A New Era of Integration and Flexibility

 Faster and Smaller Designs, Simplified Supply Chain, Low Cost Manufacturing

The Octavo Systems OSD335x System-in-Package (SiP) device is the first device in the OSD335x Family.  It integrates the Texas Instruments Sitara ARM® Cortex®-A8 AM335x Processor, DDR3 memory, TPS65217C PMIC, TL5209 LDO, and all needed passive components into a single 27mm X 27mm BGA package.

Integrating the DDR3, power system, and passive devices into the single package removes the complexities of DDR3 to processor interfacing and power sequencing.  This allows for a vastly simplified final system design.

The 400 Ball BGA package is 40% smaller than the equivalent discrete design making it a great solution for space constrained applications.  The package also utilizes a 1.27mm (50 mil) ball pitch making it extremely easy to assemble.  The ball pitch also allows for the use of more relaxed Printed Circuit Board (PCB) design rules, saving PCB cost.

The OSD335x provides a quick and easy way to implement a system around the TI AM335x while also providing space savings, simplified supply chains, lower cost manufacturing, and greater reliability.

See Also: OSD335x-SM – Same functionality in a smaller package and adds EEPROM.


OSD335x Features

  • Integrated into a single BGA Package:
  • TI AM335x Features:
    • up to 1GHz
    • 8 Channel 12-bit SAR ADC
    • Ethernet 10/100/1000 x2
    • USD 2.0 HS OTG + PHY x2
    • MMC, SD and SDIO x3
    • LCD Controller
    • SGX 3D Graphics Enginer
    • PRU Subsystem
  • Access to all AM335x Peripherals
    • CAN, SPI, UART, I2C, GPIO, etc.
  • Power In: AC Adapter, USB, or Single cell (1S) Li-Ion/Li-Po Battery
  • Power Out: 1.8V, 3.3V and SYS (Switched VIN)
  • AM335x I/O Voltage: 3.3V
  • 400 Ball BGA (27mm x 27mm)
  • 20 x 20 grid, 1.27mm Pitch
  • Case Temp Range: 0° to 85°C, -40° to 85°C

OSD335x Detailed Block Diagram


Technical Documents

OSD335x Data Sheet | Version: 10.0 | August 23, 2017
OSD335x Application Guide | Version: 1.0 | August 18, 2017

Application Notes



Product Number Description Price Order From
OSD3358-512M-BAS System-In-Package -
AM3358, 512MB DDR3L, TPS65217C,
TL5209, Passives -
27mm X 27mm, 400 Ball BGA, 0°C to 85°C
Digi-Key Mouser Contact Octavo
OSD3358-512M-IND System-In-Package -
AM3358, 512MB DDR3L, TPS65217C,
TL5209, Passives -
27mm X 27mm, 400 Ball BGA, -40°C to 85°C
Digi-Key Mouser Contact Octavo

Development Tools

Development Boards

BeagleBone Black Wireless Featuring the OSD335xThe BeagleBone™ Black Wireless is one of the quickest ways to get up and running with the OSD3358.  This low cost board from BeagleBoard.org features the OSD3358-512M-BAS as well as 802.11 b/g/n and Bluetooth v4.1.  It is also compatible with all BeagleBone™ Black expansion capes.  The BeagleBone™ Black Wireless is completely open-source and is supported by the large and active BeagleBoard.org® community.



The BeagleBone® Blue is  reference platform designed by BeagleBoard.org® as a robotics platform.  It features the OSD3358-512M-BAS, 802.11 b/g/n and Bluetooth v4.1, 4 quadrature encoders, 4 DC motor drives, 8 servo outputs, as well as a 9 axis IMU and barometer.  It is a great platform to prototype robotics or motor control applications.  The BeagleBone® Blue is completely opensource and is supported by the large and active BeagleBoard.org® community.


To help make designing with the OSD335x devices easier a number of schematic symbols have been provided below.  They are for multiple schematic capture programs and multiple configurations.  Please choose the one that best suits your needs.

Octavo Symbol Library - Eagle | Version: 1.0 | September 18, 2017
Octavo Symbol Library - OrCAD | Version: 1.0 | September 18, 2017


Provided below is a copy of the DDR3 calibration program that is provided from Texas Instruments.  It has been provided here for your convenience.

