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Octavo Systems Releases the OSD3358 System-In-Package Device

Octavo Systems Helps Bridge the Prototype-to-Production Gap

Austin, Texas (May 9, 2016) – Octavo Systems LLC (Octavo) today launched a new platform that makes it easier than ever for designers to quickly create production-ready systems based on the Texas Instruments (TI) Sitara™ AM335x processor with an ARM® Cortex®-A8 core. The OSD3358, the first in a family of System-In-Package (SiP) devices, is geared to help developers who are using the BeagleBone® Black single board computing (SBC) platform move from prototype to production effortlessly.

“With the wide availability and strong community around single board computing platforms like the BeagleBone® Black, it is easier than ever for designers to quickly prototype and prove out a design,” said Octavo President Bill Heye. “However, moving past the prototype stage into a production ready product remains very difficult for a large number of people and organizations.”

“After a proof of concept is done on an SBC, an application-specific mainboard will need to be designed, requiring a large number of specialized skills that can be hard to come by,” explained Gene Frantz, Octavo’s CTO. “Our System-In-Package devices reduce this requirement by abstracting some of the most tedious and complex tasks, allowing designers to focus on their end product.”

The OSD3358 is built to make the design of an application-specific mainboard around the Sitara™ AM3358 processor as easy as possible. It integrates the core of the BeagleBone® Black, the AM3358 processor running up to 1GHz, the TPS65217C power management IC (PMIC), the TL5209 low-dropout (LDO) regulator, 512MB of DDR3 memory, and over 140 passive components, into a single BGA package. Through this integration, the OSD3358 removes the complexities of power sequencing and DDR to processor interfacing that are typical in the design process.

OSD335 Size of a quarter with easy to use package
OSD3358 Size of a quarter with easy to use package

The OSD3358 has the smallest footprint of any similar AM3358 processor implementation. It simplifies the sourcing of components and supply chain management by replacing over 144 components with just one. The OSD3358 also utilizes a wide pitch BGA of 1.27mm allowing cost effective manufacturing processes to be used. “These added benefits make the OSD3358 an attractive solution not just for new designs, but also as a way to simplify or cost down an existing design,” added Heye.

 

“We are very excited that Octavo will be using the scalable Sitara™ AM335x processor as the base of the OSD335x family, giving designers both great performance and simple development,” said Adrian Valenzuela, Marketing Manager, Catalog Processors, TI. “By integrating all the major components of an AM335x-Processor-based-system into a single package, developers can quickly place a single SiP onto their boards and can still leverage all the software provided by TI to dramatically simplify their design.”

To help speed up development around the OSD3358, Octavo is also announcing the availability of the OSD3358 Development Platform from GHI Electronics featuring a capacitive touch screen and multiple industrial interfaces.

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OCTAVO is registered in the U.S. Patent and Trademark Office. OSD, C-SiP, and the Octavo Logo are trademarks of Octavo Systems LLC.