OSD32MP2 Family
Overview
Products
| Product | OSD32MP2x | OSD32MP2x-PM | |
|---|---|---|---|
 | |||
| Description | The OSD32MP2x System-in-Package (SiP) integrates the STMicroelectronics STM32MP2 processor with DDR4 memory, STPMIC2 PMIC, EEPROM, Oscillators and passives into a compact 21mm x 21mm BGA package. This integration removes tedious tasks from your design process allowing you to focus on areas that will add value to your STM32MP2 based design. | The OSD32MP2x-PM System-in-Package (SiP) integrates the ST Microelectronics STM32MP2 processor, DDR4 memory, and essential passive components into a compact 9mm x 14mm BGA package. This design simplifies the processor-to-DDR interface, reducing development complexity and time. The OSD32MP2x-PM offers the full functionality of the STM32MP2 in a significantly smaller form factor, making it suitable for new, space-constrained applications. | |
| Processor | STMicroelectronics STM32MP25x | STMicroelectronics STM32MP25x | |
| Memory | Starting at 1GB DDR4 | Starting at 1GB DDR4 | |
| Additional Integration | - STMicroelectronics STM32MP2 processor - DDR4 memory - STPMIC2 PMIC - EEPROM - Oscillators - Passives | - Passives | |
| Temperature Range | 0° to 85° C -40° to 85° C | 0° to 85° C -40° to 85° C | |
| Package Size | 21mm X 21mm - 437 Ball BGA | 9mm X 14mm - 500 Ball BGA | |
The Quickest and Most Cost-effective way to develop with the STM32MP2 | STM32MP2 + DDR4 in a Small Flexible Package | ||
| Details | View Details | View Details |
