In today’s fast-paced tech landscape, speed, efficiency, and innovation are more crucial than ever. Whether you’re building a wearable health monitor, an industrial sensor, or a smart home device, the complexity of modern electronics can be a major hurdle. That’s where Octavo Systems steps in—reshaping how engineers design and deliver embedded systems through powerful, compact System-in-Package (SiP) technology.
Who is Octavo Systems?
Founded in 2013 by a team of semiconductor veterans from Texas Instruments, Octavo Systems is a Texas-based company with a mission to simplify electronic design. They do this by creating SiPs that bundle key components—like processors, memory, power management, and passive components—into a single integrated package.
The result? Products that are smaller, easier to design, and faster to get to market.
Embedded World is just over 2 Weeks away! If you’re like us, you’re busy putting together a plan to navigate the world’s largest trade show dedicated to embedded systems. Having attended for several years, we’ve gathered some key insights to help you make the most of your time at the show.
We are thrilled to announce our participation in Embedded World 2025, taking place on March 11, 12, and 13 in Nuremberg, Germany. As the leading event for embedded systems designers, this show is the perfect opportunity to explore how cutting-edge technology like System-in-Package can help you deliver next-generation products faster and connect with industry experts.
Discover the Latest in System-in-Package Technology(Read More…)
The Consumer Electronics Show (CES) is always a whirlwind of innovation, hype, and surprises. After decades in the semiconductor industry and a lifelong technology geek, I’ve developed a sense for identifying both the trends with staying power and those that might just be clever marketing spins. This year, CES didn’t disappoint, and I want to share my takeaways on a few themes that stuck with me—AI and robotics– and spotlight on one of our customers, Fasetto, Inc. (Read More…)
The quest for more efficient, compact, and high-performing devices has led to significant technological innovations. Among these, heterogeneous integration (HI) and System-in-Package (SiP) technology stand out as pivotal advancements. These methodologies redefine electronic systems design and open up possibilities for design engineers. Let’s clarify the concepts of HI and SiP, demonstrating their significance and advantages in the context of contemporary electronic design and development.
For electronic systems design, efficiency, innovation, and integration are key. Electronic design engineers constantly seek solutions that offer robust performance, are cost-effective, and streamline the design process. This is where understanding different semiconductor packaging technologies – System-in-Package (SiP), Package-on-Package (PoP), System-on-Chip (SoC), and System-on-Module (SoM) – becomes crucial.
Houston, Texas, United States (March 24, 2022) – Octavo Systems, the leader in mass market System-in-Package (SiP) solutions, today announced a new family of SiP devices based on the AMD Xilinx® Zynq® UltraScale+™ MPSoC Architecture. The OSDZU3, based on the ZU3, provides the benefits of System-in-Package while delivering the performance and flexibility expected from the Zynq UltraScale+ architecture. (Read More…)
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