As we continue to expand our product offerings and our global footprint, the demands of our customers continue evolve. In order to help us continue to meet and exceed the needs of our evolving customer base, I am proud to announce that we have added Arrow Electronics as a worldwide authorized distributor. Arrow is the world’s largest electronics distributor, with over 20,000 Employees servicing over 200,000 customers around the globe. Arrow brings a global team of highly skilled technical Field Application Engineers (FAEs) to complement our existing stellar sales and support teams. By working to directly support customers and hosting seminars and training, Arrow will enable us to greatly expand our reach, bringing the benefits of System-in-Package to an even larger customer base.
Starting today you will be able to contact your local Arrow representative and ask about Octavo solutions. Arrow will be carrying all of Octavo’s products from the Texas Instruments AM335x based OSD335x family to our newest family the OSD32MP1 based on the new STM32MP1 microprocessor from STMicroelectronics.
“We are excited to have Arrow be a distribution partner of Octavo,” said Harley Walsh, Octavo’s President. “They are a leader in the industry, and they see Octavo and our System-in-Package technology as key to the future of the electronics industry. We can’t wait to see what we can accomplish together.” (Read More…)
Once again we are among an impressive list of finalists for an important industry award. This time it is for one of the Elektra Awards (electraawards.co.uk). Thank you to our customers and the esteemed list of judges for recognizing the uniqueness of our System in Package and promoting us to finalist for the “Internet-of-Things Product Innovation Award”. We are honored to be among 14 companies, all with very impressive entries, most of whom are over 100 times our size. (For details of not only the award for which we are a finalist but all of the categories go to https://www.elektraawards.co.uk/elektraawards2019/en/page/2019-products-shortlist )
It is crazy to think that just 3 years ago we released our first SiP built around the popular AM335x microprocessor from Texas Instruments. We have since spread the word that System-in-Package is no longer a solution reserved for the large, well-funded companies, but that any designer can take advantage of System-in-Package Technology via solutions from Octavo Systems. Now with this recognition from the Electronics Industry Awards, it appears this message is gaining traction.
Sometimes 512MB of DDR memory just isn’t enough. No matter how hard you try your application just needs more space. Maybe you are trying to process large datasets gathered from thousands of sensors around a building. Perhaps you developed a platform that is capable of running many completely different applications at the same time, or you have some awesome graphics you are trying to render. Whatever your software dilemma or creative idea for your embedded product may be, you just want to have more memory coupled with your computing system. Octavo Systems has heard your requests. We are happy to announce the general availability of a 1GB DDR memory option for the OSD335x-SM family of devices.
We are excited to announce the most completely integrated 1GHz Arm® Cortex®- A8 computing platform, the OSD335x C-SiP™. This COMPLETE System-in-Package provides everything you need to design a powerful Linux computer in half the time, while using half the space. (Read More…)
Austin, TX (September 27, 2018) – Octavo Systems, the leader in System-in-Package (SiP) technology, announced today, the most completely integrated 1GHz Arm® Cortex®-A8 computing platform, the OSD335x C-SiP™. The OSD335x C-SiP (Complete System-In-Package) integrates the required components for a computing system into a single IC package that is about the size of a standard Lego block. The newest addition to the OSD335x family, the OSD335x C-SiP is a complete system containing:
It is always worth our while to review the state of the art of integrated circuit technology. As one who has been in the middle of it for over 40 years, it is interesting to see how we have advanced the technology by driving the learning curve, exploiting the physics of silicon and creating new ways to design billions of transistors into functioning, reliable, affordable products. The products that have revolutionized the world we live in.
I believe we are only at the beginning of a transition from integration at the component level to integration at the system level. The new heterogeneous integration method known at System-in-Package (SiP) will be the technology of choice.
That is why Octavo’s products and strategy are based on this proven technology platform known as SiP. Although the technologies associated with SiP integration have been around for over a decade and are well established in the semiconductor industry, they have not been exploited for system integration. Our goal is to develop these existing technologies, along with new concepts, to deliver to you unprecedented integration and design flexibility.
SiP technology will help increase the performance of products while increasing their reliability.
At Octavo Systems, we are always looking for ways to help designers be more productive, be it with application notes, tutorials, reference designs, or design collateral. The goal of our System-in-Package technology is to create modular building blocks that abstract away tedious, repetitive, and complex tasks that designers are forced to spend time on, but don’t really add value to the end system so that they can create better, more innovate products.
Today we took another step in making designing with Octavo Systems devices easier by adding an Altium symbol library for the OSD335x-SM for you to download from our website. Scroll down to the link to download.
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