We’re thrilled to announce the release of our comprehensive hands-on training course, “Getting Started with Embedded Linux“! Whether you’re an embedded systems beginner or a seasoned developer looking to expand your skillset, this free training provides everything you need to start building real-world embedded Linux applications.
What happens when you combine passionate musicians, innovative technology, and the right development tools? Sometimes, you get to witness the birth of something revolutionary.
Today we’re excited to share an inspiring customer success story that demonstrates how System-in-Package (SiP) technology is enabling the next generation of musical innovation. Our new case study follows the journey of Chaos Audio, a Florida-based startup that transformed from a student’s creative idea into a disruptive force in the guitar effects industry.
In the world of embedded systems, the Linux operating system has become a popular choice due to its flexibility, robustness, and open-source nature. One of the key components that enables Linux to work seamlessly with various hardware configurations is the device tree. Device trees provide a way to describe the hardware components of an embedded system, allowing the Linux kernel to dynamically configure itself to work with the specific hardware present on a given board.
Today’s electronics engineers face unprecedented challenges: shrinking development timelines, resource constraints, and increasingly complex design requirements. In our latest white paper, “The Best Things in Small SiPs: Accelerating Time to Market at Lower Costs,” we explore how System-in-Package (SiP) technology is helping companies overcome these challenges while reducing costs and accelerating innovation.
Nuremberg, Germany — April 9, 2024 — Octavo Systems, a leader in system integration technology, proudly announces the launch of its OSD32MP2 family, featuring two innovative System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM. Designed to leverage the advanced capabilities of the new STM32MP25 processor from STMicroelectronics, this family is set to transform electronics design by significantly reducing complexity, size, and total cost of ownership. (Read More…)
The security of embedded systems stands as a crucial yet often overlooked aspect. As technology propels forward, these systems become increasingly central to our everyday lives, powering everything from smartphones to critical infrastructure.
However, with this technological integration comes a heightened vulnerability to physical attack vectors. The need to protect these systems from such threats has never been more pressing. As designers and engineers, understanding and mitigating these risks is not just a challenge but a requirement.
This article aims to shine a light on the various physical attack vectors threatening embedded systems and explore how advancements in System-in-Package (SiP) technology are revolutionizing our approach to securing these vital components of the modern technological landscape.
In the rapidly evolving landscape of technology, embedded systems have become the backbone of modern electronic devices, ranging from simple household appliances to complex industrial machines. As these devices become more interconnected, the importance of security in embedded systems cannot be overstated. For professionals involved in electronic product design, ensuring the security of these systems is paramount.
The quest for more efficient, compact, and high-performing devices has led to significant technological innovations. Among these, heterogeneous integration (HI) and System-in-Package (SiP) technology stand out as pivotal advancements. These methodologies redefine electronic systems design and open up possibilities for design engineers. Let’s clarify the concepts of HI and SiP, demonstrating their significance and advantages in the context of contemporary electronic design and development.
For electronic systems design, efficiency, innovation, and integration are key. Electronic design engineers constantly seek solutions that offer robust performance, are cost-effective, and streamline the design process. This is where understanding different semiconductor packaging technologies – System-in-Package (SiP), Package-on-Package (PoP), System-on-Chip (SoC), and System-on-Module (SoM) – becomes crucial.
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