For electronic systems design, efficiency, innovation, and integration are key. Electronic design engineers constantly seek solutions that offer robust performance, are cost-effective, and streamline the design process. This is where understanding different semiconductor packaging technologies – System-in-Package (SiP), Package-on-Package (PoP), System-on-Chip (SoC), and System-on-Module (SoM) – becomes crucial.
Artificial intelligence (AI) once seemed like a figment of science fiction, but as technology has evolved, many new and exciting applications have arisen. From national security to finance, healthcare, and beyond, AI has the capacity to improve the quality and quantity of data analytics and reduce costs. As the ubiquity of AI technology continues to grow, we see it moving closer to the edge, requiring specialized hardware to ensure that AI-enabled devices can operate and process data efficiently.
What is AI at the Edge?
AI at the edge relies on edge computing – a distributed network of computing devices that exist near the source of data, rather than in a data center. This includes Internet of Things (IoT) devices that could be sensors and smart devices that reside within a home, business, or other location. Because the Internet is a global network, the edge could exist anywhere.
Compared to AI algorithms that run inside of a data center, edge AI can offer a number of important benefits that include:
Reduced latency since data is processed locally.
Increased data security since data is processed at the edge and only results are transmitted , reducing the risk of a breach or interception.
Improved reliability since the AI can run even if connection to a data center goes down.
Real-time insights since data is processed locally instead of in a distant data center.
Octavo Systems, a leader in providing highly integrated System-in-Package technology solutions, is excited to announce the production release of the powerful OSDZU3 System-in-Package (SiP) and the OSDZU3-REF, an open-source development and evaluation platform. Both products are available for order through our distribution partner, Avnet.
Nuremberg, Germany (March 14, 2023) – Expanding on its history of delivering highly integrated System-in-Package (SiP) devices, Octavo Systems announced its OSD62x family of SiPs that help expand the performance of edge and small form factor embedded processing into next generation applications. The OSD62x family is based on the Texas Instruments (TI) AM623 and AM625 processors. The OSD62x enables small-size human-machine interface (HMI) applications for building automation, industrial control, IoT gateways, artificial intelligence (AI) at the edge, as well as many other low-power systems demanding high performance Linux processing. Delivering the smallest AM62x module form factor, the OSD62x SiP family integrates high-speed memory, power management, passive components, and much more into a single BGA package.
“The OSD62x is a powerful example of our commitment to deliver ‘Innovation through Integration.’ We are excited to offer our customers a TI AM62x-based solution that reduces solution sizes by 60% and enables designs to get to market up to 9 months faster,” said Harley Walsh, President at Octavo Systems. (Read More…)
Houston, Texas, United States (March 1, 2023) – Octavo Systems LLC, a leading provider of System-in-Package (SiP) solutions, has officially released its latest offering, the OSDZU3-REF Development Platform. This platform gives system designers a comprehensive development environment for evaluating, testing, and starting product development using the OSDZU3 System-in-Package (SiP).
Built around the AMD-Xilinx ZU3 Zynq UltraScale+ MPSoC, the OSDZU3 SiP integrates LPDDR4, a Flexible Power System, EEPROM, Oscillators, and hundreds of passive components into a compact 20.5mm x 40mm BGA.
The OSDZU3-REF platform features standard peripherals such as 1Gb Ethernet, USB-C, Display Port, and SATA, and provides expandability through PMOD headers, Mikroe Click™, standard 100Mil headers, and an FMC LPC Connector. It also features an Onboard µUSB JTAG debugger, a µUSB UART connection and access to both SYSMON and PMBUS through standard 100mil connectors.
Octavo Systems leveraged the integration provided by the OSDZU3 SiP to create the OSDZU3-REF using just four PCB layers with low-cost design rules. “The OSDZU3-REF highlights the benefits of using an Octavo SiP to simplify and reduce the cost of your system, “says Erik Welsh, CTO of Octavo Systems. “Without the OSDZU3 SiP, this reference platform would need 8 to 12 layers with much more complex design rules to support the AMD-Xilinx MPSoC, the power system, and the LPDDR4.” (Read More…)
Houston, Texas, United States (March 24, 2022) – Octavo Systems, the leader in mass market System-in-Package (SiP) solutions, today announced a new family of SiP devices based on the AMD Xilinx® Zynq® UltraScale+™ MPSoC Architecture. The OSDZU3, based on the ZU3, provides the benefits of System-in-Package while delivering the performance and flexibility expected from the Zynq UltraScale+ architecture. (Read More…)
When most of us think of Artificial Intelligence (AI) we think of large server farms doing complex calculations. In this paradigm for a product to leverage AI it would need to connect and send data to these servers to do their AI magic and then return the answer to the device, similar to Alexa. However, with the continued advancements in performance along with the reduction of size and power of processors, like the OSD32MP1 System-in-Package (SiP) featuring the STM32MP1, it is possible to run AI algorithms right on the local product, at the Edge.
The MPCAM from Siana Systems is an example of just such a platform. Featuring the OSD32MP1 SiP it is a platform that does Computer Vision (CV) at the edge. (Read More…)
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