Houston, Texas, United States (March 1, 2023) – Octavo Systems LLC, a leading provider of System-in-Package (SiP) solutions, has officially released its latest offering, the OSDZU3-REF Development Platform. This platform gives system designers a comprehensive development environment for evaluating, testing, and starting product development using the OSDZU3 System-in-Package (SiP).
Built around the AMD-Xilinx ZU3 Zynq UltraScale+ MPSoC, the OSDZU3 SiP integrates LPDDR4, a Flexible Power System, EEPROM, Oscillators, and hundreds of passive components into a compact 20.5mm x 40mm BGA.
The OSDZU3-REF platform features standard peripherals such as 1Gb Ethernet, USB-C, Display Port, and SATA, and provides expandability through PMOD headers, Mikroe Click™, standard 100Mil headers, and an FMC LPC Connector. It also features an Onboard µUSB JTAG debugger, a µUSB UART connection and access to both SYSMON and PMBUS through standard 100mil connectors.
Octavo Systems leveraged the integration provided by the OSDZU3 SiP to create the OSDZU3-REF using just four PCB layers with low-cost design rules. “The OSDZU3-REF highlights the benefits of using an Octavo SiP to simplify and reduce the cost of your system, “says Erik Welsh, CTO of Octavo Systems. “Without the OSDZU3 SiP, this reference platform would need 8 to 12 layers with much more complex design rules to support the AMD-Xilinx MPSoC, the power system, and the LPDDR4.” (Read More…)
Houston, Texas, United States (March 24, 2022) – Octavo Systems, the leader in mass market System-in-Package (SiP) solutions, today announced a new family of SiP devices based on the AMD Xilinx® Zynq® UltraScale+™ MPSoC Architecture. The OSDZU3, based on the ZU3, provides the benefits of System-in-Package while delivering the performance and flexibility expected from the Zynq UltraScale+ architecture. (Read More…)
When most of us think of Artificial Intelligence (AI) we think of large server farms doing complex calculations. In this paradigm for a product to leverage AI it would need to connect and send data to these servers to do their AI magic and then return the answer to the device, similar to Alexa. However, with the continued advancements in performance along with the reduction of size and power of processors, like the OSD32MP1 System-in-Package (SiP) featuring the STM32MP1, it is possible to run AI algorithms right on the local product, at the Edge.
The MPCAM from Siana Systems is an example of just such a platform. Featuring the OSD32MP1 SiP it is a platform that does Computer Vision (CV) at the edge. (Read More…)
You know what they say… “Time is Money”. Using Octavo Systems System-in-Package (SiP) can reduce your design time by a YEAR, allowing you to save money on develop and generate more revenue by getting to market that much sooner.
As processor based products become more pervasive in the industry, it seems that the time required to get a new product to market is lengthening. A major time period of getting the product to market is during the product development stage. Over my career I have seen the product development process taking from 12 months to 2 or more years. Our direction at Octavo has been to help you reduce your development time to production ramp by using system in package (SiP) technology. (Read More…)
The OSD32MP1-RED full Featured Development Platform is AVAILABLE NOW from Digi-Key, Arrow, and Mouser. Quickly prototype your design on the OSD32MP1 System-in-Package, leveraging some of the most common peripherals (WiFi, Bluetooth, Camera, Ethernet, CAN, Display, etc.), plenty of options for expansion, and support for both Debian Linux and OpenSTLinux.
It is always interesting when a new integration concept like System in Package (SiP) technology gives opportunity to innovate beyond the obvious. One of those opportunities which has no effect on system designers or component designers but is unique to a SiP designer is the handling of the bulk and bypass capacitors.
But before we get to the topic of capacitor reduction, let me take a moment to remind all of us of some of those new integration concepts:
Point to Point wiring (PtP): this concept is still being used in guitar amplifiers. Figure 1 will remind you of the concept.
Printed Circuit boards (PCB). Once components could be attached to a PCB, PtP began to take a back seat. Note Figure 1 also has a PCB included.
Integrated circuits with the ultimate being a System on Chip (SoC)
The new year is a time for resolutions, not only for ourselves but also our projects. Some of the most popular revolve around TIME or MONEY. The good news is using an Octavo Systems System-in-Package Device will make sure these are resolutions you can keep. (Read More…)
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Built around the AMD-Xilinx ZU3 Zynq UltraScale+ MPSoC, the OSDZU3 SiP integrates LPDDR4, a Flexible Power System, EEPROM, Oscillators, and hundreds of passive components into a compact 20.5mm x 40mm BGA.
