The pace of innovation in embedded electronics is staggering—but so are the challenges. As devices get smaller and more capable, the complexity of traditional PCB design is becoming a bottleneck. That’s where System-in-Package (SiP) technology comes in—and Octavo Systems is leading the charge.
In this post, we’ll break down why SiP is rapidly becoming the go-to approach for modern embedded systems and how Octavo Systems is helping shape the future of electronics design.
Traditionally, embedded systems relied on Printed Circuit Boards (PCBs) with dozens—if not hundreds—of discrete components. Engineers had to carefully place memory chips, processors, power regulators, and passives while managing complex signal integrity and layout requirements.
Then came System-on-Chip (SoC) technology, which integrated more functionality into a single die. SoCs helped reduce board space and improve performance, but they weren’t flexible enough for many applications. Enter System-in-Package (SiP)—a modular, scalable middle ground.
SiPs, like those from Octavo Systems, bundle multiple chips (e.g., processor, RAM, PMIC) into one compact, pre-tested unit—dramatically simplifying design and manufacturing.
What Makes SiP So Powerful?
SiP technology offers several key advantages:
While many companies explore SiP for niche applications, Octavo Systems focuses on practical, accessible solutions for real-world developers. Their SiPs are built around industry-proven processors—like the STM32MP1 or Texas Instruments AM335x—and include everything you need to run a full OS or real-time firmware.
Here’s what makes Octavo stand out:
They’re not just selling chips—they’re enabling design success.
Here’s why SiP is exploding in popularity across sectors:
These needs align perfectly with what SiP—and particularly Octavo’s SiP solutions—can offer.
Looking ahead, we’re going to see a massive shift toward highly integrated hardware platforms. SiP will play a key role in this transition, offering:
As more engineers adopt SiP, the companies that provide robust, well-supported solutions—like Octavo Systems—will shape the next wave of innovation in medical devices, robotics, consumer electronics, and beyond.
System-in-Package technology is no longer experimental—it’s essential. And Octavo Systems is showing the world how SiP can be both powerful and practical. If you want to stay ahead of the curve in embedded design, understanding and leveraging SiP is a must.
Want to build smaller, faster, and smarter? SiP might just be your secret weapon.
Let us show you the difference.
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OCTAVO is registered in the U.S. Patent and Trademark Office. OSD, C-SiP, and the Octavo Logo are trademarks of Octavo Systems LLC.
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