PocketBone: The Linux Computer that Fits in a Mini-Altoids Tin – Designed in KiCad – Featuring the OSD3358
PocketBone: The Linux Computer that Fits in a Mini-Altoids Tin – Designed in KiCad – Featuring the OSD3358 This article
PocketBone: The Linux Computer that Fits in a Mini-Altoids Tin – Designed in KiCad – Featuring the OSD3358 This article

Visit Octavo Systems at the Embedded Systems Conference 2017 in Boston Octavo Systems is heading to Boston! We will be
Robots are everywhere. Self-guided vacuums cruise across our floors. Manufacturing robots construct cars and appliances with speed and precision. Self–driving

Why System in Package Technology Must Replace System on a Chip Technology System on a chip (SoC) technology has got us
Now Even More Ways to Buy Octavo’s Products I have another exciting announcement to make! We are expanding our distribution network, giving

New OSD335x-SM Reference Design Tutorials Give Engineers Full Design Instructions & Practice How can you simplify your design process and
New OSD3358 Development Platforms from GHI Electronics It has been a busy couple of weeks around here lately with a
The BeagleBone® Black Wireless and BeagleBoard Compatibility Today is a very exciting day! After months of hard work, we are

Meet Us at World Maker Faire New York 2016 Hey everybody. I wanted to let you know the Octavo Team
System-In-Package: The Next Step of Integration Our CTO, Gene Frantz, published an article on Embedded Computing last week titled System-In-Package: The
BeagleLogic Standalone – Featuring the OSD3358-SM This article was guest written by Kumar Abhishek about his award winning BeagleLogic project. Kumar is
Houston, We Have Forums! We have officially launched our forums! We are excited to provide a place for our community to

PocketBeagle® Featuring The OSD335x-SM PocketBeagle® is here! BeagleBoard.org® has released its newest board based on the OSD3358-512M-BSM System-In-Package (SiP). PocketBeagle® is the smallest and lowest

OSD335x-SM & OSD3358-SM-RED Dev Board NOW AVAILABLE! Austin, Texas (September 19, 2017) – Octavo Systems LLC (Octavo) announced the production
Smaller and Cheaper PCBs enabled by System-In-Package Technology. Today’s embedded designers face more challenges in terms of design complexity, cycle
Industrial Rated OSD335x Devices Are Now Available! We are excited to announce that the industrial temperature rated (-40°C to 85°C
PCB Assembly Cost Savings – Another Benefit of System-In-Package One of the key benefits delivered by System-In-Package (SiP) technology is the savings
Hand Assembly of PocketBone using the OSD3358g Text Here This article was guest written by Michael Welling, the developer of the KiCad
Robots, Games, IoT, and Tiny Computers – Example Applications from the Embedded Systems Conference in Boston Last week was a

New Smaller More Flexible OSD335x-SM System-In-Package Octavo Systems Announces 40% Smaller SiP to OSD335x Family Austin, Texas (May 2, 2017)
There has been multiple revisions to the OSDZU3-REF and some of the documentation is for specific revisions.
The revision of your OSDZU3-REF is printed under the fan next to the Octavo Systems logo. See the image below.
If there are multiple versions of a document make sure you select the one that matches your revision.