Category: Uncategorized

Heterogeneous Integration (HI) and System-in-Package (SiP) Technology: A Comprehensive Overview

The quest for more efficient, compact, and high-performing devices has led to significant technological innovations. Among these, heterogeneous integration (HI) and System-in-Package (SiP) technology stand out as pivotal advancements. These methodologies redefine electronic systems design and open up possibilities for design engineers. Let’s clarify the concepts of HI and SiP, demonstrating their significance and advantages in the context of contemporary electronic design and development.

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Understanding The Differences Between System-on-Chip (SoC), Package-on-Package (PoP), System-on-Module (SoM), and System-in-Package (SiP)

For electronic systems design, efficiency, innovation, and integration are key. Electronic design engineers constantly seek solutions that offer robust performance, are cost-effective, and streamline the design process. This is where understanding different semiconductor packaging technologies – System-in-Package (SiP), Package-on-Package (PoP), System-on-Chip (SoC), and System-on-Module (SoM) – becomes crucial. 

Octavo Systems: SiP the Future of Edge AI – 2023 Highlights & 2024 Preview

Chill Out with a Cool Dev Board – Summer 2022 Newsletter

It’s the heart of the summer and too hot to go outside, so why not stay in and work on a new project with the OSD32MP1-BRK.

Octavo Systems Announces AMD-Xilinx Zynq UltraScale+ MPSoC System-in-Package

Houston, Texas, United States (March 24, 2022) – Octavo Systems, the leader in mass market System-in-Package (SiP) solutions, today announced a new family of SiP devices based on the AMD Xilinx® Zynq® UltraScale+™ MPSoC Architecture. The OSDZU3, based on the ZU3, provides the benefits of System-in-Package while delivering the performance and flexibility expected from the Zynq UltraScale+ architecture. (Read More…)

Jump Start Your Next Design – 1Q22 Newsletter

Free Training, Development Boards, and Software.  All here to help you get moving on your next design!

OSD32MP1 Powers AI at the Edge – MPCAM

When most of us think of Artificial Intelligence (AI) we think of large server farms doing complex calculations.  In this paradigm for a product to leverage AI it would need to connect and send data to these servers to do their AI magic and then return the answer to the device, similar to Alexa.  However, with the continued advancements in performance along with the reduction of size and power of processors, like the OSD32MP1 System-in-Package (SiP) featuring the STM32MP1, it is possible to run AI algorithms right on the local product, at the Edge.

The MPCAM from Siana Systems is an example of just such a platform.  Featuring the OSD32MP1 SiP it is a platform that does Computer Vision (CV) at the edge. (Read More…)

Save Time and Money with System-in-Package – May 2021 Newsletter

You know what they say… “Time is Money”.  Using Octavo Systems System-in-Package (SiP) can reduce your design time by a YEAR, allowing you to save money on develop and generate more revenue by getting to market  that much sooner.

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Resolved to Save Time and Money? System-in-Package Can Provide the Path.

The new year is a time for resolutions, not only for ourselves but also our projects. Some of the most popular revolve around TIME or MONEY.  The good news is using an Octavo Systems System-in-Package Device will make sure these are resolutions you can keep. (Read More…)

Resources to Get Your Project on Track – Nov 2020 Newsletter

2020 has been a trying year.  We know some of your projects might not be where you were hoping they would be.  Well here are some resources that can get your project back on track.