Wearable sensors are becoming more common, and the demand for these devices has only increased with the growth of the Internet-of-Things (IoT). These wearables range all the way from consumer items like Fitbits to medical devices for hospital patients. To keep up with this demand, designers need a flexible and powerful platform to develop their application quickly and reliably. The OSD335x-SM System-in-Package (SiP), a full Linux computer in the space of a US nickel (or 20 Euro cent piece), is just that platform. Its small form factor, high level of integration, and abundance of open source hardware and software tools make it ideal for developers working on new wearables. The OSD335x small size makes it ideal for space-constrained applications, even pedometer applications like the Fitbit. The rest of this post will show you how easy it is to quickly build your own pedometer prototype using the OSD335x with standard off the shelf components! (Detailed instructions can be found on Hackster.) (Read More…)
Austin, TX (December 17, 2019) – Octavo systems, the leader in System-in-Package (SiP) technology, announced today a Hardware Design Review Consulting Service for customers leveraging their SiP technology in their Design. (Read More…)
As the demands on embedded systems continue to grow, system designers have been forced to move from simple microcontroller-based system designs to more complicated microprocessor designs. This move took designs from a single device with a single power rail to multiple devices requiring sophisticated high-speed routing and complex power sequencing. In order to cope with this increasing complexity many designers have turned to using modules instead of designing discrete microprocessor systems. Modules remove the complexity of working with a microprocessor system. The module will typically include the processor, power management, and all the highspeed signals, removing the need for the designer to deal with these tasks. Using a module means the designer can continue to focus on the parts of the system that truly differentiate their product while getting it to market quicker. (Read More…)
Developed by an Industry Expert the open source reference design has everything you need to develop a building automation controller. This design features the OSD335x C-SiP which integrates an entire Embedded Linux system into a single IC, Relays, Analog Sensor inputs, RS-485, CAN and many other features required in industrial and building automation environments.
Figure 1 Let’s have better control and put AM335x based system in package into all these Air Conditioner units!
Some applications of IoT are still being debated. Does your refrigerator really need an operating system and be connected to the internet? Should it try to detect when you’re out of milk and automatically order more? What if there’s an error and 50 gallons shows up on your doorstep? Just like many others, I do not know the answers to all these questions. One thing I know for sure is that IoT does belong in air conditioning and the control systems of medium-to-large buildings. The OSD335x family of System-in-Package products featuring the AM335x, provides an excellent foundation for the design of an Open-Hardware Building Automation System Controller. This article introduces a series of technical application notes for building a reference design with the OSD335x-SM.
It is always worth our while to review the state of the art of integrated circuit technology. As one who has been in the middle of it for over 40 years, it is interesting to see how we have advanced the technology by driving the learning curve, exploiting the physics of silicon and creating new ways to design billions of transistors into functioning, reliable, affordable products. The products that have revolutionized the world we live in.
I believe we are only at the beginning of a transition from integration at the component level to integration at the system level. The new heterogeneous integration method known at System-in-Package (SiP) will be the technology of choice.
That is why Octavo’s products and strategy are based on this proven technology platform known as SiP. Although the technologies associated with SiP integration have been around for over a decade and are well established in the semiconductor industry, they have not been exploited for system integration. Our goal is to develop these existing technologies, along with new concepts, to deliver to you unprecedented integration and design flexibility.
SiP technology will help increase the performance of products while increasing their reliability.
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