We are thrilled to announce our participation in Embedded World 2025, taking place on March 11, 12, and 13 in Nuremberg, Germany. As the leading event for embedded systems designers, this show is the perfect opportunity to explore how cutting-edge technology like System-in-Package can help you deliver next-generation products faster and connect with industry experts.
Discover the Latest in System-in-Package Technology
At Octavo Systems, we are excited to showcase our advancements in System-in-Package (SiP) technology in Stand 3-160. We will be highlighting:
Customer Demos: See how our technology is driving innovation with live demonstrations of a modular robotics platform from Olive Robotics and a real-time audio processing guitar effects pedal from Chaos Audio.
Introducing the OSD62-PM: We will have live demos that allow you to experience the power of our newest SiP product, built around the Texas Instruments AM62 processor. With up to 2 GB of DDR4 integrated into a package no larger than a standalone DDR chip, the OSD62-PM is a game-changer for embedded designs, enabling smaller formfactors, faster design cycles, at the same price as chip down solutions.
Exciting Giveaway Announcement Coming Soon
As if seeing the latest in SiP technology weren’t enough, we’re hosting a special giveaway! Stay tuned for details on how you can participate and win a fantastic prize. Be sure to sign up for our newsletter to be the first to hear about the giveaway and other exclusive updates.
Plan Your Visit
Come by our Stand (3-160) at Embedded World 2025 to:
Learn how our SiP solutions can accelerate your development and reduce your system’s footprint.
Connect with our team of experts to discuss your design challenges and discover how Octavo Systems can help you achieve your goals.
In the world of embedded systems, the Linux operating system has become a popular choice due to its flexibility, robustness, and open-source nature. One of the key components that enables Linux to work seamlessly with various hardware configurations is the device tree. Device trees provide a way to describe the hardware components of an embedded system, allowing the Linux kernel to dynamically configure itself to work with the specific hardware present on a given board.
Nuremberg, Germany — April 9, 2024 — Octavo Systems, a leader in system integration technology, proudly announces the launch of its OSD32MP2 family, featuring two innovative System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM. Designed to leverage the advanced capabilities of the new STM32MP25 processor from STMicroelectronics, this family is set to transform electronics design by significantly reducing complexity, size, and total cost of ownership. (Read More…)
The security of embedded systems stands as a crucial yet often overlooked aspect. As technology propels forward, these systems become increasingly central to our everyday lives, powering everything from smartphones to critical infrastructure.
However, with this technological integration comes a heightened vulnerability to physical attack vectors. The need to protect these systems from such threats has never been more pressing. As designers and engineers, understanding and mitigating these risks is not just a challenge but a requirement.
This article aims to shine a light on the various physical attack vectors threatening embedded systems and explore how advancements in System-in-Package (SiP) technology are revolutionizing our approach to securing these vital components of the modern technological landscape.
In the rapidly evolving landscape of technology, embedded systems have become the backbone of modern electronic devices, ranging from simple household appliances to complex industrial machines. As these devices become more interconnected, the importance of security in embedded systems cannot be overstated. For professionals involved in electronic product design, ensuring the security of these systems is paramount.
The quest for more efficient, compact, and high-performing devices has led to significant technological innovations. Among these, heterogeneous integration (HI) and System-in-Package (SiP) technology stand out as pivotal advancements. These methodologies redefine electronic systems design and open up possibilities for design engineers. Let’s clarify the concepts of HI and SiP, demonstrating their significance and advantages in the context of contemporary electronic design and development.
For electronic systems design, efficiency, innovation, and integration are key. Electronic design engineers constantly seek solutions that offer robust performance, are cost-effective, and streamline the design process. This is where understanding different semiconductor packaging technologies – System-in-Package (SiP), Package-on-Package (PoP), System-on-Chip (SoC), and System-on-Module (SoM) – becomes crucial.
Artificial intelligence (AI) once seemed like a figment of science fiction, but as technology has evolved, many new and exciting applications have arisen. From national security to finance, healthcare, and beyond, AI has the capacity to improve the quality and quantity of data analytics and reduce costs. As the ubiquity of AI technology continues to grow, we see it moving closer to the edge, requiring specialized hardware to ensure that AI-enabled devices can operate and process data efficiently.
What is AI at the Edge?
AI at the edge relies on edge computing – a distributed network of computing devices that exist near the source of data, rather than in a data center. This includes Internet of Things (IoT) devices that could be sensors and smart devices that reside within a home, business, or other location. Because the Internet is a global network, the edge could exist anywhere.
Compared to AI algorithms that run inside of a data center, edge AI can offer a number of important benefits that include:
Reduced latency since data is processed locally.
Increased data security since data is processed at the edge and only results are transmitted , reducing the risk of a breach or interception.
Improved reliability since the AI can run even if connection to a data center goes down.
Real-time insights since data is processed locally instead of in a distant data center.
Octavo Systems, a leader in providing highly integrated System-in-Package technology solutions, is excited to announce the production release of the powerful OSDZU3 System-in-Package (SiP) and the OSDZU3-REF, an open-source development and evaluation platform. Both products are available for order through our distribution partner, Avnet.
To provide the best experiences, we use technologies like cookies to store and/or access device information. Consenting to these technologies will allow us to process data such as browsing behavior or unique IDs on this site. Not consenting or withdrawing consent, may adversely affect certain features and functions.
Functional Always active
The technical storage or access is strictly necessary for the legitimate purpose of enabling the use of a specific service explicitly requested by the subscriber or user, or for the sole purpose of carrying out the transmission of a communication over an electronic communications network.
Preferences
The technical storage or access is necessary for the legitimate purpose of storing preferences that are not requested by the subscriber or user.
Statistics
The technical storage or access that is used exclusively for statistical purposes.The technical storage or access that is used exclusively for anonymous statistical purposes. Without a subpoena, voluntary compliance on the part of your Internet Service Provider, or additional records from a third party, information stored or retrieved for this purpose alone cannot usually be used to identify you.
Marketing
The technical storage or access is required to create user profiles to send advertising, or to track the user on a website or across several websites for similar marketing purposes.
Introducing the OSD62-PM: We will have live demos that allow you to experience the power of our newest SiP product, built around the Texas Instruments AM62 processor. With up to 2 GB of DDR4 integrated into a package no larger than a standalone DDR chip, the OSD62-PM is a game-changer for embedded designs, enabling smaller formfactors, faster design cycles, at the same price as chip down solutions.