In today’s fast-paced tech landscape, speed, efficiency, and innovation are more crucial than ever. Whether you’re building a wearable health monitor, an industrial sensor, or a smart home device, the complexity of modern electronics can be a major hurdle. That’s where Octavo Systems steps in—reshaping how engineers design and deliver embedded systems through powerful, compact System-in-Package (SiP) technology.
Founded in 2013 by a team of semiconductor veterans from Texas Instruments, Octavo Systems is a Texas-based company with a mission to simplify electronic design. They do this by creating SiPs that bundle key components—like processors, memory, power management, and passive components—into a single integrated package.
The result? Products that are smaller, easier to design, and faster to get to market.
System-in-Package (SiP) is a method of packaging multiple integrated circuits and passive components into one chip-scale module. It’s different from a traditional System-on-Chip (SoC), which integrates everything onto a single silicon die. Instead, a SiP combines multiple dies and supporting components in a single housing.
This gives designers the performance of complex systems with the simplicity of a single part number.
Here’s why engineers and developers are excited about SiP technology—and specifically, Octavo’s approach:
Octavo’s technology has been used across a wide range of industries, including:
By making high-performance processing more accessible, Octavo helps engineers turn bold ideas into functioning products with fewer headaches.
One of our flagship products is the OSD32MP1, based on STMicroelectronics STM32MP1 processor. It combines the processor, DDR memory, power management ICs, and essential passive components into a single package. Developers can drop this module onto a two-layer PCB and be up and running with Linux in no time—something that would otherwise require deep hardware expertise and months of effort.
Octavo Systems is more than just a semiconductor company—it’s a catalyst for innovation. By removing complexity and lowering the barrier to entry, they’re empowering a new generation of engineers to build smarter, faster, and more efficiently.
If your next product depends on embedded processing, and time and space are of the essence, Octavo’s SiP solutions might just be your biggest shortcut to success.
If you’re designing your next embedded product and want to save time, space, and resources, Octavo’s SiP technology can help you get there faster.
?Explore our SiP solutions at octavosystems.com and see how we’re transforming the way electronics are designed.
Octavo Systems LLC all rights reserved
OCTAVO is registered in the U.S. Patent and Trademark Office. OSD, C-SiP, and the Octavo Logo are trademarks of Octavo Systems LLC.
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