With the exciting upsets, shoot-outs and close matches of the FIFA World Cup games this year, predicting who will win each game has been challenging. Therefore, we turned to technology and built an electronic Magic 8-Ball to help make decisions for our bracket.
Decide New Features Quickly with Rapid Prototyping
Fortunately, developers can now rapidly prototype with the OSD3358 System-in-Package (SiP) using the BeagleBoard.org® PocketBeagle®and MikroElektronika click boards™. BeagleBoard.org® is a 501c3 Foundation focused on education. PocketBeagle® is a completely open source, highly affordable super tiny single board computer featuring the OSD335x-SM SiP. One of the most exciting things about the BeagleBoard.org® PocketBeagle® is that is conforms to the standard of the MikroElektronika mikroBUS™ click boards™. This is an open standard interface for which over 400 compatible add-on boards have been created. These compact boards provide a range of added functionality and features from sensors to connectivity and storage. The OSD3358 SiP has the performance capability to process multiple sensor inputs, process information quickly and perform actions such as driving displays, motor control, or communication.
You’re busy. We get it. You ask: Do I really have time to learn about Linux? You don’t have time NOT to. 8 reasons why MCU users love switching to Linux on OSD335x :
1. Code is written while you sleep
The software libraries and device drivers for Linux are supported by a huge open-source community that stretches around the globe with thousands of passionate programmers and developers. This means that device drivers and software libraries, like OpenCV, an image processing library, or the TCP/IP stack, a complete set of networking protocols, are already available for most hardware components in your design. Even with new hardware that has just hit the market, there is a good chance that someone has already started developing or has developed the software you need. It is like having your own world-wide team of software developers.
2. A friend has started your hardware design for you
Developers can now rapidly prototype with the OSD3358 System-in-Package (SiP) using BeagleBoard.org® PocketBeagle® and MikroElektronika click boards™. This blog will describe the procedure for interfacing a new click board™ with PocketBeagle® using the OLED-C click board™ as an example. BeagleBoard.org® is a 501c3 Foundation focused on education. PocketBeagle® is a completely open source, highly affordable super tiny single board computer featuring the OSD335x-SM SiP. One of the most exciting things about the BeagleBoard.org® PocketBeagle® is that is conforms to the standard of the MikroElektronika mikroBUS™ click boards™.
There is a Hackster.io project page with the instructions for you to follow along, download the code and build your own project with this great learning platform. We’ve also added a Hackster.io project page with full instructions to build, test and add device tree overlays to BeagleBoard. org® bb.org community repository for click boards™ if you are adding a new one. (Read More…)
Embedded World (February 27, 2018) – Octavo Systems LLC (Octavo), the expert in System-In-Package (SiP) for mass-market applications, today announced the smallest system ready for Industrial applications with a temperature rating of -40°C to 85°C case. (Read More…)
Equivalent AM335x designs in SoM versus SiP solutions
When we introduce new customers to our System-In-Package (SiP) solutions they often ask how a SiP is different from a System-On-Module (SoM). Fact is, in functionality, they are very similar. The two solutions address similar design challenges and provide similar value, however, they do this in very different ways. (Read More…)
Last week at CES, Intel announced their new CPU family aimed at High End Personal Computers. Normally this would only be tangentially interesting to us. However, this news was right up our alley because Intel announced a System-in-Package (SiP) device geared toward the consumer PC industry. The new 8th generation Core Processors with Radeon RX Vega M Graphics combines the Intel Core CPU with a GPU from AMD and High Speed HBM2 Graphics memory all into a single package. (Read More…)
Applications requiring machine vision and the ability to make decisions without human interference are becoming more widespread. The OSD335x System-in-Package is a perfect starting point for these types of applications. Its Texas Instruments ARM Cortex-A8 processor has the power and the peripherals required for them. The below block diagram illustrates how the OSD335x would fit into a generalized industrial control system.
Today’s embedded designers face more challenges in terms of design complexity, cycle time and target size. System-In-Package (SiP) devices, such as the OSD335x Family, bring many advantages when designing and building an embedded system.
One significant advantage of using a SiP device is the amount of printed circuit board (PCB) space that can be saved versus using hundreds of discrete components. To understand this advantage, let us examine the amount of space required by the OSD335x devices and the discrete components that make up an equivalent system. (Read More…)
One of the key benefits delivered by System-In-Package (SiP) technology is the savings realized in the Printed Circuit Board (PCB) Assembly process. This is a benefit that is commonly overlooked by designers on the front end. Typically, they only look at the cost of the individual components on the Bill of Material (BOM) and don’t consider the cost of assembly. With System-In-Package technology, the number of components that need be placed during the assembly process can be significantly reduced. This reduction decreases the component set up time and actual time spent on the Pick and Place machine. Simultaneously driving down the assembly cost and the total cost of the finished product. (Read More…)
System on a chip (SoC) technology has got us a long way, allowing for entire electronic systems to be integrated into a single microchip, and SoC technology has long been the driving force behind smaller and smaller electronic systems with higher and higher levels of performance. Like all great technologies, though, SoC technology must eventually give way to something even more innovative and effective. In an article published by Stephan Ohr on EE Times, Ohr discusses how the increasing costs of transistor scaling has made SoC technology less viable and has created a demand for a specialized design process, and we at Octavo Systems completely agree with that assessment. With current manufacturing trends demanding an efficient process to manufacture an entire electronic system at one time and at increasingly smaller sizes, SoC technology is no longer an optimal solution. Fortunately, we have a replacement–System in Package (SiP) technology. (Read More…)
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