Welcome to the inaugural edition of Embedded Insights, where we explore how System-in-Package (SiP) technology is accelerating product development across industries. In this issue, we’re spotlighting real-world applications, an inspiring audio demo, and a fresh perspective on why SiP is quickly becoming the gold standard in modern hardware design.
From Concept to Creation: Embedded World 2025
What happens when you replace traditional, time-consuming embedded development with SiP-based design? You get results—fast. Our Embedded World 2025 videogives you an inside look at how Octavo’s SiP modules have helped engineers take their ideas from sketch to prototype in just months. The tour showcases real products and the scalable simplicity that SiP brings to modern design.
Revolutionizing Audio Hardware: The Stratus Guitar Pedal
Chaos Audio’s Stratus pedal is a great example of performance and elegance powered by SiP. Using the OSD3358-SM module, the team accelerated development and streamlined their hardware design. The result? A compact, powerful guitar effects processor that handles real-time audio with precision. Watch the Stratus pedal demoto see SiP in action.
New Blog: Why SiP is the Future of Embedded Systems
In our latest blog, we break down the rising momentum behind SiP technology. From faster development cycles to simplified integration, SiP is unlocking a new era of innovation—especially as AI, IoT, and compact edge devices demand more functionality in less space.
Ready to Cut Development Time by 66%? With Octavo’s SiP modules, you can streamline design, reduce risk, and bring products to market faster. Imagine going from 18 months to 6. Let us help you get there.
The pace of innovation in embedded electronics is staggering—but so are the challenges. As devices get smaller and more capable, the complexity of traditional PCB design is becoming a bottleneck. That’s where System-in-Package (SiP) technology comes in—and Octavo Systems is leading the charge.
In this post, we’ll break down why SiP is rapidly becoming the go-to approach for modern embedded systems and how Octavo Systems is helping shape the future of electronics design.
In today’s fast-paced tech landscape, speed, efficiency, and innovation are more crucial than ever. Whether you’re building a wearable health monitor, an industrial sensor, or a smart home device, the complexity of modern electronics can be a major hurdle. That’s where Octavo Systems steps in—reshaping how engineers design and deliver embedded systems through powerful, compact System-in-Package (SiP) technology.
Who is Octavo Systems?
Founded in 2013 by a team of semiconductor veterans from Texas Instruments, Octavo Systems is a Texas-based company with a mission to simplify electronic design. They do this by creating SiPs that bundle key components—like processors, memory, power management, and passive components—into a single integrated package.
The result? Products that are smaller, easier to design, and faster to get to market.
Embedded World is just over 2 Weeks away! If you’re like us, you’re busy putting together a plan to navigate the world’s largest trade show dedicated to embedded systems. Having attended for several years, we’ve gathered some key insights to help you make the most of your time at the show.
We are thrilled to announce our participation in Embedded World 2025, taking place on March 11, 12, and 13 in Nuremberg, Germany. As the leading event for embedded systems designers, this show is the perfect opportunity to explore how cutting-edge technology like System-in-Package can help you deliver next-generation products faster and connect with industry experts.
Discover the Latest in System-in-Package Technology(Read More…)
The Consumer Electronics Show (CES) is always a whirlwind of innovation, hype, and surprises. After decades in the semiconductor industry and a lifelong technology geek, I’ve developed a sense for identifying both the trends with staying power and those that might just be clever marketing spins. This year, CES didn’t disappoint, and I want to share my takeaways on a few themes that stuck with me—AI and robotics– and spotlight on one of our customers, Fasetto, Inc. (Read More…)
The quest for more efficient, compact, and high-performing devices has led to significant technological innovations. Among these, heterogeneous integration (HI) and System-in-Package (SiP) technology stand out as pivotal advancements. These methodologies redefine electronic systems design and open up possibilities for design engineers. Let’s clarify the concepts of HI and SiP, demonstrating their significance and advantages in the context of contemporary electronic design and development.
For electronic systems design, efficiency, innovation, and integration are key. Electronic design engineers constantly seek solutions that offer robust performance, are cost-effective, and streamline the design process. This is where understanding different semiconductor packaging technologies – System-in-Package (SiP), Package-on-Package (PoP), System-on-Chip (SoC), and System-on-Module (SoM) – becomes crucial.
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