Category: System-In-Package

System in Package: the Complement to Moore’s Law

Moore’s Law has served us well for over a half of a century.  It drove the semiconductor (SC) process technology roadmap.  It got us to think about putting more transistors on an integrated circuit to the point where it is no longer a nightmare to consider billions of transistors on one piece of silicon.  In fact, several years ago I began to use the phrase “transistors are becoming a buck a billion” to put a new perspective on the success of Moore’s Law.

But even with the great success the SC industry has had, we continue to find ourselves unable to accomplish the ultimate goal, a complete system on a chip.  Yes, we talk about System on Chip (SoC) technology as the solution (now what was the problem again?).  However, the advancements in IC technology have actually defeated the primary goal of SoC, the integration of a complete system on a single piece of silicon.  In the past I have actually suggested that it should be SSoC rather than SoC as all we have been able to do is a Sub-System on a Chip. (Read More…)

A Complementary Semiconductor Roadmap: System-In-Package (SiP) and the Challenges Ahead

Since the early 1960s, advances in semiconductor technology have been tracking Moore’s law. This “law”, based on a paper by Gordon Moore[i], states that the number of transistors per chip will double about every 18 months.  For decades Moore’s law has been the overarching benchmark for development in the Semiconductor industry, especially in regards to System-On-Chip (SoC) development. (Read More…)