Octavo’s products are based on the proven process known as System-in-Package (SiP).  The technologies associated with SiP have been around for over a decade and are well-established in the semiconductor industry.  In fact in 2009 the International Technology Roadmap for Semiconductors established a roadmap specifically for the continued development of SiP technologies.  Octavo Systems uses the proven concepts and technologies associated with SiP along with new Patent Pending methods to deliver our customers unprecedented integration and design flexibility.

What is a SiP?

Overview of SiP Technology

A SiP, also referred to as a Multi-Chip Module (MCM), is an electronic device that looks like a single Integrated Circuit (IC).  However, instead of just doing a single function, a SiP incorporates many different ICs into a single package.  This one package can contain an entire electronic subsystem or even a complete system.  A more detailed picture of the steps required to build and use a SiP is provided to the right.

Why use a SiP?

SiPs provide many advantages.  For large semiconductor manufacturers SiPs provide a way to continue to offer integrated solutions even when the multiple functions of the IC cannot be built on the same silicon die for either technological or cost reasons.

For system designers there are a host of other advantages that can be broken into a couple of categories.


Faster Design Cycles

Using SiPs in a design can significantly shorten the design time on a project allowing you to get to the market quicker.  Here are just a few of the ways SiPs can help you get to market faster.

  • Abstracted Complexity – Because SiPs integrate many components together into a single package all of the tedious design and layout work that would go along with that system is already taken care of.  You just use the SiP and focus your efforts on the rest of the system.
  • Subsystem Reuse – The use of SiPs encourages design reuse.  Octavo’s SiPs are designed to be general subsystem modules that can be used in a wide variety of applications.  Instead of redesigning the same subsystem for each variation of a product just use one of Octavo’s SiPs and continue on.
  • Quicker Validation – SiPs can also decrease the amount of time you spend validating your design.  You just need to focus on validating the SiP integration into your design.  All of the components that are in the SiP have already been validated to work by us giving you over 100 less things to worry about.

Simplified Bill of Materials (BoM)

Using SiPs allows for a significant reduction in the number of components that are required in a design.  One Octavo SiP could take the place of over 150 individual components.  This reduction has a number of benefits associated with it including:

  • Reduced Size – By using silicon die and manufacturing processes associated with SiPs Octavo’s devices can reduce the size of a design by over 50% when compared to the discrete implementation.
  • Simplified Supply Chain – The benefits of using Octavo SiPs continues past the design and into production.  SiPs allow you to simplify the management of your supply chain.  You now only have to manage 1 device instead of over 100 and deal with a single manufacturer instead of a half dozen.
  • Increased Reliability – Reducing the number of components in a design also helps create a more reliable product.  One of the weakest points of an electronic system is the solder joint between the IC and the PCB.  Removing components removes the number of solder joints and decreases the likelihood that one of them could fail.

Increased Performance

Octavo SiPs can also help your system perform better.  This might not be completely obvious at first, but here are two examples of how a SiP could help your systems overall performance.

  • Increased Data Rate – SiPs allow us to connect die directly together using very short bond wires and substrate traces.  By doing this we remove millimeters out of the trace lengths, reducing line capacitance and other parasitics.  This allows Octavo SiPs to actually run faster than the discrete equivalents.
  • Decreased Power Consumption – The shorter trace lengths with reduced parasitics provides a second benefit.  At the same speed Octavo SiPs will actually use less power than the discrete design.  For the absolute lowest power design an Octavo SiP is the way to go.

How is Octavo Different?

SiP technology has been around for quite a while, and there are a handful of companies that build SiPs.  What makes our products at Octavo Systems different?  At the most basic level it comes down to our approach.  Historically, SiPs were only designed by the largest companies to solve very specific problems.  This approach to SiPs have made them very costly to develop.

We set out with the goal to be able to provide this powerful technology to all customers, not just reserved for the largest.  With this as our goal we innovated across a variety of areas.  These patent pending innovations allow us to offer generic SiPs to a large variety of customers.  They have also enabled us to significantly lower the upfront cost associated with designing custom SiPs allowing this technology to be leveraged by everybody.

Please contact us if you would like to learn more!  We look forward to hearing from you!