STM32MP1 System In Package Wins Highly Commended Electronics Industry Award
Our latest System-in-Package device built around the new STMicroelectronics STM32MP1 microprocessor has won the Highly Commended Award for Embedded Solutions at the Electronics Industry Awards.
It is crazy to think that just 3 years ago we released our first SiP built around the popular AM335x microprocessor from Texas Instruments. We have since spread the word that System-in-Package is no longer a solution reserved for the large, well-funded companies, but that any designer can take advantage of System-in-Package Technology via solutions from Octavo Systems. Now with this recognition from the Electronics Industry Awards, it appears this message is gaining traction.
The Benefits of the Tighter Integration of the STM32MP1 System in Package Resonates with Every Developer
We are both proud and greatly humbled to be recognized by this award, nominated along side long time innovators like Xilinx and Cypress Semiconductor, as well as newer innovators helping to reinvent LED displays and voice recognition. We are revolutionizing the way not only Embedded Systems, but all electronics are designed and manufactured. System-in-Package allows reuse of common subsystems, giving designers the opportunity to spend more time on the differentiators of their product. It also allows tighter integration of components, leading to smaller, lower cost systems. The fact that were nominated for this award and chosen as a finalist by a public vote is even more meaningful. This election means these ideas and the resulting technology we have been creating for the last three years are resonating with the very developers we aim to help!
The OSD32MP15x, the STM32MP1 System-in-Package, is just the latest innovation in what will be a far-reaching eventual transformation of the industry. Integrating the Dual ARM-A7 & M4 processor from ST Micro, with DDR memory, Power Supplies, EEPROM, Oscillators, and Passives into a single BGA device allows developers to easily take advantage of this powerful new processor from ST without having to worry about all of the complexities that go along with integrating it. The OSD32MP15x SiP gives you all of the performance of a Microprocessor running Linux in the package of a Microcontroller. To top it all off, the OSD32MP15x is up to 60% smaller than the equivalent design built with discrete components. This product really does highlight the benefits of System-in-Package, which is why we are so excited that it has been recognized by this important community.
Thank you for electing OSD32MP15x, the STM32MP1 System in Package for This Award
Thank you to everyone who voted for the Octavo Systems STM32MP1 System in Package, the OSD32MP15x. It is an absolute honor and helps us feel like we are on the right track. We would like to thank the judges and the organizers, Datateam Business Media in association with CIE Magazine and supported by Electronics Magazine and ecsn also for this award. We would especially like to thank Roberto Blanco, VP of Sales at ISMOsys, who are the Octavo Systems representatives in Europe, for attending the event on June 21st in London and accepting this award.
Make sure you follow us on social media (@octavosystems) or sign up for our mailing list and newsletter to stay up to date with the latest in System-in-Package award-winning technology.