It is Feb 2nd, Groundhog day. Each year I like to watch the 1993 classic Groundhog Day with Bill Murray and Andie MacDowell. In it, Murray gets stuck reliving the same day over and over again until he finally “gets it right”. The movie will make you laugh and cry. I highly recommend it.
However, this isn’t meant to be a movie review. I bring it up because I see parallels between Murray’s problem, reliving the same day over again, and a common complaint we hear from our customers. No matter how hard they try they always seem to be stuck having to redo the same design tasks over and over again! (Read More…)
Industry analysts predict billions of things will connect to the Internet by 20201. Whether it is your fitness tracker or a smart fridge, we are now able track, analyze and make healthier choices to improve our lives. We are able to make our homes more secure and energy efficient. Soon we will watch Netflix in self-driving vehicles on our way to work. Due to the potential and the ability to personalize information, the industry has pursued connecting all devices to the Internet with passion. Therefore, it is a given that your marketing department will come in asking you to update your product with IoT capabilities.
How Octavo Systems Helps Your IoT Design
Octavo Systems is leading the hardware effort to make IoT system development more accessible to everyone. Through System-in-Package (SiP) technology, it is possible to embed complex and powerful systems into tiny spaces while saving valuable time to market and cost.
How can you simplify your design process and get started on your application with lightning speed?
Have a System-In-Package (SiP) at the heart of your design.
Have the right steps, tools and techniques in your hands to get a jumpstart on a production-ready product with SiP.
Introducing Reference Design Tutorials
We have developed the OSD335x Reference Design Tutorials to cover all aspects of initial hardware design to help you create a successful product. (Read More…)
Last week at CES, Intel announced their new CPU family aimed at High End Personal Computers. Normally this would only be tangentially interesting to us. However, this news was right up our alley because Intel announced a System-in-Package (SiP) device geared toward the consumer PC industry. The new 8th generation Core Processors with Radeon RX Vega M Graphics combines the Intel Core CPU with a GPU from AMD and High Speed HBM2 Graphics memory all into a single package. (Read More…)
Getting started on a new design is an exhilarating experience. As a jumpstart, developers often grab a breadboard and prototype new features around a reference development board.
Whac-A-Mole Project using PocketBeagle
Our project this week reminds me of my days at Rice University in the Electrical and Computer Engineering (ECE) department where we practiced this skill as we rushed to complete end of semester assignments. The apps engineers at Octavo built a breadboard project, similar to those ECE lab boards, as a fun way to illustrate how easy it is to get started with our System-in-Package (SiP) devices. The project uses the new, low cost PocketBeagle® , featuring the OSD3358-512M-BSM, to build a cool retro arcade style game reminiscent of Whac-A-Mole*. We created a the hackster.io project page to walk you through the steps and demonstrate just how easy it is to get started building projects using SiP technology. (Read More…)
The Octavo Systems team wishes you and yours a joyous Holiday Season and a 2018 filled with success. We appreciate your business and look forward to helping you innovate and achieve your design goals. (Read More…)
Applications requiring machine vision and the ability to make decisions without human interference are becoming more widespread. The OSD335x System-in-Package is a perfect starting point for these types of applications. Its Texas Instruments ARM Cortex-A8 processor has the power and the peripherals required for them. The below block diagram illustrates how the OSD335x would fit into a generalized industrial control system.
Last week we headed out to San Jose to attend the Embedded Systems Conference (ESC) Silicon Valley. We met a lot of innovative startups and had very productive conversations, as well as engaged with more familiar industry names that were all looking to take advantage of System-In-Package technology. Hopefully, if you were in the area, you were able to stop by and talk to the team. If you weren’t, here’s a few highlights from the show, as well as some exciting things to come.
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