Octavo Systems is heading to Boston! We will be attending the 2017 Embedded Systems Conference on May 3rd and 4th in the Boston Convention Center. We will be there to discuss all the ways System-In-Package (SiP) Technology can help you create new and exciting products faster than ever before. We will also be showcasing a handful of different applications for the OSD3358, from simple computers to robots. If you are planning to be at the Embedded Systems Conference make sure you stop by booth 1166 to see what we can do for you. If you want to set up a meeting please contact us through our online form.
Robots are everywhere. Self-guided vacuums cruise across our floors. Manufacturing robots construct cars and appliances with speed and precision. Self–driving cars are only a few years away from commercial viability. The R2 Robonaut has been helping astronauts on the space station for years. A little closer to Earth, drones help people take stunning overhead photos and videos. Soon, drones may even deliver packages or rescue lost hikers.
Even with the explosion of robots all around us, building them can be challenging. For a robot to complete a task safely and correctly, the robot needs to interact and sense its environment and know how to react. This requires complicated mechanical, electrical, and software functions all working together with precision. With so much complexity, robot development might seem the sole province of well-funded institutions and companies.
System on a chip (SoC) technology has got us a long way, allowing for entire electronic systems to be integrated into a single microchip, and SoC technology has long been the driving force behind smaller and smaller electronic systems with higher and higher levels of performance. Like all great technologies, though, SoC technology must eventually give way to something even more innovative and effective. In an article published by Stephan Ohr on EE Times, Ohr discusses how the increasing costs of transistor scaling has made SoC technology less viable and has created a demand for a specialized design process, and we at Octavo Systems completely agree with that assessment. With current manufacturing trends demanding an efficient process to manufacture an entire electronic system at one time and at increasingly smaller sizes, SoC technology is no longer an optimal solution. Fortunately, we have a replacement–System in Package (SiP) technology. (Read More…)
I have another exciting announcement to make! We are expanding our distribution network, giving you even more ways to buy Octavo’s products. At Octavo, we are continually evaluating how best to reach our customers and give them the support they need. Today, Octavo Systems is happy to announce that Mouser has joined Digi-Key as one of our distribution partners. Partnering with these two world-class distributors ensures our customers have easy access to our devices. (Read More…)
It has been a busy couple of weeks around here lately with a lot of exciting news. First we had the announcement of the BeagleBone® Black Wireless which features the OSD3358-512M-BAS instead of the discrete TI AM3358. Then we went to World Maker Faire at the New York Hall of Science. Now we have a couple more announcements.
We are happy to let everybody know that GHI Electronics has released two development platforms for the OSD3358. Both boards utilize the OSD3358-512M-BAS which integrates the TI Sitara™ AM3358 ARM® Cortex® A8 processor running at 1GHz, 512MB of DDR3, 2 power supplies, and passives into a single IC package. The boards are available to order today from the GHI Electronics website. Their status is listed as preview. This means there are some things that haven’t been completely tested yet (all of which are outlined). It also means there could be some minor changes when the production versions are released. (Read More…)
Hey everybody. I wanted to let you know the Octavo Team will be attending World Maker Faire in New York this weekend on October 1st and 2nd. We will be roaming around Hall of Science checking out all of the incredible projects. We will also be at the BeagleBoard.org booth in Zone 3 and giving a talk on how the OSD3358 and BeagleBoard can simplify the design of embedded Linux systems. (Read More…)
Today is a very exciting day! After months of hard work, we are finally ready to make two big announcements. First, is the release of the BeagleBone® Black Wireless, which features the Octavo OSD3358-512M-BAS System-In-Package. Second, the OSD3358 is now officially BeagleBoard Compatible! These developments strengthen our relationship with BealgeBoard.org and make the OSD335x family of devices even easier to use. (Read More…)
Our CTO, Gene Frantz, published an article on Embedded Computing last week titled System-In-Package: The Next Step of Integration. In his article, he poses an interesting question: How do small, innovative companies work with larger semiconductor manufacturers to further integrate their designs? He outlined four questions that need to be answered “YES” before a large S/C manufacturer will agree to work with any company for a custom integration.
What happens, however, if you can’t answer “YES” to all of them? Are you out of luck? Is there no path to further integration? Not quite. Gene points out that there just might be a way forward with the advances made by Octavo. (Read More…)
Last week Rich Nass from Embedded Computing stopped by our Austin headquarters for their IoT road show. Our CTO, Gene Frantz, spent some time talking to him about the OSD3358 and how it helps designers get into production. Through packaging the key components of the BeagleBone Black SBC into a standard package, the OSD3358 gives designers a clear path from prototyping on the BeagleBone Black to producing their own boards around the OSD3358. Check it out!
I am excited to announce that members of the Octavo Team will be attending Maker Faire in the Bay Area on May 21st and 22nd. We will be roaming around the event center and volunteering at the BeagleBoard.org booth, booth #2434. If you are interested in meeting with us please contact us. We look forward to meeting all of the Makers out there who can use the OSD3358 to create new and innovative products!
