Escape the Struggles of Layout with OSD335x C-SiP

Here at Octavo Systems, we pride ourselves in making our devices easy to use.  This extends to reducing the challenges that designers have in laying out a new printed circuit board (PCB).  Our System-in-Package devices by their very nature will reduce a bill of materials (BOM) from over one hundred discreet devices to only one.  This saves enormous amounts of layout time and effort purely from a component placement and routing point of view.  However, Octavo Systems goes to the next level in simplifying your design layout.

Ball-grid Array (BGA) packages can be difficult to route during layout.  Routing out, or escaping, the signals on the inner balls of a BGA can be difficult and can add many layers to the PCB.  However, the ball maps of our System-in-Package devices are specifically designed from a system integration point of view. By moving all signal pins to the outer three rows and columns, with the 1.27mm (50 mil) ball pitch, it allows all signals to be escaped in one PCB layer with very standard 0.15mm (6 mil) trace / space routing rules.  Then we designed the power inputs and outputs to be easy to use by grouping the ball together such that it is easy to use copper pours to connect them together.  Similarly all control signals between the processor and power management IC (PMIC) are pinned out next to each other for easy connections.  This not only reduces design complexity but makes laying out the BGA much easier which saves engineering time and money.

C-SiP Takes Integration to the Next Level

The OSD335x C-SiP takes this to the next level.  Traditionally, eMMC has posed routing challenges.  Either you have to use small, expensive trace / space routing rules to route the eMMC BGA or you have to carefully route larger traces through the mechanical (i.e. non-electrical) BGA balls.  We have developed app notes (link to eMMC app note) to help with this, but with the OSD335x C-SiP, you no longer have to worry about eMMC routing since the eMMC has been integrated within the SiP device.  Similarly, routing oscillators can be tricky given all of the EMI (electro-magnetic interference) concerns of today’s devices.  By integrating the 24MHz oscillator, the OSD335x C-SiP takes additional complexity off the table.

As you get started with your PCB layout, please consult our layout guides for either the OSD335x-SM and OSD335x C-SiP.

Please contact us for support to make your design experience as easy as possible with the OSD335x Family of devices.

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