Category: System-In-Package

New Case Study: How Olive Robotics Slashed Development Time by 83% Using Octavo’s SiP Technology

 

We’re excited to share a compelling new customer success story featuring Olive Robotics, an innovative startup that’s revolutionizing the robotics industry with their modular, AI-powered sensor solutions.

When Dr. Leox Karimi and his team set out to create standardized, interoperable robotic sensors that work right out of the box, they faced a significant challenge: how to pack high-performance processing, multiple sensors, and advanced AI capabilities into an ultra-compact form factor – all while racing to be first to market.

 

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Free Hands-On Training: Master Embedded Linux in Just 4 Hours

 

We’re thrilled to announce the release of our comprehensive hands-on training course, “Getting Started with Embedded Linux“! Whether you’re an embedded systems beginner or a seasoned developer looking to expand your skillset, this free training provides everything you need to start building real-world embedded Linux applications.

 

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Small Team, Big Innovation: How SiP Technology Enabled a Guitar Effects Revolution

 

What happens when you combine passionate musicians, innovative technology, and the right development tools? Sometimes, you get to witness the birth of something revolutionary.


Today we’re excited to share an inspiring customer success story that demonstrates how System-in-Package (SiP) technology is enabling the next generation of musical innovation. Our new case study follows the journey of Chaos Audio, a Florida-based startup that transformed from a student’s creative idea into a disruptive force in the guitar effects industry.

 

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Mastering Linux Device Trees in Embedded Systems

 

In the world of embedded systems, the Linux operating system has become a popular choice due to its flexibility, robustness, and open-source nature. One of the key components that enables Linux to work seamlessly with various hardware configurations is the device tree. Device trees provide a way to describe the hardware components of an embedded system, allowing the Linux kernel to dynamically configure itself to work with the specific hardware present on a given board.

 

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New White Paper: How System-in-Package Technology is Revolutionizing Product Development

 

Today’s electronics engineers face unprecedented challenges: shrinking development timelines, resource constraints, and increasingly complex design requirements. In our latest white paper, “The Best Things in Small SiPs: Accelerating Time to Market at Lower Costs,” we explore how System-in-Package (SiP) technology is helping companies overcome these challenges while reducing costs and accelerating innovation.

 

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Securing the Future: The Integral Role of SiP Technology in Thwarting Physical Attack Vectors in Embedded Systems

 

The security of embedded systems stands as a crucial yet often overlooked aspect. As technology propels forward, these systems become increasingly central to our everyday lives, powering everything from smartphones to critical infrastructure.

However, with this technological integration comes a heightened vulnerability to physical attack vectors. The need to protect these systems from such threats has never been more pressing. As designers and engineers, understanding and mitigating these risks is not just a challenge but a requirement.

This article aims to shine a light on the various physical attack vectors threatening embedded systems and explore how advancements in System-in-Package (SiP) technology are revolutionizing our approach to securing these vital components of the modern technological landscape.

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Developing Secure Embedded Systems: Best Practices and Strategies

 

In the rapidly evolving landscape of technology, embedded systems have become the backbone of modern electronic devices, ranging from simple household appliances to complex industrial machines. As these devices become more interconnected, the importance of security in embedded systems cannot be overstated. For professionals involved in electronic product design, ensuring the security of these systems is paramount.

 

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AI at the Edge Relies on the Right Hardware

Artificial intelligence (AI) once seemed like a figment of science fiction, but as technology has evolved, many new and exciting applications have arisen. From national security to finance, healthcare, and beyond, AI has the capacity to improve the quality and quantity of data analytics and reduce costs. As the ubiquity of AI technology continues to grow, we see it moving closer to the edge, requiring specialized hardware to ensure that AI-enabled devices can operate and process data efficiently.

What is AI at the Edge?

AI at the edge relies on edge computing – a distributed network of computing devices that exist near the source of data, rather than in a data center. This includes Internet of Things (IoT) devices that could be sensors and smart devices that reside within a home, business, or other location. Because the Internet is a global network, the edge could exist anywhere.

Compared to AI algorithms that run inside of a data center, edge AI can offer a number of important benefits that include:

  • Reduced latency since data is processed locally.
  • Increased data security since data is processed at the edge and only results are transmitted , reducing the risk of a breach or interception.
  • Improved reliability since the AI can run even if connection to a data center goes down.
  • Real-time insights since data is processed locally instead of in a distant data center.

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The Time Value of Design

As processor based products become more pervasive in the industry, it seems that the time required to get a new product to market is lengthening. A major time period of getting the product to market is during the product development stage. Over my career I have seen the product development process taking from 12 months to 2 or more years. Our direction at Octavo has been to help you reduce your development time to production ramp by using system in package (SiP) technology. (Read More…)

SiP Technology: A solution to a passive problem

 

It is always interesting when a new integration concept like System in Package (SiP) technology gives opportunity to innovate beyond the obvious. One of those opportunities which has no effect on system designers or component designers but is unique to a SiP designer is the handling of the bulk and bypass capacitors.

But before we get to the topic of capacitor reduction, let me take a moment to remind all of us of some of those new integration concepts:

  • Point to Point wiring (PtP): this concept is still being used in guitar amplifiers. Figure 1 will remind you of the concept.
  • Printed Circuit boards (PCB). Once components could be attached to a PCB, PtP began to take a back seat. Note Figure 1 also has a PCB included.
  • Integrated circuits with the ultimate being a System on Chip (SoC)
  • System in Package (SiP)

An example of point to point wiring courtesy of Wikipedia.
Figure 1. An example of point to point wiring courtesy of Wikipedia.

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