PocketBone: The Linux Computer that Fits in a Mini-Altoids Tin – Designed in KiCad – Featuring the OSD3358 This article
Visit Octavo Systems at the Embedded Systems Conference 2017 in Boston Octavo Systems is heading to Boston! We will be
Robots are everywhere. Self-guided vacuums cruise across our floors. Manufacturing robots construct cars and appliances with speed and precision. Self–driving
Why System in Package Technology Must Replace System on a Chip Technology System on a chip (SoC) technology has got us
Now Even More Ways to Buy Octavo’s Products I have another exciting announcement to make! We are expanding our distribution network, giving
New OSD335x-SM Reference Design Tutorials Give Engineers Full Design Instructions & Practice How can you simplify your design process and
New OSD3358 Development Platforms from GHI Electronics It has been a busy couple of weeks around here lately with a
The BeagleBone® Black Wireless and BeagleBoard Compatibility Today is a very exciting day! After months of hard work, we are
Meet Us at World Maker Faire New York 2016 Hey everybody. I wanted to let you know the Octavo Team
System-In-Package: The Next Step of Integration Our CTO, Gene Frantz, published an article on Embedded Computing last week titled System-In-Package: The
Modern PCBs are being asked to support more functionality than ever before. As embedded systems grow more capable, board-level decisions now play a central role in shaping system behavior, reliability, and scalability.
Compact industrial designs eventually reach a tipping point where board density, thermal limits, and long-term reliability collide. System-in-Package integration helps embedded teams manage complexity by relocating the most sensitive interactions off the PCB and into a pre-validated device.
Compare SiP and discrete integration beyond BOM cost. Learn where SiP reduces assembly steps, test time, and rework to accelerate embedded hardware ramps.
As embedded systems shrink, where complexity lives matters more than ever. See how System-in-Package integration simplifies DDR routing, reduces risk, and improves performance per area.
DDR pricing has nearly tripled in some cases, and availability is increasingly unpredictable. But the real cost is not the price increase. It is the validation work, board spins, and schedule risk that follow every sourcing change. This piece breaks down where DDR risk actually shows up in embedded designs, and why more teams are moving memory complexity upstream.
Most board spins are not caused by mistakes. They are caused by decisions that carry risk into hardware. Here is what a board spin actually costs and why the same teams keep experiencing them.
Most SiP vs SoC comparisons stop at definitions. The real question is how each option affects layout complexity, bring-up risk, development timelines, and your path to a working system. Here’s what the decision actually means in practice.
The hidden costs of discrete design aren’t found in the BOM alone. PCB complexity, component qualification, and supply chain risk can all impact development timelines and product stability. Explore how the OSD32MP15x System-in-Package helps simplify embedded design by integrating critical system functions into a single package.
Lean embedded teams often juggle hardware, firmware, and software responsibilities. Learn how architecture decisions and System-in-Package (SiP) designs help reduce complexity and protect engineering time.
The OSD32MP2x-PM has been shortlisted for Embedded Solution Product of the Year in the 2026 Instrumentation & Electronics Awards. Learn more about the recognition and cast your vote for Octavo Systems.
There has been multiple revisions to the OSDZU3-REF and some of the documentation is for specific revisions.
The revision of your OSDZU3-REF is printed under the fan next to the Octavo Systems logo. See the image below.
If there are multiple versions of a document make sure you select the one that matches your revision.
