OSD335x-SM

More Flexibility. Smallest Package.

The OSD335x-SM is the smallest System-In-Package (SiP) device in the OSD335x Family.  The OSD335x-SM integrates the TI Sitara™ ARM® Cortex®-A8 AM335x processor, DDR3 memory, TPS65217C PMIC, TL5209 LDO, all the needed passives, and 4KB of EEPROM into a single BGA package.  At 21mm X 21mm, it is 40% smaller than the OSD335x and 60% smaller than the equivalent discrete system.

The OSD335x-SM utilizes the same wide 1.27mm (50mil) pitch as the rest of the OSD335x family.  This combined with a new optimized Pin Map allows designers to escape all the BGA signals in a single layer.  The wide pitch also simplifies the assemble process and removes common concerns associated with manufacturing BGAs.

The OSD335x-SM also gives designers the ability to tailor the device to meet their needs.  The I/O Voltage Domains and the ADC Ranges are both programmable.  The PMIC low power modes are also made accessible as well as the PMIC voltage monitors giving the ability to more finely tune the power performance of the final design.

The OSD335x-SM is the perfect solution for the designer that is looking for the most flexible ARM-based solution in the smallest footprint.

See Also: OSD335x – Same functionality in a larger package and NO EEPROM.

OSD335x-SM Features

  • Integrated into a single BGA Package:
  • TI AM335x Features:
    • up to 1GHz
    • 8 Channel 12-bit SAR ADC
    • Ethernet 10/100/1000 x2
    • USD 2.0 HS OTG + PHY x2
    • MMC, SD and SDIO x3
    • LCD Controller
    • SGX 3D Graphics Engine
    • PRU Subsystem
  • Access to all AM335x Peripherals
    • CAN, SPI, UART, I2C, GPIO, etc.
  • Power In: AC Adapter, USB, or Single cell (1S) Li-Ion/Li-Po Battery
  • Power Out: 1.8V, 3.3V and SYS (Switched VIN)
  • Selectable AM335x I/O Voltage: 1.8V or 3.3V
  • 256 Ball BGA (21mm x 21mm)
  • 16 x 16 grid, 1.27mm Pitch
  • Case Temp Range: 0° to 85°C, -40° to 85°C

OSD335x-SM Detailed Block Diagram

 

Technical Documents

OSD335x-SM Datasheet | Version: 3.0 | November 21, 2017

Application Notes

Availability

Product Number Description Price Order From
OSD3358-512M-BSM System-In-Package -
AM3358, 512MB DDR3L, 4KB EEPROM,
TPS65217C, TL5209, Passives -
21mm X 21mm, 256 Ball BGA, 0°C to 85°C
$26.50
@1Ku
Digi-Key Mouser Contact Octavo

Development Tools

Reference Design & Development Platform

The Octavo Systems OSD3358-SM-RED platform is the official Reference, Evaluation, and Development board for the OSD335x-SM family of devices.  It was developed to allow designers to quickly evaluate the OSD335x-SM in their application.  It has many common interfaces and sensors.  It also has a pair of expansion headers that are compatible with BeagleBone® Black Capes.  This provides a platform to quickly prototype different applications.

All of the design resources and software are opensource making it an ideal known good starting point for new designs.

 

Other Development Boards

The PocketBeagle®, from BeagleBoard.org®, is a low cost, bare bones prototyping platform.  It consists of the OSD3358-512M-BSM, microSD card holder, microUSB connector, and 72 header pins.  The header pins expose many signals that can be used to construct a lager system, like GPIO, PWMs, ADC inputs, USB, and PRU I/O.  At 56mm x 35mm x 5mm, PocketBeagle® is the smallest development platform for the OSD335x-SM products.

Like all of the BeagleBoard.org products, all of the design files and software are completely opensource and available on their website.

Symbols

To make designing with Octavo Systems devices easier, a number of schematic symbol libraries have been provided below.  There are options for a variety of schematic capture and layout programs.  Please choose the one that best suits your needs.  If you would like to request a symbol for a different tool, please request it here.

Octavo Symbol Library - Eagle | Version: 2.0 | October 24, 2017
Octavo Symbol Library - OrCAD | Version: 1.0 | September 18, 2017

Software

Provided below is a copy of the DDR3 calibration program that is provided from Texas Instruments.  It has been provided here for your convenience.

