Octavo’s products are based on the proven process known as System-in-Package (SiP). The technologies associated with SiP have been around for over a decade and are well-established in the semiconductor industry. In fact in 2009 the International Technology Roadmap for Semiconductors established a roadmap specifically for the continued development of SiP technologies. Octavo Systems uses the proven concepts and technologies associated with SiP along with new Patent Pending methods to deliver our customers unprecedented integration and design flexibility.
A SiP, also referred to as a Multi-Chip Module (MCM), is an electronic device that looks like a single Integrated Circuit (IC). However, instead of just doing a single function, a SiP incorporates many different ICs into a single package. This one package can contain an entire electronic subsystem or even a complete system. A more detailed picture of the steps required to build and use a SiP is provided to the right.
SiPs provide many advantages. For large semiconductor manufacturers SiPs provide a way to continue to offer integrated solutions even when the multiple functions of the IC cannot be built on the same silicon die for either technological or cost reasons.
For system designers there are a host of other advantages that can be broken into a couple of categories.
Using SiPs in a design can significantly shorten the design time on a project allowing you to get to the market quicker. Here are just a few of the ways SiPs can help you get to market faster.
Using SiPs allows for a significant reduction in the number of components that are required in a design. One Octavo SiP could take the place of over 150 individual components. This reduction has a number of benefits associated with it including:
Octavo SiPs can also help your system perform better. This might not be completely obvious at first, but here are two examples of how a SiP could help your systems overall performance.
SiP technology has been around for quite a while, and there are a handful of companies that build SiPs. What makes our products at Octavo Systems different? At the most basic level it comes down to our approach. Historically, SiPs were only designed by the largest companies to solve very specific problems. This approach to SiPs have made them very costly to develop.
We set out with the goal to be able to provide this powerful technology to all customers, not just reserved for the largest. With this as our goal we innovated across a variety of areas. These patent pending innovations allow us to offer generic SiPs to a large variety of customers. They have also enabled us to significantly lower the upfront cost associated with designing custom SiPs allowing this technology to be leveraged by everybody.
Please contact us if you would like to learn more! We look forward to hearing from you!