In the world of embedded systems, the Linux operating system has become a popular choice due to its flexibility, robustness, and open-source nature. One of the key components that enables Linux to work seamlessly with various hardware configurations is the device tree. Device trees provide a way to describe the hardware components of an embedded system, allowing the Linux kernel to dynamically configure itself to work with the specific hardware present on a given board.
The security of embedded systems stands as a crucial yet often overlooked aspect. As technology propels forward, these systems become increasingly central to our everyday lives, powering everything from smartphones to critical infrastructure.
However, with this technological integration comes a heightened vulnerability to physical attack vectors. The need to protect these systems from such threats has never been more pressing. As designers and engineers, understanding and mitigating these risks is not just a challenge but a requirement.
This article aims to shine a light on the various physical attack vectors threatening embedded systems and explore how advancements in System-in-Package (SiP) technology are revolutionizing our approach to securing these vital components of the modern technological landscape.
In the rapidly evolving landscape of technology, embedded systems have become the backbone of modern electronic devices, ranging from simple household appliances to complex industrial machines. As these devices become more interconnected, the importance of security in embedded systems cannot be overstated. For professionals involved in electronic product design, ensuring the security of these systems is paramount.
Artificial intelligence (AI) once seemed like a figment of science fiction, but as technology has evolved, many new and exciting applications have arisen. From national security to finance, healthcare, and beyond, AI has the capacity to improve the quality and quantity of data analytics and reduce costs. As the ubiquity of AI technology continues to grow, we see it moving closer to the edge, requiring specialized hardware to ensure that AI-enabled devices can operate and process data efficiently.
What is AI at the Edge?
AI at the edge relies on edge computing – a distributed network of computing devices that exist near the source of data, rather than in a data center. This includes Internet of Things (IoT) devices that could be sensors and smart devices that reside within a home, business, or other location. Because the Internet is a global network, the edge could exist anywhere.
Compared to AI algorithms that run inside of a data center, edge AI can offer a number of important benefits that include:
Reduced latency since data is processed locally.
Increased data security since data is processed at the edge and only results are transmitted , reducing the risk of a breach or interception.
Improved reliability since the AI can run even if connection to a data center goes down.
Real-time insights since data is processed locally instead of in a distant data center.
As processor based products become more pervasive in the industry, it seems that the time required to get a new product to market is lengthening. A major time period of getting the product to market is during the product development stage. Over my career I have seen the product development process taking from 12 months to 2 or more years. Our direction at Octavo has been to help you reduce your development time to production ramp by using system in package (SiP) technology. (Read More…)
It is always interesting when a new integration concept like System in Package (SiP) technology gives opportunity to innovate beyond the obvious. One of those opportunities which has no effect on system designers or component designers but is unique to a SiP designer is the handling of the bulk and bypass capacitors.
But before we get to the topic of capacitor reduction, let me take a moment to remind all of us of some of those new integration concepts:
Point to Point wiring (PtP): this concept is still being used in guitar amplifiers. Figure 1 will remind you of the concept.
Printed Circuit boards (PCB). Once components could be attached to a PCB, PtP began to take a back seat. Note Figure 1 also has a PCB included.
Integrated circuits with the ultimate being a System on Chip (SoC)
Today is an exciting day at Octavo Systems. It is the culmination of months of hard work and at the same time the beginning of even more! Starting today you can place orders for OSD32MP1 Engineering Samples through all of our distribution partners! Also, we have released our first reference design using the OSD32MP1 SiP so you can get started on your own! (Read More…)
Surprisingly the hardest part of creating a new product is taking a working prototype and ramping into production. It is more complex than the architecture of the system, the hardware and software design, creating a working prototype, or taking the system through certification/qualification. The reason is simple; production requires discipline, logistics, and manufacturing at large volumes, where simple mistakes can be very expensive.
Smoothly ramping a new product into production is always the goal but seldom the reality. While it may be convenient to start thinking about production once the prototype is working, this will lead to many headaches. Successfully ramping into production starts its journey very early in the process. That means it requires paying attention to the details all the way through the process, starting with the system architecture. One thing we have learned by taking many products into production:
“Just because you can build 1 doesn’t mean you can build 10. Just because you can build 10 doesn’t mean you can build 100. And this continues with each order of magnitude.”
This paper discusses some of the insights an aids that we at Octavo have learned over the years to help you minimize the issues as you design and ramp your product into production.
The Heating, Ventilation and Air Conditioning (HVAC) market is expected to reach over $130B in the next five years. Driven by the rise in construction globally, plus refurbishment of homes and businesses, the demand to put in new units is increasing rapidly. Smarter equipment with more sensors, higher efficiency, reliability and ease of maintenance are priorities for new designs. As with most rapidly growing electronics markets, the need for fast turnaround of embedded systems designs while maintaining cost controls and increasing features is critical to a strong go to market strategy. Increasingly these systems also need be configured and controlled based on information being received in real time. In order to keep up with the rapid rate at which technology is transforming the HVAC industry, design engineers need a flexible platform on which they can spend time developing the features that make their application unique and efficient, and not have to channel valuable resources into tedious complexities such as power management and DDR routing. They also need reliable, open source hardware and software design tools. The OSD335x-SM System in Package based on the TI AM335x, is the perfect solution as it provides engineers the solid foundation that they need. With the availability of low cost development tools, such as PocketBeagle® from BeagleBoard.org®, rapid prototyping HVAC features is easy. (Read More…)
Whether you use OrCAD, Eagle or Altium, we’ve just released a library containing our OSD32MP1 , the STM32MP1 System in Package device. Download all of the OSD32MP1 SiP, STM32MP1 Schematic Symbol and STM32MP1 Footprint files in one place.
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