Surprisingly the hardest part of creating a new product is taking a working prototype and ramping into production. It is more complex than the architecture of the system, the hardware and software design, creating a working prototype, or taking the system through certification/qualification. The reason is simple; production requires discipline, logistics, and manufacturing at large volumes, where simple mistakes can be very expensive.
Smoothly ramping a new product into production is always the goal but seldom the reality. While it may be convenient to start thinking about production once the prototype is working, this will lead to many headaches. Successfully ramping into production starts its journey very early in the process. That means it requires paying attention to the details all the way through the process, starting with the system architecture. One thing we have learned by taking many products into production:
“Just because you can build 1 doesn’t mean you can build 10. Just because you can build 10 doesn’t mean you can build 100. And this continues with each order of magnitude.”
This paper discusses some of the insights an aids that we at Octavo have learned over the years to help you minimize the issues as you design and ramp your product into production.
The Heating, Ventilation and Air Conditioning (HVAC) market is expected to reach over $130B in the next five years. Driven by the rise in construction globally, plus refurbishment of homes and businesses, the demand to put in new units is increasing rapidly. Smarter equipment with more sensors, higher efficiency, reliability and ease of maintenance are priorities for new designs. As with most rapidly growing electronics markets, the need for fast turnaround of embedded systems designs while maintaining cost controls and increasing features is critical to a strong go to market strategy. Increasingly these systems also need be configured and controlled based on information being received in real time. In order to keep up with the rapid rate at which technology is transforming the HVAC industry, design engineers need a flexible platform on which they can spend time developing the features that make their application unique and efficient, and not have to channel valuable resources into tedious complexities such as power management and DDR routing. They also need reliable, open source hardware and software design tools. The OSD335x-SM System in Package based on the TI AM335x, is the perfect solution as it provides engineers the solid foundation that they need. With the availability of low cost development tools, such as PocketBeagle® from BeagleBoard.org®, rapid prototyping HVAC features is easy. (Read More…)
Whether you use OrCAD, Eagle or Altium, we’ve just released a library containing our OSD32MP1 , the STM32MP1 System in Package device. Download all of the OSD32MP1 SiP, STM32MP1 Schematic Symbol and STM32MP1 Footprint files in one place.
You might have seen the OSD32MP1 System in Package (SiP) built around the new STM32MP1 microprocessor from ST Micro and wondered, “Why should I care? I’ve been using microcontrollers for years- I’m an expert at programming bare metal, a regular register ninja.” In this article, I will paint a picture of why even the simplest of microcontroller applications can benefit from the Octavo STM32MP1 System in Package.
The July 2019 Newsletter includes an exciting industry award announcement plus new application notes for AM335x on ethernet and industrial control as well as CubeMX software for STM32MP1. (Read More…)
It is crazy to think that just 3 years ago we released our first SiP built around the popular AM335x microprocessor from Texas Instruments. We have since spread the word that System-in-Package is no longer a solution reserved for the large, well-funded companies, but that any designer can take advantage of System-in-Package Technology via solutions from Octavo Systems. Now with this recognition from the Electronics Industry Awards, it appears this message is gaining traction.
Are you tired of spending all your time re-inventing the wheel? Unfortunately, many embedded engineers do just that; spend countless hours integrating the same core systems components over and over again. The OSD335x C-SiP allows you to break the cycle by providing an easy to use, complete system in a single package that integrates all of the core components that you need for your embedded system. Provide power, connect your peripherals, and you are ready to go. This single chip computer is so easy to use, you can now ‘dead bug’ a 1GHz Linux computer. (Read More…)
Having a full Linux computer, such as the OSD335x System in Package (SiP), the size of a coin enables abundant creativity when designing new IoT applications. The global health sensors market is in the billions and increasing at a rapid rate. When a market changes that quickly, designers need a flexible platform so they can spend time on the features they want to add. They also need reliable, open source hardware and software design tools. Therefore, the OSD335x-SM SiP, the smallest Texas Instruments AM335x module available, gives a solid foundation to build a health monitor.
Embedded World, Nuremberg, Germany (February 25, 2019) – Octavo Systems today introduced the OSD32MP1, their first System-in-Package (SiP) product based on the new STM32MP1 microprocessor from STMicroelectronics. The OSD32MP1 allows users of the popular STM32 family to move to Linux without adding size or complexity to their design. Octavo has leveraged their years of experience creating tightly integrated system building blocks to develop a device that is up to 64% smaller than an equivalent system made from discrete components. At only 18mm X 18mm the OSD32MP1 is the same size as the STM32MP1 but integrates: (Read More…)
