The Embedded World Conference in Nuremberg, Germany last week provided an opportunity for the Octavo Systems team to engage with dynamic and innovative companies from around the globe. In its 16th year, this leading exhibition for the international embedded community hosted over 32,000 engineers from 78 countries. With more than 2,000 sessions, the technical engagement level was at an all time high.
Embedded World (February 27, 2018) – Octavo Systems LLC (Octavo), the expert in System-In-Package (SiP) for mass-market applications, today announced the smallest system ready for Industrial applications with a temperature rating of -40°C to 85°C case. (Read More…)
How can you simplify your design process and get started on your application with lightning speed?
We have developed the OSD335x Reference Design Tutorials to cover all aspects of initial hardware design to help you create a successful product. (Read More…)
Last week at CES, Intel announced their new CPU family aimed at High End Personal Computers. Normally this would only be tangentially interesting to us. However, this news was right up our alley because Intel announced a System-in-Package (SiP) device geared toward the consumer PC industry. The new 8th generation Core Processors with Radeon RX Vega M Graphics combines the Intel Core CPU with a GPU from AMD and High Speed HBM2 Graphics memory all into a single package. (Read More…)
Getting started on a new design is an exhilarating experience. As a jumpstart, developers often grab a breadboard and prototype new features around a reference development board.
Our project this week reminds me of my days at Rice University in the Electrical and Computer Engineering (ECE) department where we practiced this skill as we rushed to complete end of semester assignments. The apps engineers at Octavo built a breadboard project, similar to those ECE lab boards, as a fun way to illustrate how easy it is to get started with our System-in-Package (SiP) devices. The project uses the new, low cost PocketBeagle® , featuring the OSD3358-512M-BSM, to build a cool retro arcade style game reminiscent of Whac-A-Mole*. We created a the hackster.io project page to walk you through the steps and demonstrate just how easy it is to get started building projects using SiP technology. (Read More…)
As 2017 becomes a memory, I reflect on what we accomplished and look forward with anticipation to an exciting 2018. Join us on the roadmap to MORE.
The Octavo Systems team wishes you and yours a joyous Holiday Season and a 2018 filled with success.
We appreciate your business and look forward to helping you innovate and achieve your design goals. (Read More…)
Last week we headed out to San Jose to attend the Embedded Systems Conference (ESC) Silicon Valley. We met a lot of innovative startups and had very productive conversations, as well as engaged with more familiar industry names that were all looking to take advantage of System-In-Package technology. Hopefully, if you were in the area, you were able to stop by and talk to the team. If you weren’t, here’s a few highlights from the show, as well as some exciting things to come.
We have officially launched our forums! We are excited to provide a place for our community to ask questions, get answers, and exchange ideas. Our team has been looking for better ways to engage more directly with our customers. We believe these forums will provide a platform for that. (Read More…)
