Category: News

Octavo Systems Releases the OSD3358 System-In-Package Device

Octavo Systems Helps Bridge the Prototype-to-Production Gap

Austin, Texas (May 9, 2016) – Octavo Systems LLC (Octavo) today launched a new platform that makes it easier than ever for designers to quickly create production-ready systems based on the Texas Instruments (TI) Sitara™ AM335x processor with an ARM® Cortex®-A8 core. The OSD3358, the first in a family of System-In-Package (SiP) devices, is geared to help developers who are using the BeagleBone® Black single board computing (SBC) platform move from prototype to production effortlessly. (Read More…)

Welcome to Octavo Systems

Welcome to Octavo Systems!  We are so glad you are here!

We are a small company with a big dream, to bring System-In-Package (SiP) technology to the masses.  We believe the only way for Moore’s law to continue is to have wide spread adoption of SiPs.  Today SiPs are typically only available to the largest electronics companies.  We want to change that.  Our technology and products are geared to meet the needs of any size company.  We know that providing this technology to such a wide group of innovators will spur the creation of new and exciting products that couldn’t have been built before. (Read More…)

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