DDR3 Slave Ratio Calibration Tool | Version: 1.0 | May 09, 2016

FAQs

Power consumption of OSD335x-SM depends highly on usage scenarios. The OSD335x-SM Power Application Note and the OSD335x Power Management Software Control Application Note will give you detailed information about OSD335x-SM power consumption in various operating states.

Other helpful resources are:

  1. AM335x Power Consumption Summary: This wiki page provides current and power measurements for common system application usage scenarios. However, these measurements were made for a presently unsupported version of SDK. Updated power consumption data can be found here.
  2. Power Estimation Tool: This entails modifying and submitting a spreadsheet specifying processor mode and peripheral usage of AM335x. Login to TI website is required and the results will be emailed to the email address used to login.

We plan to support these devices as long as TI continues to support the AM335x device. In fact, we will most likely be able to support them longer than TI will because of our ability to bank die.

No, you don’t. The AM335x die in the OSD335x-SM is the same as the Die in the discrete TI device.  This means that the Pin MUX will work the same on the OSD335x-SM as it would on the discrete version. There are differences in the location and position of the signals, however. Please refer to OSD335x Family Pin Assignments page for ball map differences between OSD335x-SM and AM335x.

All the peripherals supported by the AM335x are also supported by the OSD335x-SM. Please refer to the Ball Map section of the OSD335x-SM datasheet to understand naming conventions of various balls of OSD335x-SM. Also, the OSD335x Family Pin Assignments page gives you detailed information about pin mapping differences between OSD335x-SM and AM335x.

The ORCAD files for both OSD335x and OSD335x-SM devices can be found here.

 

The following table shows the minimum set of signals that need to be connected externally between the processor (AM335x) and PMIC (TPS65217C) to use the OSD335x-SM. It also shows internal pull up resistor values, the voltage rail they are pulled up to and the specific pad that was pulled up.

OSD335x-SM Pad Name PAD OSD335x-SM PAD Name PAD Pull Up Resistor Value Pull Up Voltage Pull Up on PAD
PMIC_SCL D10 I2C0_SCL C10 4.7 K VDDSHV6 C10
PMIC_SDA D11 I2C0_SDA C11 4.7 K VDDSHV6 C11
PMIC_PWR_EN N11 PMIC_POWER_EN N10 4.7 K SYS_RTC_1P8V N11
PMIC_PGOOD N12 PWRONRSTN P11 NONE N/A N/A
PMIC_LDO_PGOOD N4 RTC_PWRONRSTN N5 NONE N/A N/A
PMIC_NINT E4 EXTINTN D4 4.7 K VDDSHV6 D4
PMIC_NWAKEUP L4 EXT_WAKEUP M4 4.7 K SYS_RTC_1P8V M4

 

These power pins are driven by the TPS65217C PMIC and are used internally to power the AM335x, DDR and other components.  These pins are all connected within the SiP and should not be connected externally.  Optionally, these pins can be brought out as test points for debugging purposes only.  They should NEVER be used to power external components.

The OSD335x family supports all the frequencies supported by corresponding AM335x present inside. For example, the AM3358 inside the OSD3358 supports 6 Operational Performance Points(OPP). It can run at 300MHz, 600MHz, 720MHz, 800Mhz and 1GHz. These operational performance points are set using the Digital Phase Locked Loops(DPLLs) and MPU, CORE voltages on the AM335x. The following figure from the AM335x datasheet (Table 5-7) shows the OPPs, the corresponding MPU voltage to be set and the frequency of operation of the OPP (Source: AM335x datasheet).

VDD_MPU OPP VDD_MPU  ARM Clock Speed
MIN NOM MAX
Nitro 1.272 V 1.325 V 1.378 V 1 GHz
Turbo 1.210 V 1.260 V 1.326 V 800 MHz
OPP120 1.152 V 1.200 V 1.248 V 720 MHz
OPP100 1.056 V 1.100 V 1.144 V 600 MHz
OPP50 0.912 V 0.950 V 0.988 V 300 MHz

Yes, OSD335x family runs all Linux distributions supported by TI for AM335x. It is also officially BeagleBoard Compatible so it will run the same Linux distributions found on Beaglebone Family of products.