The Embedded World Conference in Nuremberg, Germany last week provided an opportunity for the Octavo Systems team to engage with dynamic and innovative companies from around the globe. In its 16th year, this leading exhibition for the international embedded community hosted over 32,000 engineers from 78 countries. With more than 2,000 sessions, the technical engagement level was at an all time high.
When we introduce new customers to our System-In-Package (SiP) solutions they often ask how a SiP is different from a System-On-Module (SoM). Fact is, in functionality, they are very similar. The two solutions address similar design challenges and provide similar value, however, they do this in very different ways. (Read More…)
Industry analysts predict billions of things will connect to the Internet by 20201. Whether it is your fitness tracker or a smart fridge, we are now able track, analyze and make healthier choices to improve our lives. We are able to make our homes more secure and energy efficient. Soon we will watch Netflix in self-driving vehicles on our way to work. Due to the potential and the ability to personalize information, the industry has pursued connecting all devices to the Internet with passion. Therefore, it is a given that your marketing department will come in asking you to update your product with IoT capabilities.
Octavo Systems is leading the hardware effort to make IoT system development more accessible to everyone. Through System-in-Package (SiP) technology, it is possible to embed complex and powerful systems into tiny spaces while saving valuable time to market and cost.
Applications requiring machine vision and the ability to make decisions without human interference are becoming more widespread. The OSD335x System-in-Package is a perfect starting point for these types of applications. Its Texas Instruments ARM Cortex-A8 processor has the power and the peripherals required for them. The below block diagram illustrates how the OSD335x would fit into a generalized industrial control system.
Last week we headed out to San Jose to attend the Embedded Systems Conference (ESC) Silicon Valley. We met a lot of innovative startups and had very productive conversations, as well as engaged with more familiar industry names that were all looking to take advantage of System-In-Package technology. Hopefully, if you were in the area, you were able to stop by and talk to the team. If you weren’t, here’s a few highlights from the show, as well as some exciting things to come.
Austin, Texas (September 19, 2017) – Octavo Systems LLC (Octavo) announced the production release and immediate availability of its highly anticipated OSD335x-SM System-In-Package (SiP) device. The OSD335x-SM, like the entire OSD335x family, integrates the Texas Instruments (TI) Sitara™ AM335x processor with an ARM® Cortex®-A8 core running at 1GHz, DDR3 memory, a TPS65217C power management IC (PMIC), a TL5209 low-dropout (LDO) regulator, and passive components into a single wide pitch (1.27mm) BGA package. The OSD335x-SM enhances this integration by adding EEPROM as well and reducing the package size by 40%. (Read More…)
Today’s embedded designers face more challenges in terms of design complexity, cycle time and target size. System-In-Package (SiP) devices, such as the OSD335x Family, bring many advantages when designing and building an embedded system.
One significant advantage of using a SiP device is the amount of printed circuit board (PCB) space that can be saved versus using hundreds of discrete components. To understand this advantage, let us examine the amount of space required by the OSD335x devices and the discrete components that make up an equivalent system. (Read More…)
We are excited to announce that the industrial temperature rated (-40°C to 85°C Case) version of the OSD335x System-In-Package is now available! It can be ordered for immediate delivery through our distribution partners, Mouser and Digi-Key. (Read More…)
One of the key benefits delivered by System-In-Package (SiP) technology is the savings realized in the Printed Circuit Board (PCB) Assembly process. This is a benefit that is commonly overlooked by designers on the front end. Typically, they only look at the cost of the individual components on the Bill of Material (BOM) and don’t consider the cost of assembly. With System-In-Package technology, the number of components that need be placed during the assembly process can be significantly reduced. This reduction decreases the component set up time and actual time spent on the Pick and Place machine. Simultaneously driving down the assembly cost and the total cost of the finished product. (Read More…)
This article was guest written by Michael Welling, the developer of the KiCad PocketBone Design. Michael is an Embedded Design Engineer with over 10 years of experience. He owns an electronic design consulting firm, QWERTY Embedded Design, LLC. He has an MS in Electrical Engineering, was an instructor at SIUC and a 12-year member of IEEE. He is also a mentor for Beagleboard.org Google Summer of Code.
In the previous blog, the origin story and design process of the PocketBone were discussed. This edition talks about the process of gathering components and assembling the units at home by hand.
