Revolutionizing Electronics: How Octavo Systems Simplifies Design with SiP Technology

In today’s fast-paced tech landscape, speed, efficiency, and innovation are more crucial than ever. Whether you’re building a wearable health monitor, an industrial sensor, or a smart home device, the complexity of modern electronics can be a major hurdle. That’s where Octavo Systems steps in—reshaping how engineers design and deliver embedded systems through powerful, compact System-in-Package (SiP) technology.

 

Who is Octavo Systems?

Founded in 2013 by a team of semiconductor veterans from Texas Instruments, Octavo Systems is a Texas-based company with a mission to simplify electronic design. They do this by creating SiPs that bundle key components—like processors, memory, power management, and passive components—into a single integrated package.

The result? Products that are smaller, easier to design, and faster to get to market.

What is SiP Technology?

System-in-Package (SiP) is a method of packaging multiple integrated circuits and passive components into one chip-scale module. It’s different from a traditional System-on-Chip (SoC), which integrates everything onto a single silicon die. Instead, a SiP combines multiple dies and supporting components in a single housing.

This gives designers the performance of complex systems with the simplicity of a single part number.

Why It Matters: The Benefits of SiP

Here’s why engineers and developers are excited about SiP technology—and specifically, Octavo’s approach:

  • Space Efficiency: SiPs drastically reduce board space. In compact devices like drones, wearables, and industrial sensors, this is a game changer.
  • Faster Time to Market: Designers spend less time sourcing, integrating, and troubleshooting multiple components.
  • Reduced Risk: Octavo pre-qualifies and validates the internal components, so developers can trust the performance.
  • Easier Manufacturing: A single, pre-tested unit means fewer solder joints and simpler assembly.

Real-World Applications of Octavo’s SiPs

Octavo’s technology has been used across a wide range of industries, including:

  • Medical Devices: Compact, reliable solutions for portable diagnostic equipment
  • Industrial Automation: Rugged performance in harsh environments
  • Consumer Electronics: Great for smart home hubs, wearables, and AR/VR headsets
  • IoT & Edge Devices: Seamless integration of compute and connectivity in small form factors

By making high-performance processing more accessible, Octavo helps engineers turn bold ideas into functioning products with fewer headaches.

Octavo in Action: OSD32MP1 as An Example

One of our flagship products is the OSD32MP1, based on STMicroelectronics STM32MP1 processor. It combines the processor, DDR memory, power management ICs, and essential passive components into a single package. Developers can drop this module onto a two-layer PCB and be up and running with Linux in no time—something that would otherwise require deep hardware expertise and months of effort.

The Future of Embedded Design is Smaller, Smarter, and Simpler

Octavo Systems is more than just a semiconductor company—it’s a catalyst for innovation. By removing complexity and lowering the barrier to entry, they’re empowering a new generation of engineers to build smarter, faster, and more efficiently.

If your next product depends on embedded processing, and time and space are of the essence, Octavo’s SiP solutions might just be your biggest shortcut to success.

Ready to Build Without Boundaries?

If you’re designing your next embedded product and want to save time, space, and resources, Octavo’s SiP technology can help you get there faster.
?Explore our SiP solutions at octavosystems.com and see how we’re transforming the way electronics are designed.

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