Last week at CES, Intel announced their new CPU family aimed at High End Personal Computers. Normally this would only be tangentially interesting to us. However, this news was right up our alley because Intel announced a System-in-Package (SiP) device geared toward the consumer PC industry. The new 8th generation Core Processors with Radeon RX Vega M Graphics combines the Intel Core CPU with a GPU from AMD and High Speed HBM2 Graphics memory all into a single package. (Read More…)
Getting started on a new design is an exhilarating experience. As a jumpstart, developers often grab a breadboard and prototype new features around a reference development board.
Whac-A-Mole Project using PocketBeagle
Our project this week reminds me of my days at Rice University in the Electrical and Computer Engineering (ECE) department where we practiced this skill as we rushed to complete end of semester assignments. The apps engineers at Octavo built a breadboard project, similar to those ECE lab boards, as a fun way to illustrate how easy it is to get started with our System-in-Package (SiP) devices. The project uses the new, low cost PocketBeagle® , featuring the OSD3358-512M-BSM, to build a cool retro arcade style game reminiscent of Whac-A-Mole*. We created a the hackster.io project page to walk you through the steps and demonstrate just how easy it is to get started building projects using SiP technology. (Read More…)
The Octavo Systems team wishes you and yours a joyous Holiday Season and a 2018 filled with success. We appreciate your business and look forward to helping you innovate and achieve your design goals. (Read More…)
Last week we headed out to San Jose to attend the Embedded Systems Conference (ESC) Silicon Valley. We met a lot of innovative startups and had very productive conversations, as well as engaged with more familiar industry names that were all looking to take advantage of System-In-Package technology. Hopefully, if you were in the area, you were able to stop by and talk to the team. If you weren’t, here’s a few highlights from the show, as well as some exciting things to come.
We have officially launched our forums! We are excited to provide a place for our community to ask questions, get answers, and exchange ideas. Our team has been looking for better ways to engage more directly with our customers. We believe these forums will provide a platform for that. (Read More…)
Austin, Texas (September 19, 2017) – Octavo Systems LLC (Octavo) announced the production release and immediate availability of its highly anticipated OSD335x-SM System-In-Package (SiP) device. The OSD335x-SM, like the entire OSD335x family, integrates the Texas Instruments (TI) Sitara™ AM335x processor with an ARM® Cortex®-A8 core running at 1GHz, DDR3 memory, a TPS65217C power management IC (PMIC), a TL5209 low-dropout (LDO) regulator, and passive components into a single wide pitch (1.27mm) BGA package. The OSD335x-SM enhances this integration by adding EEPROM as well and reducing the package size by 40%. (Read More…)
We are excited to announce that the industrial temperature rated (-40°C to 85°C Case) version of the OSD335x System-In-Package is now available! It can be ordered for immediate delivery through our distribution partners, Mouser and Digi-Key. (Read More…)
Last week was a busy one. We started off the week by announcing the newest member of the OSD335x family, the OSD335x-SM. This new device has even more integration than the OSD335x but in a package that is 40% smaller with an easy to route ball map.
As if that wasn’t enough excitement for the week, a group of us also made a trip to Boston to attend the Embedded Systems Conference. We met a lot of interesting engineers and designers that were excited to see how System-In-Package (SiP) technology could help with their designs. While we were there we showed off some applications powered by the OSD335x SiP. We also highlighted the wide range of development platforms that are available today. For those of you that couldn’t visit us in Boston, here is a recap of what we showed:
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