Octavo Systems @ Embedded World

After a four-year hiatus, we’re thrilled to announce our return to Embedded World, the leading international fair for embedded systems, happening April 9-11 in Germany. Visit us at Booth 5-424 to discover the latest innovations in System-in-Package technology and enter our Raffle. Whether you’re a long-time partner or new to the world of embedded solutions, we can’t wait to reconnect and showcase the power and versatility of our products.

Discover how our customers are leveraging System-in-Package (SiP) technology to innovate and solve real-world problems. From enhancing robotics to transforming music production, improving connectivity, and advancing safety, we will be showing demos that highlight the versatility and power of SiP in action.  Learn more about some of the demo below.

Olive Owl Kit

The Olive Owl Kit, developed by Olive Robotics, aims to democratize robotics education by offering an intuitive and comprehensive platform for students, educators, and hobbyists to explore advanced robotics concepts. This kit simplifies learning about robotics perception, control, and programming through user-friendly components and by leveraging the Robot Operating System (ROS), making sophisticated robotics technology accessible and enjoyable.  A pivotal piece allowing Olive to achieve their goal is the integration of the OSD32MP1 System-in-Package (SiP). By blending Linux’s versatility and power with precise real-time processing, the OSD32MP1 SiP enables the Owl Kit’s compact and efficient design. This significantly enhances the kit’s usability and performance, ensuring Olive Robotics can provide a potent and accessible robotics education tool that caters to a wide audience’s needs.

Stratus

Stratus by Chaos Audio represents a breakthrough in music technology, offering a versatile multi-effects guitar pedal that caters to musicians’ evolving needs. At the heart of the Stratus is the OSD3358-SM System-in-Package (SiP). The OSD3358-SM not only enabled Chaos Audio to implement real-time processing of complex audio signals, ensuring seamless effect transitions and high-quality sound output, but it also significantly accelerated the product’s development time. By consolidating multiple functions into a single SiP, the OSD3358-SM reduced the design complexity and shortened the path from concept to market readiness. This strategic integration has allowed Chaos Audio to deliver an unparalleled audio experience, making Stratus a must-have for musicians seeking to expand their creative palette without compromise.

Come jam with us at stand 5-424, or visit Chaos Audio’s website to learn more.

CELIA-E

The CELIA-E by BiPOM Electronics redefines system connectivity, offering a ruggedized embedded Linux platform that effortlessly adds cellular or other wireless interfaces to existing setups. With it’s USB and Ethernet connections it easily enables systems to achieve cloud connectivity. BiPOM’s firmware transforms CELIA-E into a Modbus master device, ideal for upgrading installed systems with cloud communication capabilities. The CELIA-E’s takes advantage of the benefits of the OSD32MP1 System-in-Package (SiP) from Octavo Systems, which ensures a compact form factor while providing the dual-core Linux system and real-time M4 MCU needed for robust performance. This SiP advantage significantly accelerated development, reducing time to market and empowering BiPOM to enhance existing industrial systems with a powerful, efficient connectivity solution.

Book some time to see how the CELIA-E can add new life to your existing equipment at Stand 5-424 or visit BiPOM for more information.

ADAS

The Advanced Driver-Assistance Systems (ADAS) demo by Octavo Systems exemplifies the integration of high-performance applications into small, innovative form factors, utilizing the OSDZU3-REF platform. This demonstration vividly showcases the OSDZU3 System-in-Package (SiP)’s capability to process real-time video feeds for vehicle detection and alerting, a critical function in enhancing driver safety and situational awareness. The OSDZU3, with its compact design and powerful processing and FPGA capabilities, stands at the core of this demonstration, proving that size is no barrier to performance in the realm of ADAS technologies. The ADAS demo not only highlights the technical excellence achievable with the OSDZU3 but also illustrates Octavo Systems’ commitment to pushing the boundaries of what small form factor platforms can accomplish in high-performance size constrained applications.

Book some time to see how the OSDZU3 can bring big performance in a small package to your next design at our Stand 5-424.

Did somebody say a Raffle? Swing by our booth (5-424) or book a meeting with us and enter into our end-of-show raffle! What’s the prize, you ask? Well I will tell you.  This year we will have a drawing for one lucky visitor to win the Hogwarts Castle Lego Set!

Just stop by our booth (5-424) or register for a meeting below to be entered to win!

We are excited to see you at the show.  Please fill out the meeting request for below and somebody will be in touch to schedule a discussion at our Stand 5-424.