DDR3 Slave Ratio Calibration Tool | Version: 1.0 | May 09, 2016

Reference Designs

OSD3358 SBC Reference Design
OSD3358 SBC Reference Design

In order to help get you started using the OSD335x we, in partnership with BeagleBoard.org, have created a reference design around the OSD3358-512M-BAS.  The reference design is a Single Board Computer that is compatible with BeagleBone Black ecosystem.  This reference design will run the BeagleBone Linux distributions and is also compatible with all capes.  If copied exactly, it will perform like a BeagleBone Black.  This is a reference design only.  The boards are not available to purchase.

Note:  This is reference design replaced the original OSD3358 SBC Reference Design that was done in Orcad.  This design represents the current best practices for designing with the OSD335x.  If you are interested in the legacy design, it can be found here.

OSD3358 SBC Reference Design Schematics (PDF) | Version: A2 | March 01, 2017
OSD3358 SBC Reference Design Eagle Files (ZIP) | Version: A2 | March 01, 2017


We plan to support this device as long as TI continues to support the AM335x device. In fact, we will most likely be able to support it longer than TI will.

One is broken into 20 sub blocks with each block showing one of the 20 columns of the OSD335x. The other is broken into 12 sub blocks, each grouping signals according to functionalities that the OSD335x provides. So, you can use which ever one fits your needs. Both are linked below.

OrCAD symbol 20 Sections

Orcad symbol 12 Sections

An Eagle Schematic library containing an Eagle CAD symbol of OSD3358 is also available for download and can be found here.

The following table shows the minimum set of signals that need to be connected to use OSD335x. It also shows internal pull up resistor values, the voltage rail they are pulled up to and the specific pad that was pulled up.

OSD335x Pad Name PAD OSD335x PAD Name PAD Pull Up Resistor Value Pull Up Voltage Pull Up on PAD
PMIC_IN_I2C_SCL C20 I2C0_SCL C16 4.7 K VDD_3V3A C20
PMIC_IN_I2C_SDA C19 I2C0_SDA C17 4.7 K VDD_3V3A C19


These power pins are driven by the TPS65217C PMIC and are used internally to power the AM335x, DDR and other components.  These pins are all connected within the SiP and do not be connected externally.  Optionally, these pins can be brought out as test points for debugging purposes only.  They should NEVER be used to power external components.

The OSD335x supports all the frequencies supported by corresponding AM335x present inside. For example, the AM3358 inside the OSD3358 supports 6 Operational Performance Points(OPP). It can run at 300MHz, 600MHz, 720MHz, 800Mhz and 1GHz. These operational performance points are set using the Digital Phase Locked Loops(DPLLs) and MPU, CORE voltages on the AM335x. The following figure from the AM335x datasheet (Table 5-7) shows the OPPs, the corresponding MPU voltage to be set and the frequency of operation of the OPP (Source: AM335x datasheet).

Nitro 1.272 V 1.325 V 1.378 V 1 GHz
Turbo 1.210 V 1.260 V 1.326 V 800 MHz
OPP120 1.152 V 1.200 V 1.248 V 720 MHz
OPP100 1.056 V 1.100 V 1.144 V 600 MHz
OPP50 0.912 V 0.950 V 0.988 V 300 MHz

The OSD335x is BeagleBoard Compatible meaning it can run any of the software provided by BeagleBoard.org. Here is a link to getting started on Beaglebone.

TI also provides Linux and TI-RTOS support for software development. Here is a link to their resources.

Yes, OSD335x runs all Linux distributions supported by TI for AM335x. It is also officially BeagleBoard Compatible so it will run the Linux distributions found on Beaglebone Black.

Pin map of OSD335x corresponds to the pin map of the ZCZ package of the AM335x.

The ball map of the OSD335x was designed to match the ball map of AM335x ZCZ package except for a few changes. The following figure highlights the changes that were made to AM335x ZCZ ball map.

Violet and Grey pins are the only pins that have been moved or functionally changed.

Blue pins (AM335x DDR interface) should be left unconnected.

Green pins (AM335x Power input pins) should be left unconnected or brought out as test points for monitoring.

Orange pins are additional pins added to the package for more functions.

Please refer to the datasheet for their functional description.

The major changes in functionality are listed below. (more…)