July 2019 Newsletter
The July 2019 Newsletter includes an exciting industry award announcement plus new application notes for AM335x on ethernet and industrial control as well as CubeMX software for STM32MP1.
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STM32MP1 System In Package Wins Highly Commended Electronics Industry Award
Our latest System-in-Package device built around the new STMicroelectronics STM32MP1 microprocessor has won the Highly Commended Award for Embedded Solutions at the Electronics Industry Awards.
It is crazy to think that just 3 years ago we released our first SiP built around the popular AM335x microprocessor from Texas Instruments. We have since spread the word that System-in-Package is no longer a solution reserved for the large, well-funded companies, but that any designer can take advantage of System-in-Package Technology via solutions from Octavo Systems. Now with this recognition from the Electronics Industry Awards, it appears this message is gaining traction.
STM32MP1 System-in-Package Support Update and Creation of Octavo Alpha
We have exciting updates to share about our STM32MP1 activity. Click on each to learn more:
1.STM32MP1 SiP Launch Update
2.Updates on Tech Docs
3.Request for Your Input on our Reference Design – Join Octavo Alpha Community!
4.Visit Us at the Upcoming ST Tech Tour
5. Support Forums Launched
OSD335x C-SiP Brings a Dead Bug Single Chip Computer to Life
Are you tired of spending all your time re-inventing the wheel? Unfortunately, many embedded engineers do just that; spend countless hours integrating the same core systems components over and over again. The OSD335x C-SiP allows you to break the cycle by providing an easy to use, complete system in a single package that integrates all of the core components that you need for your embedded system. Provide power, connect your peripherals, and you are ready to go. This single chip computer is so easy to use, you can now ‘dead bug’ a 1GHz Linux computer. (Read More…)
Health Monitor Design with OSD335x SiP
Having a full Linux computer, such as the OSD335x System in Package (SiP), the size of a coin enables abundant creativity when designing new IoT applications. The global health sensors market is in the billions and increasing at a rapid rate. When a market changes that quickly, designers need a flexible platform so they can spend time on the features they want to add. They also need reliable, open source hardware and software design tools. Therefore, the OSD335x-SM SiP, the smallest Texas Instruments AM335x module available, gives a solid foundation to build a health monitor.
The First STM32MP1 System-in-Package – OSD32MP15x
Embedded World, Nuremberg, Germany (February 25, 2019) – Octavo Systems today introduced the OSD32MP1, their first System-in-Package (SiP) product based on the new STM32MP1 microprocessor from STMicroelectronics. The OSD32MP1 allows users of the popular STM32 family to move to Linux without adding size or complexity to their design. Octavo has leveraged their years of experience creating tightly integrated system building blocks to develop a device that is up to 64% smaller than an equivalent system made from discrete components. At only 18mm X 18mm the OSD32MP1 is the same size as the STM32MP1 but integrates: (Read More…)
Open-Hardware Building Automation System Controller Reference Design Using AM335x Based System in Package
Some applications of IoT are still being debated. Does your refrigerator really need an operating system and be connected to the internet? Should it try to detect when you’re out of milk and automatically order more? What if there’s an error and 50 gallons shows up on your doorstep? Just like many others, I do not know the answers to all these questions. One thing I know for sure is that IoT does belong in air conditioning and the control systems of medium-to-large buildings. The OSD335x family of System-in-Package products featuring the AM335x, provides an excellent foundation for the design of an Open-Hardware Building Automation System Controller. This article introduces a series of technical application notes for building a reference design with the OSD335x-SM.
Embedded World 2019 Newsletter
The Embedded World 2019 Newsletter includes plans for the show, new technology demonstrations, win a robot, and more
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OrCAD Symbol Library Available for OSD335x C-SiP
Empowering Electronic Engineers – OrCAD and Octavo Systems’ System-in-Package share this focus. Now by adding an OrCAD symbol library for the C-SiP, we empower embedded systems design engineers with more time to add features to new applications. Download the OrCAD library from our website.
Altium Symbol Library Available for OSD335x C-SiP
Completing an embedded design in record time. Reducing the BOM to very few devices. Giving a designer time to add more features to the application. Sound like your wish list? C-SiP is the answer.
The goal of our System-in-Package technology is to create modular building blocks that abstract away tedious, repetitive, and complex tasks that designers are forced to spend time on, but don’t really add value to the end system so that they can create better, more innovate products. At Octavo Systems, we designed a completely integrated 1GHz Arm® Cortex®-A8 computing platform, the OSD335x C-SiP™. The OSD335x C-SiP (Complete System-In-Package) integrates the required components for a computing system into a single IC package.
Today we took another step in making designing with the C-SiP easier by adding an Altium symbol library for you to download from our website.