Octavo Systems Announces Texas Instruments AM62x-Based System-in-Package
Nuremberg, Germany (March 14, 2023) – Expanding on its history of delivering highly integrated System-in-Package (SiP) devices, Octavo Systems announced its OSD62x family of SiPs that help expand the performance of edge and small form factor embedded processing into next generation applications. The OSD62x family is based on the Texas Instruments (TI) AM623 and AM625 processors. The OSD62x enables small-size human-machine interface (HMI) applications for building automation, industrial control, IoT gateways, artificial intelligence (AI) at the edge, as well as many other low-power systems demanding high performance Linux processing. Delivering the smallest AM62x module form factor, the OSD62x SiP family integrates high-speed memory, power management, passive components, and much more into a single BGA package.
“The OSD62x is a powerful example of our commitment to deliver ‘Innovation through Integration.’ We are excited to offer our customers a TI AM62x-based solution that reduces solution sizes by 60% and enables designs to get to market up to 9 months faster,” said Harley Walsh, President at Octavo Systems. (Read More…)