We are thrilled to announce our participation in Embedded World 2025, taking place on March 11, 12, and 13 in Nuremberg, Germany. As the leading event for embedded systems designers, this show is the perfect opportunity to explore how cutting-edge technology like System-in-Package can help you deliver next-generation products faster and connect with industry experts.
Discover the Latest in System-in-Package Technology
At Octavo Systems, we are excited to showcase our advancements in System-in-Package (SiP) technology in Stand 3-160. We will be highlighting:
Customer Demos: See how our technology is driving innovation with live demonstrations of a modular robotics platform from Olive Robotics and a real-time audio processing guitar effects pedal from Chaos Audio.
Introducing the OSD62-PM: We will have live demos that allow you to experience the power of our newest SiP product, built around the Texas Instruments AM62 processor. With up to 2 GB of DDR4 integrated into a package no larger than a standalone DDR chip, the OSD62-PM is a game-changer for embedded designs, enabling smaller formfactors, faster design cycles, at the same price as chip down solutions.
Exciting Giveaway Announcement Coming Soon
As if seeing the latest in SiP technology weren’t enough, we’re hosting a special giveaway! Stay tuned for details on how you can participate and win a fantastic prize. Be sure to sign up for our newsletter to be the first to hear about the giveaway and other exclusive updates.
Plan Your Visit
Come by our Stand (3-160) at Embedded World 2025 to:
Learn how our SiP solutions can accelerate your development and reduce your system’s footprint.
Connect with our team of experts to discuss your design challenges and discover how Octavo Systems can help you achieve your goals.
The quest for more efficient, compact, and high-performing devices has led to significant technological innovations. Among these, heterogeneous integration (HI) and System-in-Package (SiP) technology stand out as pivotal advancements. These methodologies redefine electronic systems design and open up possibilities for design engineers. Let’s clarify the concepts of HI and SiP, demonstrating their significance and advantages in the context of contemporary electronic design and development.
For electronic systems design, efficiency, innovation, and integration are key. Electronic design engineers constantly seek solutions that offer robust performance, are cost-effective, and streamline the design process. This is where understanding different semiconductor packaging technologies – System-in-Package (SiP), Package-on-Package (PoP), System-on-Chip (SoC), and System-on-Module (SoM) – becomes crucial.
Houston, Texas, United States (March 24, 2022) – Octavo Systems, the leader in mass market System-in-Package (SiP) solutions, today announced a new family of SiP devices based on the AMD Xilinx® Zynq® UltraScale+™ MPSoC Architecture. The OSDZU3, based on the ZU3, provides the benefits of System-in-Package while delivering the performance and flexibility expected from the Zynq UltraScale+ architecture. (Read More…)
When most of us think of Artificial Intelligence (AI) we think of large server farms doing complex calculations. In this paradigm for a product to leverage AI it would need to connect and send data to these servers to do their AI magic and then return the answer to the device, similar to Alexa. However, with the continued advancements in performance along with the reduction of size and power of processors, like the OSD32MP1 System-in-Package (SiP) featuring the STM32MP1, it is possible to run AI algorithms right on the local product, at the Edge.
The MPCAM from Siana Systems is an example of just such a platform. Featuring the OSD32MP1 SiP it is a platform that does Computer Vision (CV) at the edge. (Read More…)
You know what they say… “Time is Money”. Using Octavo Systems System-in-Package (SiP) can reduce your design time by a YEAR, allowing you to save money on develop and generate more revenue by getting to market that much sooner.
The new year is a time for resolutions, not only for ourselves but also our projects. Some of the most popular revolve around TIME or MONEY. The good news is using an Octavo Systems System-in-Package Device will make sure these are resolutions you can keep. (Read More…)
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Introducing the OSD62-PM: We will have live demos that allow you to experience the power of our newest SiP product, built around the Texas Instruments AM62 processor. With up to 2 GB of DDR4 integrated into a package no larger than a standalone DDR chip, the OSD62-PM is a game-changer for embedded designs, enabling smaller formfactors, faster design cycles, at the same price as chip down solutions.