application. It comes with a PetaLinux distribution that features a number of demos that allow you to get up and running in no time.
The OSDZU3 integrates the AMD Zynq Ultrascale+ MPSoC ZU3, LPDDR4 memory, 2x Infineon IRPS5401 PMICs, 2x LDOs, EEPROM, QSPI Flash, 2x Oscillators, and passives into a 40mm x 20.5mm 600 Ball BGA.
Processor
AMD-Xilnx Zynq Ultrascale+ MPSoC ZU3
Memory
Up to 2GB (16Gb)
2x Infineon IRPS5401 PMICs, 2x LDOs
EEPROM, QSPI Flash
2x Oscillators
Passives
0° to 85° C
-40° to 85° C
-40° to 105° C
Package Size
40mm X 20.5mm – 600 Ball BGA
There has been multiple revisions to the OSDZU3-REF and some of the documentation is for specific revisions.
The revision of your OSDZU3-REF is printed under the fan next to the Octavo Systems logo. See the image below.
If there are multiple versions of a document make sure you select the one that matches your revision.
