Category: OSD335x

OSD335x-SM & OSD3358-SM-RED Dev Board NOW AVAILABLE!

 

OSD335x Family of Devices

Austin, Texas (September 19, 2017) – Octavo Systems LLC (Octavo) announced the production release and immediate availability of its highly anticipated OSD335x-SM System-In-Package (SiP) device.  The OSD335x-SM, like the entire OSD335x family, integrates the Texas Instruments (TI) Sitara™ AM335x processor with an ARM® Cortex®-A8 core running at 1GHz, DDR3 memory, a TPS65217C power management IC (PMIC), a TL5209 low-dropout (LDO) regulator, and passive components into a single wide pitch (1.27mm) BGA package.  The OSD335x-SM enhances this integration by adding EEPROM as well and reducing the package size by 40%. (Read More…)

Smaller and Cheaper PCBs enabled by System-In-Package Technology.

 

Today’s embedded designers face more challenges in terms of design complexity, cycle time and target size.  System-In-Package (SiP) devices, such as the OSD335x Family, bring many advantages when designing and building an embedded system.

One significant advantage of using a SiP device is the amount of printed circuit board (PCB) space that can be saved versus using hundreds of discrete components. To understand this advantage, let us examine the amount of space required by the OSD335x devices and the discrete components that make up an equivalent system.  (Read More…)

Industrial Rated OSD335x Devices Are Now Available!

OSD335x Industrial Rated

We are excited to announce that the industrial temperature rated (-40°C to 85°C Case) version of the OSD335x System-In-Package is now available! It can be ordered for immediate delivery through our distribution partners, Mouser and Digi-Key. (Read More…)

PCB Assembly Cost Savings – Another Benefit of System-In-Package

 

One of the key benefits delivered by System-In-Package (SiP) technology is the savings realized in the Printed Circuit Board (PCB) Assembly process.  This is a benefit that is commonly overlooked by designers on the front end.  Typically, they only look at the cost of the individual components on the Bill of Material (BOM) and don’t consider the cost of assembly.  With System-In-Package technology, the number of components that need be placed during the assembly process can be significantly reduced.  This reduction decreases the component set up time and actual time spent on the Pick and Place machine. Simultaneously driving down the assembly cost and the total cost of the finished product. (Read More…)

Hand Assembly of PocketBone using the OSD3358

This article was guest written by Michael Welling, the developer of the KiCad PocketBone Design.  Michael is an Embedded Design Engineer with over 10 years of experience.  He owns an electronic design consulting firm, QWERTY Embedded Design, LLC.  He has an MS in Electrical Engineering, was an instructor at SIUC and a 12-year member of IEEE.  He is also a mentor for Beagleboard.org Google Summer of Code.

In the previous blog, the origin story and design process of the PocketBone were discussed. This edition talks about the process of gathering components and assembling the units at home by hand.

(Read More…)

Robots, Games, IoT, and Tiny Computers – Example Applications from the Embedded Systems Conference in Boston

 

Last week was a busy one.  We started off the week by announcing the newest member of the OSD335x family, the OSD335x-SM.  This new device has even more integration than the OSD335x but in a package that is 40% smaller with an easy to route ball map.

As if that wasn’t enough excitement for the week, a group of us also made a trip to Boston to attend the Embedded Systems Conference.  We met a lot of interesting engineers and designers that were excited to see how System-In-Package (SiP) technology could help with their designs.  While we were there we showed off some applications powered by the OSD335x SiP.  We also highlighted the wide range of development platforms that are available today.  For those of you that couldn’t visit us in Boston, here is a recap of what we showed:

(Read More…)

New Smaller More Flexible OSD335x-SM System-In-Package

Octavo Systems Announces 40% Smaller SiP to OSD335x Family

OSD335x-SM on top of the OSD335xAustin, Texas (May 2, 2017) – Octavo Systems LLC (Octavo) today announced a new addition to its popular OSD335x family of System-In-Package (SiP) devices, the OSD335x-SM.  The OSD335x-SM, like the OSD335x, provides designers a platform to quickly create production-ready systems based on the Texas Instruments (TI) Sitara™ AM335x processor with an ARM® Cortex®-A8 core.  However, the OSD335x-SM offers this in a package that is 40% smaller than the original OSD335x and adds new functionality. (Read More…)

BeagleBone® Blue and OSD3358: The Fastest Way to Build Your Own Robots

 

Robots are everywhere. Self-guided vacuums cruise across our floors.  Manufacturing robots construct cars and appliances with speed and precision. Self–driving cars are only a few years away from commercial viability. The R2 Robonaut has been helping astronauts on the space station for years. A little closer to Earth, drones help people take stunning overhead photos and videos. Soon, drones may even deliver packages or rescue lost hikers.

Even with the explosion of robots all around us, building them can be challenging. For a robot to complete a task safely and correctly, the robot needs to interact and sense its environment and know how to react.  This requires complicated mechanical, electrical, and software functions all working together with precision. With so much complexity, robot development might seem the sole province of well-funded institutions and companies.

Not any longer. (Read More…)

New OSD3358 Development Platforms from GHI Electronics

 

It has been a busy couple of weeks around here lately with a lot of exciting news.  First we had the announcement of the BeagleBone® Black Wireless which features the OSD3358-512M-BAS instead of the discrete TI AM3358.  Then we went to World Maker Faire at the New York Hall of Science.  Now we have a couple more announcements.

We are happy to let everybody know that GHI Electronics has released two development platforms for the OSD3358.  Both boards utilize the OSD3358-512M-BAS which integrates the TI Sitara™ AM3358 ARM® Cortex® A8 processor running at 1GHz, 512MB of DDR3, 2 power supplies, and passives into a single IC package.  The boards are available to order today from the GHI Electronics website.  Their status is listed as preview.  This means there are some things that haven’t been completely tested yet (all of which are outlined).  It also means there could be some minor changes when the production versions are released. (Read More…)

The BeagleBone® Black Wireless and BeagleBoard Compatibility

 

Today is a very exciting day!  After months of hard work, we are finally ready to make two big announcements.  First, is the release of the BeagleBone® Black Wireless, which features the Octavo OSD3358-512M-BAS System-In-Package.  Second, the OSD3358 is now officially BeagleBoard Compatible!  These developments strengthen our relationship with BealgeBoard.org and make the OSD335x family of devices even easier to use. (Read More…)

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