On January 21, 2025, the announcement of Stargate AI infrastructure was made with much fanfare. There are numerous possible applications—such as healthcare, finance, education, developing new materials, and complex problem solving.
AI will have the ability to access huge amounts of research from institutions worldwide, assimilate it, and apply it to problems at hand. The value of solutions depends on a particular AI’s intrinsic ability to absorb and analyze knowledge and apply it to specific situations. However, there is one more factor that will impact the value of an AI solution: problem-specific, real-time information unique to that situation.
We are excited to announce the availability of the Preliminary Datasheet for the OSD62-PM System-in-Package (SiP). This marks an important step in the journey of bringing the OSD62-PM to market and enabling engineers to leverage it in their designs.
The OSD62-PM
The OSD62-PM System-in-Package integrates the AM62 from Texas Instruments along with up to 2GB of DDR4 Memory and passives in a package that is only 9mm x 14mm (the size of the DDR itself). This design simplifies the development process, reduces system size, and accelerates time to market.
Whether you’re developing industrial solutions, consumer electronics, or IoT devices, the OSD62-PM is designed to make your system integration easier. (Read More…)
As we step into 2025, there’s a lot to be excited about in the semiconductor world. After a challenging period of slowdown, things are starting to pick up, and innovation is happening at every level. Here’s a look at where the industry is heading and what Octavo Systems has in store for the year ahead.
Nuremberg, Germany — April 9, 2024 — Octavo Systems, a leader in system integration technology, proudly announces the launch of its OSD32MP2 family, featuring two innovative System-in-Package (SiP) modules: the OSD32MP2 and OSD32MP2-PM. Designed to leverage the advanced capabilities of the new STM32MP25 processor from STMicroelectronics, this family is set to transform electronics design by significantly reducing complexity, size, and total cost of ownership. (Read More…)
Octavo Systems, a leader in providing highly integrated System-in-Package technology solutions, is excited to announce the production release of the powerful OSDZU3 System-in-Package (SiP) and the OSDZU3-REF, an open-source development and evaluation platform. Both products are available for order through our distribution partner, Avnet.
Nuremberg, Germany (March 14, 2023) – Expanding on its history of delivering highly integrated System-in-Package (SiP) devices, Octavo Systems announced its OSD62x family of SiPs that help expand the performance of edge and small form factor embedded processing into next generation applications. The OSD62x family is based on the Texas Instruments (TI) AM623 and AM625 processors. The OSD62x enables small-size human-machine interface (HMI) applications for building automation, industrial control, IoT gateways, artificial intelligence (AI) at the edge, as well as many other low-power systems demanding high performance Linux processing. Delivering the smallest AM62x module form factor, the OSD62x SiP family integrates high-speed memory, power management, passive components, and much more into a single BGA package.
“The OSD62x is a powerful example of our commitment to deliver ‘Innovation through Integration.’ We are excited to offer our customers a TI AM62x-based solution that reduces solution sizes by 60% and enables designs to get to market up to 9 months faster,” said Harley Walsh, President at Octavo Systems. (Read More…)
Houston, Texas, United States (March 1, 2023) – Octavo Systems LLC, a leading provider of System-in-Package (SiP) solutions, has officially released its latest offering, the OSDZU3-REF Development Platform. This platform gives system designers a comprehensive development environment for evaluating, testing, and starting product development using the OSDZU3 System-in-Package (SiP).
Built around the AMD-Xilinx ZU3 Zynq UltraScale+ MPSoC, the OSDZU3 SiP integrates LPDDR4, a Flexible Power System, EEPROM, Oscillators, and hundreds of passive components into a compact 20.5mm x 40mm BGA.
The OSDZU3-REF platform features standard peripherals such as 1Gb Ethernet, USB-C, Display Port, and SATA, and provides expandability through PMOD headers, Mikroe Click™, standard 100Mil headers, and an FMC LPC Connector. It also features an Onboard µUSB JTAG debugger, a µUSB UART connection and access to both SYSMON and PMBUS through standard 100mil connectors.
Octavo Systems leveraged the integration provided by the OSDZU3 SiP to create the OSDZU3-REF using just four PCB layers with low-cost design rules. “The OSDZU3-REF highlights the benefits of using an Octavo SiP to simplify and reduce the cost of your system, “says Erik Welsh, CTO of Octavo Systems. “Without the OSDZU3 SiP, this reference platform would need 8 to 12 layers with much more complex design rules to support the AMD-Xilinx MPSoC, the power system, and the LPDDR4.” (Read More…)
The OSD32MP1-RED full Featured Development Platform is AVAILABLE NOW from Digi-Key, Arrow, and Mouser. Quickly prototype your design on the OSD32MP1 System-in-Package, leveraging some of the most common peripherals (WiFi, Bluetooth, Camera, Ethernet, CAN, Display, etc.), plenty of options for expansion, and support for both Debian Linux and OpenSTLinux.
The new year is a time for resolutions, not only for ourselves but also our projects. Some of the most popular revolve around TIME or MONEY. The good news is using an Octavo Systems System-in-Package Device will make sure these are resolutions you can keep. (Read More…)
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