OSD32MP1-RED Now Available – March 2021 Newsletter

The OSD32MP1-RED full Featured Development Platform is AVAILABLE NOW from Digi-KeyArrow, and Mouser.  Quickly prototype your design on the OSD32MP1 System-in-Package, leveraging some of the most common peripherals (WiFiBluetoothCameraEthernetCANDisplay, etc.), plenty of options for expansion, and support for both Debian Linux and OpenSTLinux.

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SiP Technology: A solution to a passive problem

 

It is always interesting when a new integration concept like System in Package (SiP) technology gives opportunity to innovate beyond the obvious. One of those opportunities which has no effect on system designers or component designers but is unique to a SiP designer is the handling of the bulk and bypass capacitors.

But before we get to the topic of capacitor reduction, let me take a moment to remind all of us of some of those new integration concepts:

  • Point to Point wiring (PtP): this concept is still being used in guitar amplifiers. Figure 1 will remind you of the concept.
  • Printed Circuit boards (PCB). Once components could be attached to a PCB, PtP began to take a back seat. Note Figure 1 also has a PCB included.
  • Integrated circuits with the ultimate being a System on Chip (SoC)
  • System in Package (SiP)
An example of point to point wiring courtesy of Wikipedia.
Figure 1. An example of point to point wiring courtesy of Wikipedia.

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Resolved to Save Time and Money? System-in-Package Can Provide the Path.

The new year is a time for resolutions, not only for ourselves but also our projects. Some of the most popular revolve around TIME or MONEY.  The good news is using an Octavo Systems System-in-Package Device will make sure these are resolutions you can keep. (Read More…)

‘Tis the Season and We Have Something Special for You! – December 2020 Newsletter

’tis the Season for More MP1 and IoT! OSD32MP1-RED available for Pre-order, App Notes to get you started on your IoT projects, and more variations of the MP1.

Resources to Get Your Project on Track – Nov 2020 Newsletter

2020 has been a trying year.  We know some of your projects might not be where you were hoping they would be.  Well here are some resources that can get your project back on track.

Join Octavo Systems at the virtual ST Developer Conference

Tuesday, October 20 – Wednesday, October 21, 2020

This FREE two-day interactive virtual summit will bring together experts in markets that are poised for rapid growth in the coming years: Smart Things for the IoT, Smart Driving, and Smart Home, City & Industry.
Click here to register for the conference

Octavo Systems is hosting an exhibition booth as well as providing an on-demand technical session.

Visit Octavo's Booth

Chat with our applications and account management engineers in both US and European time zones who will host open discussions as well as one to one chat throughout the full two days.

ST32MP1 based system in package at ST Dev Con

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Sept 2020 Newsletter – FREE OSD32MP1-BRK & MP1 Webinar

Join our joint webinar with ST Microelectronics to learn how the MP1 and System-in-Package can get you into production faster.  Also register to win 1 of 5 OSD32MP1-BRK flexible development platforms at the end of the webinar.

August 2020 Newsletter: Get to Market Faster with System-in-Package and Open Source Designs

 

Leveraging a proven reference design to start your project is a great way to reduce risk and get to market faster. Pair that with the many advantages delivered by our System-in-Package devices and you have the fastest most reliable path to a production ready design. Here are a few of the most popular reference designs that can help you create your next project.

July 2020 Newsletter

Five Years in the Making

Octavo Systems 5 Years Delivering SiP Solution

Introduction

Octavo Systems recently celebrated our fifth year in business! It has been an amazing time for us as we have utilized the concepts surrounding system-in-package (SiP) technology. It is moments like these that make it fun to look back on what has happened and also look forward to the next five years.

Octavo had its inception when three former Texas Instruments employees (Bill Heye, Masood Murtuza and myself – Gene Frantz) began to discuss where the semiconductor industry was going and how we could participate in its movement. Octavo came to life in 2015 when we teamed up with Green Source Holding LLC and several engineer colleagues of ours. The name “Octavo” references the 15th century technology that made early printing available to the broader public by miniaturizing and reducing the cost of books. In that same vein, Octavo’s vision is to change the rules of electronics design and manufacturing so advanced technology is available to everyone by reducing the size and cost of integrated systems. (Read More…)

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