Austin, Texas (September 19, 2017) – Octavo Systems LLC (Octavo) announced the production release and immediate availability of its highly anticipated OSD335x-SM System-In-Package (SiP) device. The OSD335x-SM, like the entire OSD335x family, integrates the Texas Instruments (TI) Sitara™ AM335x processor with an ARM® Cortex®-A8 core running at 1GHz, DDR3 memory, a TPS65217C power management IC (PMIC), a TL5209 low-dropout (LDO) regulator, and passive components into a single wide pitch (1.27mm) BGA package. The OSD335x-SM enhances this integration by adding EEPROM as well and reducing the package size by 40%. (Read More…)
We are excited to announce that the industrial temperature rated (-40°C to 85°C Case) version of the OSD335x System-In-Package is now available! It can be ordered for immediate delivery through our distribution partners, Mouser and Digi-Key. (Read More…)
Last week was a busy one. We started off the week by announcing the newest member of the OSD335x family, the OSD335x-SM. This new device has even more integration than the OSD335x but in a package that is 40% smaller with an easy to route ball map.
As if that wasn’t enough excitement for the week, a group of us also made a trip to Boston to attend the Embedded Systems Conference. We met a lot of interesting engineers and designers that were excited to see how System-In-Package (SiP) technology could help with their designs. While we were there we showed off some applications powered by the OSD335x SiP. We also highlighted the wide range of development platforms that are available today. For those of you that couldn’t visit us in Boston, here is a recap of what we showed:
Octavo Systems Announces 40% Smaller SiP to OSD335x Family
Austin, Texas (May 2, 2017) – Octavo Systems LLC (Octavo) today announced a new addition to its popular OSD335x family of System-In-Package (SiP) devices, the OSD335x-SM. The OSD335x-SM, like the OSD335x, provides designers a platform to quickly create production-ready systems based on the Texas Instruments (TI) Sitara™ AM335x processor with an ARM® Cortex®-A8 core. However, the OSD335x-SM offers this in a package that is 40% smaller than the original OSD335x and adds new functionality. (Read More…)
Octavo Systems is heading to Boston! We will be attending the 2017 Embedded Systems Conference on May 3rd and 4th in the Boston Convention Center. We will be there to discuss all the ways System-In-Package (SiP) Technology can help you create new and exciting products faster than ever before. We will also be showcasing a handful of different applications for the OSD3358, from simple computers to robots. If you are planning to be at the Embedded Systems Conference make sure you stop by booth 1166 to see what we can do for you. If you want to set up a meeting please contact us through our online form.
I have another exciting announcement to make! We are expanding our distribution network, giving you even more ways to buy Octavo’s products. At Octavo, we are continually evaluating how best to reach our customers and give them the support they need. Today, Octavo Systems is happy to announce that Mouser has joined Digi-Key as one of our distribution partners. Partnering with these two world-class distributors ensures our customers have easy access to our devices. (Read More…)
Hey everybody. I wanted to let you know the Octavo Team will be attending World Maker Faire in New York this weekend on October 1st and 2nd. We will be roaming around Hall of Science checking out all of the incredible projects. We will also be at the BeagleBoard.org booth in Zone 3 and giving a talk on how the OSD3358 and BeagleBoard can simplify the design of embedded Linux systems. (Read More…)
Today is a very exciting day! After months of hard work, we are finally ready to make two big announcements. First, is the release of the BeagleBone® Black Wireless, which features the Octavo OSD3358-512M-BAS System-In-Package. Second, the OSD3358 is now officially BeagleBoard Compatible! These developments strengthen our relationship with BealgeBoard.org and make the OSD335x family of devices even easier to use. (Read More…)
Last week Rich Nass from Embedded Computing stopped by our Austin headquarters for their IoT road show. Our CTO, Gene Frantz, spent some time talking to him about the OSD3358 and how it helps designers get into production. Through packaging the key components of the BeagleBone Black SBC into a standard package, the OSD3358 gives designers a clear path from prototyping on the BeagleBone Black to producing their own boards around the OSD3358. Check it out!
I am excited to announce that members of the Octavo Team will be attending Maker Faire in the Bay Area on May 21st and 22nd. We will be roaming around the event center and volunteering at the BeagleBoard.org booth, booth #2434. If you are interested in meeting with us please contact us. We look forward to meeting all of the Makers out there who can use the OSD3358 to create new and innovative products!
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