This FREE two-day interactive virtual summit will bring together experts in markets that are poised for rapid growth in the coming years: Smart Things for the IoT, Smart Driving, and Smart Home, City & Industry. Click here to register for the conference
Octavo Systems is hosting an exhibition booth as well as providing an on-demand technical session.
Chat with our applications and account management engineers in both US and European time zones who will host open discussions as well as one to one chat throughout the full two days.
Leveraging a proven reference design to start your project is a great way to reduce risk and get to market faster. Pair that with the many advantages delivered by our System-in-Package devices and you have the fastest most reliable path to a production ready design. Here are a few of the most popular reference designs that can help you create your next project.
Octavo Systems recently celebrated our fifth year in business! It has been an amazing time for us as we have utilized the concepts surrounding system-in-package (SiP) technology. It is moments like these that make it fun to look back on what has happened and also look forward to the next five years.
Octavo had its inception when three former Texas Instruments employees (Bill Heye, Masood Murtuza and myself – Gene Frantz) began to discuss where the semiconductor industry was going and how we could participate in its movement. Octavo came to life in 2015 when we teamed up with Green Source Holding LLC and several engineer colleagues of ours. The name “Octavo” references the 15th century technology that made early printing available to the broader public by miniaturizing and reducing the cost of books. In that same vein, Octavo’s vision is to change the rules of electronics design and manufacturing so advanced technology is available to everyone by reducing the size and cost of integrated systems. (Read More…)
Wearable sensors are becoming more common, and the demand for these devices has only increased with the growth of the Internet-of-Things (IoT). These wearables range all the way from consumer items like Fitbits to medical devices for hospital patients. To keep up with this demand, designers need a flexible and powerful platform to develop their application quickly and reliably. The OSD335x-SM System-in-Package (SiP), a full Linux computer in the space of a US nickel (or 20 Euro cent piece), is just that platform. Its small form factor, high level of integration, and abundance of open source hardware and software tools make it ideal for developers working on new wearables. The OSD335x small size makes it ideal for space-constrained applications, even pedometer applications like the Fitbit. The rest of this post will show you how easy it is to quickly build your own pedometer prototype using the OSD335x with standard off the shelf components! (Detailed instructions can be found on Hackster.) (Read More…)
Austin, TX (December 17, 2019) – Octavo systems, the leader in System-in-Package (SiP) technology, announced today a Hardware Design Review Consulting Service for customers leveraging their SiP technology in their Design. (Read More…)
As the demands on embedded systems continue to grow, system designers have been forced to move from simple microcontroller-based system designs to more complicated microprocessor designs. This move took designs from a single device with a single power rail to multiple devices requiring sophisticated high-speed routing and complex power sequencing. In order to cope with this increasing complexity many designers have turned to using modules instead of designing discrete microprocessor systems. Modules remove the complexity of working with a microprocessor system. The module will typically include the processor, power management, and all the highspeed signals, removing the need for the designer to deal with these tasks. Using a module means the designer can continue to focus on the parts of the system that truly differentiate their product while getting it to market quicker. (Read More…)
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