PocketBone: The Linux Computer that Fits in a Mini-Altoids Tin – Designed in KiCad – Featuring the OSD3358 This article
Visit Octavo Systems at the Embedded Systems Conference 2017 in Boston Octavo Systems is heading to Boston! We will be
Robots are everywhere. Self-guided vacuums cruise across our floors. Manufacturing robots construct cars and appliances with speed and precision. Self–driving
Why System in Package Technology Must Replace System on a Chip Technology System on a chip (SoC) technology has got us
Now Even More Ways to Buy Octavo’s Products I have another exciting announcement to make! We are expanding our distribution network, giving
New OSD335x-SM Reference Design Tutorials Give Engineers Full Design Instructions & Practice How can you simplify your design process and
New OSD3358 Development Platforms from GHI Electronics It has been a busy couple of weeks around here lately with a
The BeagleBone® Black Wireless and BeagleBoard Compatibility Today is a very exciting day! After months of hard work, we are
Meet Us at World Maker Faire New York 2016 Hey everybody. I wanted to let you know the Octavo Team
System-In-Package: The Next Step of Integration Our CTO, Gene Frantz, published an article on Embedded Computing last week titled System-In-Package: The
SiP vs SoM: What is the Difference? Equivalent AM335x designs in SoM versus SiP solutions When we introduce new customers
System-in-Package (SiP) technology isn’t just about integration, it’s a smarter way to cut costs. By consolidating core components into a single, validated package, SiPs reduce BOM complexity, shorten design cycles, and minimize supply chain risks.
Complex interfaces and layout challenges can slow a project down. SiP integration streamlines those problem areas by combining key components into one proven package.
The global chip shortage revealed a core weakness in embedded technology: systems lacked resilience. Read how the crisis reshaped design, shifting the focus from raw performance to integration and long-term stability.
Embedded hardware costs extend far beyond the BOM. Hidden engineering, manufacturing, and supply chain factors often shape the true project cost, and integrated compute solutions help reduce risk and uncertainty.
Hardware development timelines are more demanding than ever. Moving complexity off the PCB with integrated compute solutions helps teams reduce risk, simplify prototyping, and accelerate time-to-market without sacrificing reliability or features.
Embedded systems are enabling smaller, smarter devices without adding complexity. By integrating processors, memory, and power management into optimized platforms, teams can save space, simplify design, and accelerate development—all while improving reliability and performance.
Embedded development is no longer optimized for performance alone. As systems grow more complex, priorities are shifting toward predictability, time-to-market, and reducing downstream risk. This post explores how those changing tradeoffs are reshaping design decisions across the product lifecycle.
Embedded systems don’t usually fail because of a single component. Complexity builds quietly across interfaces, assumptions, and interactions, only becoming visible once real hardware comes together. By the time it surfaces, options are often limited.
Board-level optimization powered generations of embedded innovation. But as modern systems grow more capable and interconnected, the limits of that approach are becoming harder to ignore—and system-level behavior is where complexity now takes shape.
There has been multiple revisions to the OSDZU3-REF and some of the documentation is for specific revisions.
The revision of your OSDZU3-REF is printed under the fan next to the Octavo Systems logo. See the image below.
If there are multiple versions of a document make sure you select the one that matches your revision.
